Document No.001-88989 Rev. *C ECN # 5150847 Cypress Semiconductor Package Qualification Report QTP# 133306 VERSION*C February 2016 TQFP (14x14x1.4mm) Pure Sn, CuPd Wire MSL3, 260C Reflow ASE Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director PACKAGE QUALIFICATION HISTORY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-88989 Rev. *C ECN # 5150847 QTP Number Description of Qualification Purpose Date 133306 Qualification of TQFP 100L 14x14x1.4mm assembled in ASEK using 0.8mil CuPd wire, G631H / G631SH mold comp, HITACHI FH-900 die attach FILM with Ag plated Cu Leadframe and Pure Sn leadfinish. Aug 2013 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 7 Document No.001-88989 Rev. *C ECN # 5150847 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: TQFP 100L Package Outline, Type, or Name: Oxygen Rating Index: >28% AZ0AB (14x14x1.4mm) G631H / Sumitomo G631SH / Sumitomo UL 94 V=0 pass G631H - N/A (not allow alpha mold compound) G631SH - <0.001 cph/m2 54% (typical) Lead Frame Designation: FMP Lead Frame Material: Copper Substrate Material: n/a Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: HITACHI Die Attach Material: FH-900 DIE ATTACH FILM Bond Diagram Designation 001-83305 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 34.64 C/W Package Cross Section Yes/No: n/a Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASE Taiwan (G) MSL LEVEL 3 REFLOW PROFILE 260C Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML (R) Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 7 Document No.001-88989 Rev. *C ECN # 5150847 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P X-Ray Criteria: Meet external and internal characteristics of package JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow MIL-STD-883 - 2012 Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Internal Visual MIL-STD-883-2014 P High Temp Storage JESD22-A103: 150 C, no bias P Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis High Accelerated Saturation Test (HAST) Bond Pull Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P P P P Document No.001-88989 Rev. *C ECN # 5150847 Reliability Test Data QTP #: 133306 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) COMP 15 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) COMP 15 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) COMP 15 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) COMP 50 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) COMP 50 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) COMP 50 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) COMP 50 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) COMP 50 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) COMP 50 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) COMP 5 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) COMP 5 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) COMP 5 0 STRESS: DYE PENETRANT TEST CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) COMP 15 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) COMP 15 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) 128 79 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) 128 77 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) 128 80 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 7 Document No.001-88989 Rev. *C ECN # 5150847 Reliability Test Data QTP #: 133306 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) 500 80 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) 500 60 0 CY8CTMA1036BUI (8C20407BC) BU84A 4223445 611226792 ASE TAIWAN (G) 500 83 0 CY8CTMA1036BUI (8C20407BC) BU84A 4223445 611226792 ASE TAIWAN (G) 1000 78 0 CY8CTMA1036BUI (8C20407BC) BU84A 4223445 611226790 ASE TAIWAN (G) 500 79 0 CY8CTMA1036BUI (8C20407BC) BU84A 4223445 611226790 ASE TAIWAN (G) 1000 74 0 CY8CTMA1036BUI (8C20407BC) BU84A 4223445 611226791 ASE TAIWAN (G) 500 79 0 CY8CTMA1036BUI (8C20407BC) BU84A 4223445 611226791 ASE TAIWAN (G) 1000 74 0 STRESS: INTERNAL VISUAL CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) COMP 5 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) COMP 5 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) COMP 5 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) 168 80 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) 288 80 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) 168 77 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) 288 77 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) 168 80 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) 288 78 0 STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) 500 80 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) 500 76 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) 1000 76 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) 500 79 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) 1000 79 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314007 ASE TAIWAN (G) COMP 15 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314008 ASE TAIWAN (G) COMP 15 0 CY8C5468AXI (8C561001AC) AZ100 4304019 611314009 ASE TAIWAN (G) COMP 15 0 STRESS: XRAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-88989 Rev. *C ECN # 5150847 Document History Page Document Title:QTP#133306: TQFP (14x14x1.4mm) Pure Sn, CuPd Wire MSL3, 260C Reflow ASE Taiwan (G) Document Number: 001-88989 Rev. ECN No. ** 4109322 *A 4122567 *B 4495798 *C 5150847 Orig. of Change HSTO HSTO HSTO HSTO Description of Change DCON Removed “Distribution: WEB” and “Posting: None” from history page Initial spec release Update Package Qualification History table in page 2 Align qualification report based on the new template in the front page Update contact person for Reliability Director Add G631SH mold compound in Major Package Information table. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7