INTEGRATED CIRCUITS DATA SHEET TDA4555 TDA4556 Multistandard decoder Product specification File under Integrated Circuits, IC02 November 1984 Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder • Two quadrature demodulators with external reference tuned circuits (SECAM) GENERAL DESCRIPTION The TDA4555 and TDA4556 are monolithic integrated multistandard colour decoders for the PAL, SECAM, NTSC 3,58 MHz and NTSC 4,43 MHz standards. The difference between the TDA4555 and TDA4556 is the polarity of the colour difference output signals (B-Y) and (R-Y). • Internal filtering of residual carrier • De-emphasis (SECAM) • Insertion of reference voltages as achromatic value (SECAM) in the (B-Y) and (R-Y) colour difference output stages (blanking) Features Chrominance part Identification part • Gain controlled chrominance amplifier for PAL, SECAM and NTSC • Delay for colour-on and scanning-on • Automatic standard recognition by sequential inquiry • Reliable SECAM identification by PAL priority circuit • ACC rectifier circuits (PAL/NTSC, SECAM) • Forced switch-on of a standard • Burst blanking (PAL) in front of 64 µs glass delay line • Four switching voltages for chrominance filters, traps and crystals • Chrominance output stage for driving the 64 µs glass delay line (PAL, SECAM) • Two identification circuits for PAL/SECAM (H/2) and NTSC • Limiter stages for direct and delayed SECAM signal • SECAM permutator • PAL/SECAM flip-flop • SECAM identification mode switch (horizontal, vertical or combined horizontal and vertical) Demodulator part • Flyback blanking incorporated in the two synchronous demodulators (PAL, NTSC) • Crystal oscillator with divider stages and PLL circuitry (PAL, NTSC) for double colour subcarrier frequency • PAL switch • HUE control (NTSC) • Internal PAL matrix • Service switch QUICK REFERENCE DATA Supply voltage (pin 13) VP = V13-9 typ. 12 V Supply current (pin 13) IP = I13 typ. 65 mA Chrominance input signal (peak-to-peak) V15-9(p-p) 20 to 200 Chrominance output signal (peak-to-peak) V12-9(p-p) typ. 1,6 V TDA4555: −(R-Y); TDA4556: + (R-Y) V1-9(p-p) typ. 1,05 V ± 2 dB TDA4555: −(B-Y); TDA4556: + (B-Y) V3-9(p-p) typ. 1,33 V ± 2 dB vertical and horizontal pulse separation V24-9 typ. 2,5 V horizontal pulse separation V24-9 typ. 4,5 V burst gating V24-9 typ. 7,7 V mV Colour difference output signals (peak-to-peak values) Sandcastle pulse; required amplitude for PACKAGE OUTLINE 28-lead DIL; plastic (SOT117); SOT 117-1; 1996 November 27. November 1984 2 (1) TDA4555: -(R-Y); TDA4556: + (R-Y) (2) TDA4555: -(B-Y); TDA4556: + (B-Y) Fig.1 Block diagram. Philips Semiconductors November 1984 Product specification Multistandard decoder TDA4555 TDA4556 3 Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 13) VP = V13-9 max. 13,2 V Voltage range at pins 10, 11, 17, 23, 24, 25, 26, 27, Vn-9 0 to VP Current at pin 12 I12 max. 8 mA Peak value I12M max. 15 mA Total power dissipation Ptot max. 1,4 W Storage temperature range Tstg −25 to + 150 °C Operating ambient temperature range Tamb 0 to + 70 °C 28 to pin 9 (ground) November 1984 4 V Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder CHARACTERISTICS VP = V13-9 = 12 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply (pin 13) Supply voltage range VP = V13-9 10,8 − 13,2 V Supply current IP = I13 − 65 − mA input voltage with 75% colour bar signal (peak-to-peak value) V15-9(p-p) 20 100 200 mV input impedance Z15-9 2,3 3,3 − kΩ output voltage (peak-to-peak value) V12-9(p-p) − 1,6 − V output impedance (n-p-n emitter follower) Z12-9 − − 20 Ω d.c. output voltage V12-9 − 8,2 − V d.c. input current I10 − − 10 µA input resistance R10-9 10 − − kΩ − (R-Y) signal (pin 1) V1-9(p-p) − 1,05 V ± 2 dB − V − (B-Y) signal (pin 3) V3-9(p-p) − 1,33 V ± 2 dB − V + (R-Y) signal (pin 1) V1-9(p-p) − 1,05 V ± 2 dB − V + (B-Y) signal (pin 3) V3-9(p-p) − 1,33 V ± 2 dB − V V1/3-9 − 0,79 V1,3-9(p-p) − − 30 mV V1,3-9(p-p) − 10 − mV V1-9(p-p) − − 10 mV Chrominance part Chrominance input signal (pin 15) Chrominance output signal (pin 12) Input for delayed signal (pin 10) Demodulator part (PAL/NTSC) Colour difference output signals output voltage (proportional to V13-9) (peak-to-peak value) TDA4555 TDA4556 Ratio of colour difference output signals (R-Y)/(B-Y) ± 10% − Residual carrier (subcarrier frequency) (peak-to-peak value) Residual carrier (PAL only) (peak-to-peak value) H/2 ripple at (R-Y) output (pin 1) (peak-to-peak value) without input signal D.C. output voltage