Document No. 002-11992 Rev. ** ECN #: 5212950 Cypress Semiconductor Package Qualification Report QTP# 153305 VERSION ** April 2016 48L TQFP (7x7x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow OSE-Taiwan (T) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Honesto Sintos (HSTO) Sr. Reliability Engineer Reviewed By: Rene Rodgers (RT) Sr. MTS Reliability Engineer Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No. 002-11992 Rev. ** ECN #: 5212950 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 153305 Qualification of 48L TQFP (7x7x1.4mm) at OSE-Taiwan (G) using 0.8mil CuPd wire with Sumitomo G631 mold compound, CRM-1076 die attach material, CuPd leadframe and Pure Sn leadfinish at MSL3, 260°C reflow temperature Mar 2016 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No. 002-11992 Rev. ** ECN #: 5212950 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ48 Package Outline, Type, or Name: 48L-Thin Quad Flat Package (7x7x1.4mm) Mold Compound Name/Manufacturer: G631/Sumitomo Mold Compound Flammability Rating: UL 94 V=0 pass Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: 54% (typical) Lead Frame Designation: FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer saw Die Attach Supplier: Sumitomo Die Attach Material: CRM1076 Bond Diagram Designation: 001-98723 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8 mil Thermal Resistance Theta JA °C/W: 67.28C/W Package Cross Section Yes/No: N Assembly Process Flow: 001-96147M Name/Location of Assembly (prime) facility: OSE-Taiwan (T) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No. 002-11992 Rev. ** ECN #: 5212950 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Ball Shear JESD22-B116 P Bond Pull JESD22-B116 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Dye Penetrant Test MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack High Accelerated Saturation Test (HAST) JESD22-A110, 130C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P High Temperature Storage Life JESD22-A103, 150C P Internal Visual MIL-STD-883-2014 P Die Shear Pressure Cooker Temperature Cycle X-Ray JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P P P P Document No. 002-11992 Rev. ** ECN #: 5212950 Reliability Test Data QTP #: Device 153305 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN COMP 100 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN COMP 100 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN COMP 100 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN COMP 100 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN COMP 100 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN COMP 100 0 4534099 611537783 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN COMP 15 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN COMP 2278 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN COMP 2151 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN COMP 2426 0 Failure Mechanism STRESS: ACOUSTICS STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C4247AZI (8CP42001AC) STRESS: DIE SHEAR STRESS: DYE PENETRANT STRESS: FINAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No. 002-11992 Rev. ** ECN #: 5212950 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc 153305 Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN 96 30 0 STRESS: HIGH TEMPERATURE STORAGE CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN 500 80 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN 1000 80 0 4534099 611537783 T-TAIWAN 96 30 0 STRESS: INTERNAL VISUAL CY8C4247AZI (8CP42001AC) STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN 168 80 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN 288 80 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN 500 80 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN 1000 80 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN 500 80 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN 1000 80 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN 500 80 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN 1000 80 0 CY8C4247AZI (8CP42001AC) 4534099 611537783 T-TAIWAN COMP 5 0 CY8C4247AZI (8CP42002AC) 4534099 611537781 T-TAIWAN COMP 5 0 CY8C4247AZI (8CP42002AC) 4534099 611537782 T-TAIWAN COMP 5 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No. 002-11992 Rev. ** ECN #: 5212950 Document History Page Document Title: Document Number: QTP#153305: 48L TQFP (7x7x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow OSE-Taiwan (T) 002-11992 Rev. ECN Orig. of No. Change ** 5212950 HSTO Description of Change Initial spec release. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7