QTP 144202:Automotive 28L SSOP (209 Mils) NiPdAuAg (Roughened) Leadfinish, Au Wire, MSL3, 260C Reflow, CML-RA.pdf

Document No. 002-10570 Rev. **
ECN #: 5066008
Cypress Semiconductor Automotive
Package Qualification Report
QTP# 144202 VERSION **
January 2016
28L SSOP (209 mils)
NiPdAuAg (Roughened) Leadfinish, Au Wire
MSL3, 260C Reflow
CML-RA
FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] :
OR VIA LINK A CYLINK CRM CASE
Prepared By:
Josephine Pineda (JYF)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Engineer MTS
Approved By:
Don Darling (DCDA)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 9
Document No. 002-10570 Rev. **
ECN #: 5066008
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
144202
Qualification of 28L SSOP package with downbond in CML-Autoline using 0.8mil Au wire
with KE-G3000 mold compound, QMI-509 die attach material, Cu leadframe and
NiPdAuAg (roughened) leadfinish
Dec.2015
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 9
Document No. 002-10570 Rev. **
ECN #: 5066008
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
SP282
Package Outline, Type, or Name:
28L- SSOP Package (209mils)
Mold Compound Name/Manufacturer:
KEG3000 / Kyocera
Mold Compound Flammability Rating:
V-O per UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index:
70%
Lead Frame Designation:
Pre-plated with slot design
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAuAg (roughened)
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Wafer saw
Die Attach Supplier:
Henkel
Die Attach Material:
QMI 509
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-93568
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au / 0.8mil
Thermal Resistance Theta JA °C/W:
61.10 C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
001-93568
Name/Location of Assembly (prime) facility:
CML-RA
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 9
Document No. 002-10570 Rev. **
ECN #: 5066008
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
J-STD-020
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Constructional Analysis
Criteria: Meet external and internal characteristics of Cypress
package
P
Dye Penetrant Test
Criteria: No Package Crack
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
AEC-Q100-002
500V/1000V/1500V/2000V/4000V/6000V
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
AEC-Q100-011
250V/500V/ 750V (corner pins)
P
Electrical Distribution
AEC-Q100-009
P
Final Visual
JESD22-B101B
P
High Accelerated Saturation Test
(HAST)
JESD22-A110, 130C, 5.5V, 85%RH
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
P
High Temperature Operating Life
Early Failure Rate
P
High Temperature Operating Life
Latent Failure Rate
(192 Hrs., 30C, 60% RH, 260C Reflow)
AEC-Q100-008 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.34V
JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.34V
High Temperature Storage Life
JESD22-A103, 150 C
P
Physical Dimensions
JESD22B100 and B108
P
Pressure Cooker
JESD22-A102, 121C, 100%RH, 15 Psig
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Acoustic Microscopy
P
Post Temperature Cycle
Wire Bond Pull
Mil-Std 883, Method 2011
Solderability
JESD22-B102
Static Latch-up
AEC-Q100-004, 85C, 140mA
Temperature Cycle
JESD22-A104, -65C to 150C
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
P
Wire Ball Shear
AEC-Q100-001
P
Wire Bond Pull
Mil-Std 883, Method 2011
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 9
P
P
P
Document No. 002-10570 Rev. **
ECN #: 5066008
Reliability Test Data
QTP #:
Device
144202
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
22
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
22
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
22
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
30
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
COMP
30
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
30
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
COMP
30
0
4407790
611507486
CML-RA
COMP
5
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
15
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
15
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
15
0
Failure Mechanism
STRESS: ACOUSTICS
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C4245PVA (8A44200BC)
STRESS: DYE PENETRANT
STRESS: ELECTRICAL DISTRIBUTION
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
30
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 9
Document No. 002-10570 Rev. **
ECN #: 5066008
Reliability Test Data
QTP #:
Device
Fab Lot #
Assy Lot #
Assy Loc
144202
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.34V, Vcc Max
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
48
412
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
48
2527
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
48
969
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
48
2735
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
48
860
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
48
2686
0
STRESS: ESD-CHARGE DEVICE MODEL
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
250
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
750
3
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
1000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
2000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
4000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
6000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
1400
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
2800
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
1400
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
COMP
2800
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
1400
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
COMP
2800
0
STRESS: FINAL VISUAL
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
96
77
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
96
76
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
96
77
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 9
Document No. 002-10570 Rev. **
ECN #: 5066008
Reliability Test Data
QTP #:
Device
Fab Lot #
Assy Lot #
Assy Loc
611423519
CML-RA
144202
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMPERATURE STORAGE
CY8C4245PVA (8A44200BC)
4407790
1000
80
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
408
75
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
408
75
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
408
73
0
STRESS: PHYSICAL DIMENSION
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
20
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
20
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
20
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
COMP
20
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
20
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
COMP
20
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
96
78
0
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
168
78
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
96
78
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
168
78
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
96
78
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
168
78
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
96
80
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
168
80
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
96
80
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
168
80
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
96
80
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
168
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 9
Document No. 002-10570 Rev. **
ECN #: 5066008
Reliability Test Data
QTP #:
Device
Fab Lot #
Assy Lot #
Assy Loc
144202
Duration
Samp
Rej
Failure Mechanism
STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
500
5
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
5
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
500
5
0
STRESS: PRE /POST LFR CRITICAL PARAMETER
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30+2
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
30+2
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
30+2
0
STRESS: STATIC LATCH-UP TESTING, (+/-140mA 85C)
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
6
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
15
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
15
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
15
0
STRESS: SOLDERABILITY
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
1000
80
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
1000
85
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
1000
85
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
1000
80
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
500
85
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
1000
80
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
500
85
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
1000
85
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 9
Document No. 002-10570 Rev. **
ECN #: 5066008
Document History Page
Document Title:
Document Number:
QTP#144202: Automotive 28L SSOP (209 Mils) NiPdAuAg (Roughened) Leadfinish, Au Wire,
MSL3, 260C Reflow, CML-RA
002-10570
Rev. ECN
Orig. of
No.
Change
**
5066008 JYF
Description of Change
Initial spec release
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 9
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