Document No.001-75517 Rev. *B ECN # 4310956 Cypress Semiconductor Package Qualification Report QTP# 114903 VERSION*B March, 2014 16 QFN (3x3x0.6mm) 08 DFN (5x6x0.8mm) NiPdAu-Ag, 100% Cu Wire MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.001-75517 Rev. *B ECN # 4310956 PACKAGE QUALIFICATION HISTORY QTP Number 114903 Description of Qualification Purpose Qualification of 16QFN(3x3x0.6mm) & 8 DFN (5x6x0.8mm) package dimensions at ASEKH (G) using G631 mold compound and FH900 epoxy Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Date Jan 2012 Document No.001-75517 Rev. *B ECN # 4310956 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Mold Compound Name/Manufacturer: LG16AA, LH08 16 Quad Flat No-Lead/ Chip on Lead (3X3X0.6mm) 08 Dual Quad Flat No-Lead (5x6x0.8mm) G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: FH-900 Bond Diagram Designation 001-69245 Wire Bond Method: Thermosonic Wire Material/Size: Package Cross Section Yes/No: 0.8mil / Cu LG16 : 32.69°C/W LH08 : 110.83°C/W Yes Assembly Process Flow: 49-41999M Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C Package Outline, Type, or Name: Thermal Resistance Theta JA °C/W: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: KY Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 9 Document No.001-75517 Rev. *B ECN # 4310956 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle Test Condition (Temp/Bias) JEDEC STD 22-A110, 130°C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs, 30°C /60%RH+Reflow, 260°C +0, -5°C JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs, 30°C /60%RH+Reflow, 260°C +0, -5°C MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs, 30°C /60%RH+Reflow, 260°C +0, -5°C Result P/F P P P High Temp Storage JESD22-A103, 150 C, no bias P Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs, 30°C /60%RH+Reflow, 260°C +0, -5°C P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack P P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and Thermal Shock P JESD22-A106, Condition C, -55°C to 125°C X-Ray MIL-STD-883 - 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 - 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 9 Document No.001-75517 Rev. *B ECN # 4310956 Reliability Test Data QTP #: 114903 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 15 0 CY8C20236A(8C202662BK) 5123014 611153716 G-TAIWAN COMP 15 0 CY8C20236A(8C202662BK) 5123014 611153717 G-TAIWAN COMP 15 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 15 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 15 0 CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 5 0 CY8C20236A(8C202662BK) 5123014 611153716 G-TAIWAN COMP 5 0 CY8C20236A(8C202662BK) 5123014 611153717 G-TAIWAN COMP 5 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 5 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 5 0 CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 5 0 CY8C20236A(8C202662BK) 5123014 611153716 G-TAIWAN COMP 5 0 CY8C20236A(8C202662BK) 5123014 611153717 G-TAIWAN COMP 5 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 5 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 5 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 5 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 15 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 15 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 15 0 STRESS: ELECTRICAL CHARACTERIZATION CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN COMP 30 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN COMP 30 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 9 Document No.001-75517 Rev. *B ECN # 4310956 Reliability Test Data QTP #: 114903 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN 128 79 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 128 79 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 192 39 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 128 79 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 192 40 0 STRESS: HIGH TEMP STORAGE, 150C CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN 1000 110 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 1000 90 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 1500 78 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 1000 100 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 1500 99 0 CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN 1000 80 0 CY8C20466A(8C2046625AK) 5104069 611128981 G-TAIWAN 1000 80 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN 1000 80 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN 168 120 0 CY8C20236A(8C202662BK) 5123014 611153716 G-TAIWAN 168 120 0 CY8C20236A(8C202662BK) 5123014 611153717 G-TAIWAN 168 120 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 168 113 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 168 120 0 STRESS: PHYSICAL DIMENSION CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 5 0 CY8C20236A(8C202662BK) 5123014 611153716 G-TAIWAN COMP 5 0 CY8C20236A(8C202662BK) 5123014 611153717 G-TAIWAN COMP 5 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 5 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.001-75517 Rev. *B ECN # 4310956 Reliability Test Data QTP #: 114903 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: INTERNAL VISUAL CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 5 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 5 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 5 0 611146848 G-TAIWAN COMP 3 0 611146848 G-TAIWAN COMP 3 G-TAIWAN COMP 3 0 G-TAIWAN 128 5 0 STRESS: POST MSL3 BALL SHEAR CY8C20224(8C20234CC) 4113150 STRESS: POST MSL3 BOND PULL CY8C20224(8C20234CC) 4113150 0 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CY8C20224(8C20234CC) 4113150 611146848 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY8C20224(8C20234CC) 4113150 611146848 STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN 1000 5 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN 1000 5 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 500 5 0 STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 168 5 0 611146848 G-TAIWAN 500 5 0 STRESS: POST TC BALL SHEAR CY8C20224(8C20234CC) 4113150 STRESS: POST HIGH TEMP STORAGE BOND PULL CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN 1000 5 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN 1000 5 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 500 5 0 128 5 0 STRESS: POST HI-ACCEL SATURATION TEST BOND PULL CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN STRESS: POST PRESSURE COOKER TEST BOND PULL TEST CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 168 5 0 611146848 G-TAIWAN 500 5 0 STRESS: POST TC BOND PULL CY8C20224(8C20234CC) 4113150 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.001-75517 Rev. *B ECN # 4310956 Reliability Test Data QTP #: 114903 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN 500 120 0 CY8C20236A(8C202662BK) 5123014 611153716 G-TAIWAN 500 119 0 CY8C20236A(8C202662BK) 5123014 611153717 G-TAIWAN 500 120 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 500 120 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 1000 110 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 500 120 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 1000 108 0 CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN 200 100 0 CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN 1000 99 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN 200 80 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN 200 80 0 CY8C20236A(8C202662BK) 5123014 611146849 G-TAIWAN COMP 15 0 CY8C20236A(8C202662BK) 5123014 611153716 G-TAIWAN COMP 15 0 CY8C20236A(8C202662BK) 5123014 611153717 G-TAIWAN COMP 15 0 CY8C20224(8C20234CC) 4113150 611146848 G-TAIWAN COMP 15 0 CY8C20110(8C20110BK) 5117011 611146847 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.001-75517 Rev. *B ECN # 4310956 Document History Page Document Title: QTP 114903: 16 QFN (3X3X0.6MM) & 08 DFN (5X6X0.8MM) NIPDAU-AG, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G) 001-75517 Document Number: Rev. ECN No. ** 3486089 *A 3580472 Orig. of Change ILZ NSR *B JYF 4310956 Description of Change Initial spec release Added extended readpoints 1000 Cycle TCT, 192H HAST and 1500H HTS. Removed QTP Version 1.0 in the title page Added the reference Industry Standards (JEDEC and MIL) in the stress test conditions table. Alignment of QTP title page and Reliability Tests Performed table to standard template. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9