Document No.001-63175 Rev. *C ECN # 4475040 Cypress Semiconductor Package Qualification Report QTP# 101601 VERSION *C August 2014 30-Ball Wafer Level Chip Scale Package (WLCSP) (2.204 x 2.32mm) MSL1, 260C Amkor-Taiwan (AU) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 10 Document No.001-63175 Rev. *C ECN # 4475040 PACKAGE QUALIFICATION HISTORY QUAL REPORT 081902 101601 DESCRIPTION OF QUALIFICATION PURPOSE Qualify 8C20002CC Quark 30-ball WLCSP (Wafer Level Chip Scale Package) Package Technology in Amkor Taiwan (T5/T3) Qualify Amkor Taiwan T5 (AU) for KRYPTON (8F20746A) using WLCSP30 (2.204 x 2.32mm) fabricated at CMI using the S4AD-BUMP process Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 10 DATE COMP. Jun 09 Jul 10 Document No.001-63175 Rev. *C ECN # 4475040 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: FN30B 30-Ball Wafer Level Chip Scale Package (WLCSP) Die Separation Method: Saw Solder Ball/Bump Material: SnAg Bond Diagram Designation 001-59000 Bonding Method: Redistribution Layer (RDL) Redistribution Material: Polyimide and Copper Assembly Process Flow: 001-15621 Name/Location of Assembly (prime) facility: Amkor-Taiwan (AU) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: KYEC, Amkor Taiwan Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 10 Document No.001-63175 Rev. *C ECN # 4475040 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy Test J-STD-020 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Data Retention P Electrostatic Discharge Charge Device Model (ESD-CDM) Electrostatic Discharge Human Body Model (ESD-HBM) 150C ± 5C No Bias, JESD22-A117 and JESD22-A103 Test to determine the existence and extent of cracks, Criteria: No Package Crack 500V JESD22-C101 2,200V JESD22, Method A114 External Visual MIL-PRF-38535, MILSTD- 883, METHOD 2009 P Endurance Test P High Temperature Operating Life Latent Failure Rate MIL-STD-883, Method 883-1033 JEDEC STD 22-A110: 130°C, 5.25V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH +3IR-Reflow, 260°C+0, -5°C Dynamic Operating Condition, Vcc Max=5.5V, 125°C JESD22-A108 Dynamic Operating Condition, Vcc Max=5.5V, 125 C JESD22-A108 Internal Visual MIL-STD-883-2014 P Lead Integrity JESD22-B105, MIL STD 883 P Physical Dimension MIL-STD-1835, JESD22-B100 P Dye Penetration Highly Accelerated Saturation Test (HAST) High Temperature Operating Life Early Failure Rate Pressure Cooker Static Latch-up Temperature Cycle Thermal Shock JESD22-A102: 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C 125C, ± 200Ma, ± 140mA JESD78B MIL-STD-883C, Method 1010, Condition B, -55°C to 125°C Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22-A106B, Condition C, -55 C to 125C Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 10 P P P P P P P P P P Document No.001-63175 Rev. *C ECN # 4475040 Reliability Test Data QTP #: Device 081902 Fab Lot# Assy Lot # Assy Loc Duration Samp Rej CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN COMP 18 0 CY8C20634 (8C20634CC) 4815206 610851329 AU-TAIWAN COMP 15 0 4801582 4801582-02 AU-TAIWAN COMP 15 0 4801582 4801582-02 AU-TAIWAN COMP 5 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 500 77 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 1024 76 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 1048 1 0 Failure Mechanism STRESS: ACOUSTIC, MSL1 STRESS: ACOUSTIC, MSL3 CY8C20634 (8C20634CC) STRESS: CONSTRUCTIONAL ANALYSIS CY8C20634 (8C20634CC) STRESS: DATA RETENTION STRESS: ESD-CHARGE DEVICE MODEL (500V) CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN COMP 9 0 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN COMP 8 0 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN COMP 8 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN COMP 15 0 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN COMP 15 0 CY8C20634 (8C20634CC) 4815206 610851329 AU-TAIWAN COMP 15 0 STRESS: EXTERNAL VISUAL STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 168 HR, 85C/85%RH, MSL1 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 128 77 0 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN 128 77 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE- EARLY FAILURE RATE (125C, 5.5V, Vcc Max) CY8C20334 (8C20334) 4801582 4801582-02 AU-TAIWAN 96 499 0 CY8C20334 (8C20334) 4814901 4814901 AU-TAIWAN 96 500 0 CY8C20334 (8C20334) 4815206 4815206 AU-TAIWAN 96 498 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 10 Document No.001-63175 Rev. *C ECN # 4475040 Reliability Test Data QTP #: Device Fab Lot# Assy Lot # 081902 Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE- LATENT FAILURE RATE (125C, 5.5V, Vcc Max) CY8C20334 (8C20334) 4801582 4801582-02 AU-TAIWAN 168 180 0 CY8C20334 (8C20334) 4801582 4801582-02 AU-TAIWAN 1000 180 0 CY8C20334 (8C20334) 4814901 4814901 AU-TAIWAN 168 178 0 CY8C20334 (8C20334) 4814901 4814901 AU-TAIWAN 1000 176 0 CY8C20334 (8C20334) 4815206 4815206 AU-TAIWAN 168 178 0 CY8C20334 (8C20334) 4815206 4815206 AU-TAIWAN 1000 178 0 4801582 4801582-02 AU-TAIWAN 168 69 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN COMP 5 0 