n-p-n emitter follower with internal current source of 0,3 mA V1,3-9 Z1, 3-9 output impedance November 1984 5 − 7,7 − V − − 150 Ω Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder PARAMETER SYMBOL MIN. TYP. MAX. UNIT Demodulator part (SECAM) Colour difference signals (see note 4) output voltage (proportional to V13-9) (peak-to-peak value) TDA4555 −(R-Y) signal (pin 1) V1-9(p-p) − 1,05 − V − (B-Y) signal (pin 3) V3-9(p-p) − 1,33 − V + (R-Y) signal (pin 1) V1-9(p-p) − 1,05 − V + (B-Y) signal (pin 3) V3-9(p-p) − 1,33 − V V1/3-9 − 0,79(1)± 10% − V1,3-9(p-p) − 20 30 mV V1,3-9(p-p) − 20 30 mV V1,3-9(p-p) − − 20 mV V1,3-9 − 7,7 − V ∆V/∆T(R-Y) − −0,55 − mV/K ∆V/∆T(B-Y) − + 0,25 − mV/K TDA4556 Ratio of colour difference output signals (R-Y)/(B-Y) Residual carrier (4 to 5 MHz) (peak-to-peak value) Residual carrier (8 to 10 MHz) (peak-to-peak value) H/2 ripple at (R-Y) (B-Y) outputs (pins 1 and 3) (peak-to-peak value) with fo signals D.C. output voltage Shift of inserted levels relative to levels of demodulated fo frequencies (IC only) HUE control (NTSC)/service switch Phase shift of reference carrier at V17-9 = 2 V −φ − 30 (note 2) − deg at V17-9 = 3 V φ − 0 − deg at V17-9 = 4 V +φ − 30 (note 2) − deg R17-9 − 5 − kΩ burst OFF; colour ON (for oscillator adjustment) V17-9 − − 0,5 V HUE control OFF; colour ON (for forced colour ON) V17-9 6 − − V input resistance R19-9 − 350 − Ω lock-in-range referred to subcarrier frequency ∆f ±400 − − Hz Input resistance Service position Switching voltage (pin 17) Crystal oscillator (pin 19) For double colour subcarrier frequency November 1984 6 Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder PARAMETER SYMBOL MIN. TYP. MAX. UNIT Identification part Switching voltages for chrominance filters and crystals at pin 28 (PAL) at pin 27 (SECAM) at pin 26 (NTSC 3,58 MHz) at pin 25 (NTSC 4,43 MHz) V25,26,27,28-9 − − 0,5 V during scanning; colour OFF V25,26,27,28-9 − 2,45 − V colour ON V25,26,27,28-9 − 5,8 − V Output current −I25,26,27,28-9 − − 3 mA PAL V28-9 9 − − V SECAM V27-9 9 − − V NTSC 3,58 MHz V26-9 9 − − V NTSC 4,43 MHz V25-9 9 − − V Control voltage OFF state Control voltage ON state Voltage for forced switching ON Delay time for restart of scanning tdS 2 to 3 vertical periods colour ON tdC1 2 to 3 vertical periods colour OFF tdC2 0 to 1 vertical periods SECAM identification (pin 23) Input voltage for V23-9 − − 2 V vertical identification (V) V23-9 10 − − V combined (H) and (V) identification V23-9 − 6 (note 3) − V horizontal identification (H) Sequence of standard inquiry PAL-SECAM-NTSC 3,58 MHz-NTSC 4,43 MHz Reliable SECAM identification by PAL priority circuit Scanning time for each standard November 1984 tS 7 4 vertical periods Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder PARAMETER SYMBOL MIN. TYP. MAX. UNIT Sandcastle pulse detector (see note 5) Input voltage pulse levels (pin 24) to separate vertical and horizontal blanking pulses V24-9 1,2 − 2,0 V required pulse amplitude V24-9(p-p) 2,0 − 3,0 V to separate horizontal blanking pulse V24-9 3,2 − 4,0 V required pulse amplitude V24-9(p-p) 4,0 − 5,0 V to separate burst gating pulse V24-9 6,5 − 7,7 V required pulse amplitude V24-9(p-p) 7,7 − VP V Input voltage during horizontal scanning V24-9 − − 1,0 V Input current −I24 − − 100 µA Notes 1. Value measured without influence of external circuitry. 2. Relative to phase at V17-9 = 3 V. 3. Or not connected. 4. The signal amplitude of the colour difference signals (R-Y) and (B-Y) is dependent on the characteristics of the external tuned circuits at pins 7, 8 and 4, 5 respectively. Adjustment of the amplitude is achieved by varying the Q-factor of these tuned circuits. The resonant frequency must be adjusted such that the demodulated output frequency (fo) provides the same output level as the internally inserted reference voltage (achromatic value). 5. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage. November 1984 8 Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder Service switch (a) colour ON; hue OFF (c) colour ON; burst OFF Fig.2 Application diagram. APPLICATION INFORMATION November 1984 9 Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder PACKAGE OUTLINE seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH November 1984 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 10 Philips Semiconductors Product specification TDA4555 TDA4556 Multistandard decoder SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. November 1984 11