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN COMP 5 0 CY8C20634 (8C20634CC) 4815206 610851329 AU-TAIWAN COMP 5 0 4801582 4801582-02 AU-TAIWAN COMP 5 0 STRESS: ENDURANCE CY8C20634 (8C20634CC) STRESS: INTERNAL VISUAL STRESS: LEAD INTEGRITY CY8C20634 (8C20634CC) STRESS: PHYSICAL DIMENSION CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN COMP 30 0 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN COMP 30 0 CY8C20634 (8C20634CC) 4815206 610851329 AU-TAIWAN COMP 30 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192 HRS, 30C/60%RH, MSL3) CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 168 77 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 288 75 0 CY8C20634 (8C20634AC) 4814901 610851331 AU-TAIWAN 168 75 0 AU-TAIWAN COMP 6 0 STRESS: STATIC LATCH-UP TESTING (125C, 7.88V, ±200mA) CY8C20634 (8C20634CC) 4801582 4801582-02 STRESS: TC COND. C, -65°C to 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 500 77 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 10 Document No.001-63175 Rev. *C ECN # 4475040 Reliability Test Data QTP #: Device Fab Lot# Assy Lot # 081902 Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. B –55C TO 125C, PRE COND 168 HRS, 85C/85%RH, MS1 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN 500 78 0 CY8C20634 (8C20634CC) 4814901 610851331 AU-TAIWAN 1000 76 0 CY8C20634 (8C20634CC) 4815206 610851329 AU-TAIWAN 500 83 0 CY8C20634 (8C20634CC) 4815206 610851329 AU-TAIWAN 1000 83 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 200 78 0 CY8C20634 (8C20634CC) 4801582 4801582-02 AU-TAIWAN 1000 77 0 STRESS: THERMAL SHOCK Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 10 Document No.001-63175 Rev. *C ECN # 4475040 Reliability Test Data QTP #: Device 101601 Fab Lot# Assy Lot # Assy Loc Duration Samp Rej CY8C20766A (8F20746A) 4005399 WAFER 3 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 4 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 2 AU-TAIWAN COMP 5 0 Failure Mechanism STRESS: BALL SHEAR STRESS: CONSTRUCTIONAL ANALYSIS CY8C20766A (8F20746A) 4005399 WAFER 3 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 4 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 2 AU-TAIWAN COMP 5 0 AU-TAIWAN COMP 9 0 AU-TAIWAN COMP 8 0 STRESS: ESD-CHARGE DEVICE MODEL (500V) CY8C20766A (8C20766A) 4005399 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V CY8C20766A (8C20766A) 4005399 STRESS: EXTERNAL VISUAL CY8C20766A (8F20746A) 4005399 WAFER 3 AU-TAIWAN COMP 461 0 CY8C20766A (8F20746A) 4005399 WAFER 4 AU-TAIWAN COMP 461 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN COMP 461 0 CY8C20766A (8F20746A) 4005399 WAFER 2 AU-TAIWAN COMP 461 0 CY8C20766A (8F20746A) 4005399 WAFER 3 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 4 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN COMP 5 0 CY8C20766A (8F20746A) 4005399 WAFER 2 AU-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192 HRS, 30C/60%RH, MSL3) CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN 96 75 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN 168 73 0 AU-TAIWAN COMP 6 0 STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, ±140mA) CY8C20766A (8C20766A) 4005399 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 10 Document No.001-63175 Rev. *C ECN # 4475040 Reliability Test Data QTP #: Device 101601 Fab Lot# Assy Lot # Assy Loc Duration Samp Rej CY8C20766A (8F20746A) 4005399 WAFER 3 AU-TAIWAN COMP 30 0 CY8C20766A (8F20746A) 4005399 WAFER 4 AU-TAIWAN COMP 30 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN COMP 30 0 CY8C20766A (8F20746A) 4005399 WAFER 2 AU-TAIWAN COMP 30 0 Failure Mechanism STRESS: SEM ANALYSIS STRESS: TC COND. B –55C TO 125C, PRE COND 168 HRS, 85C/85%RH, MS1 CY8C20766A (8F20746A) 4005399 WAFER 3 AU-TAIWAN 500 83 0 CY8C20766A (8F20746A) 4005399 WAFER 3 AU-TAIWAN 1000 77 0 CY8C20766A (8F20746A) 4005399 WAFER 4 AU-TAIWAN 500 82 0 CY8C20766A (8F20746A) 4005399 WAFER 4 AU-TAIWAN 1000 78 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN 500 79 0 CY8C20766A (8F20746A) 4005399 WAFER 1 AU-TAIWAN 1000 79 0 CY8C20766A (8F20746A) 4005399 WAFER 2 AU-TAIWAN 500 67 0 CY8C20766A (8F20746A) 4005399 WAFER 2 AU-TAIWAN 1000 66 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 10 Document No.001-63175 Rev. *C ECN # 4475040 History Page Document Title: 101601: 30-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (2.204 X 2.32MM) MSL1, 260C AMKOR-TAIWAN (AU) 001-63175 Document Number: Rev. ECN No. ** 2991725 *A 3704112 *B Orig. of Change HGA NSR 4092686 HSTO *C 4475040 HSTO Distribution: WEB Posting: Description of Change Initial spec release 1)Removed VERSION in the title page- The revision is added next to the document # at every page 9top right corner). 2)Changed the Contact Reliability Engineer 3)Removed the reference Cypress Specs on the Reliability tests performed and replaced with reference Industry standards. Sunset Review Updated test location facility based on current qualified test site Align qualification report based on the new template in the front page None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 10