Document No.002-03009 Rev. ** ECN # 4906781 Cypress Semiconductor Package Qualification Report QTP# 152902 VERSION** September 2015 48-Lead QFN (Stacked Die) (7x7x1mm) Matte Sn Leadfinish, Au Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.002-03009 Rev. ** ECN # 4906781 PACKAGE QUALIFICATION HISTORY QTP Number 152902 Description of Qualification Purpose Qualification of 48L QFN Stacked Die (7x7x1mm) at ASEK-Taiwan (G) using 0.8mil Au wire with G700LA mold compound, FH900 (bottom die), NEX130 (top die) die attach material, Copper leadframe and Matte Sn leadfinish at MSL3, 260C Reflow Temperature. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date August 2015 Document No.002-03009 Rev. ** ECN # 4906781 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT48E Package Outline, Type, or Name: 48L QFN Stacked die 7x7x1mm Mold Compound Name/Manufacturer: G700LA / Sumitomo Mold Compound Flammability Rating: N/A (not low alpha mold compound) Mold Compound Alpha Emission Rate: UL 94 V=0 pass Oxygen Rating Index: >28% 54% Lead Frame Designation: Full Metal Pad Lead Frame Material: C194 Substrate Material: N/A Lead Finish, Composition / Thickness: Matte Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Bond Diagram Designation Wafer Saw Nippon (Top) Hitachi (Bottom) NEX130 (Top) FH900 (Bottom) 001-69180 Wire Bond Method: Thermosonic Wire Material/Size: 0.8 mil /Au Wire Thermal Resistance Theta JA C/W: 30 C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 002-00134 Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL Level 3 Reflow Profile 260C Die Attach Supplier: Die Attach Material: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: ASE-Taiwan (G) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.002-03009 Rev. ** ECN # 4906781 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack P P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V / 1000V / 1250V JESD22-C101 P Final Visual Inspection JESD22-B101 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130C, 85%RH, 3.63V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P High Temp Storage JESD22-A103: 150 C, no bias P Internal Visual Inspection MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker Test Solderability Temperature Cycle X-Ray JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-002, JESD22-B102 95% solder coverage minimum MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P P Document No.002-03009 Rev. ** ECN # 4906781 Reliability Test Data QTP #: 152902 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 15 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 15 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 15 0 CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 100 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 100 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 100 0 CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 100 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 100 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 100 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 5 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 5 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 5 0 STRESS: DYE PENETRANT TEST CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 15 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 15 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 15 0 STRESS: ESD-CHARGE DEVICE MODEL CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan 500 9 0 CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan 1000 3 0 CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan 1250 3 0 CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 1033 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 1951 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 1549 0 STRESS: FINAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.002-03009 Rev. ** ECN # 4906781 Reliability Test Data QTP #: 152902 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan 96 25 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan 96 25 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan 96 25 0 STRESS: HIGH TEMP STORAGE, 150C CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan 1000 77 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan 1000 77 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan 1000 77 0 4243984 611326446M G-Taiwan COMP 5 0 STRESS: INTERNAL VISUAL CYWUSB6953 (7B6953AC) STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan 168 25 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan 168 25 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan 168 25 0 CYWUSB6953 (7B6953AC) 4247335 611511200 G-Taiwan 168 90 0 STRESS: PHYSICAL DIMENSION CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 30 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 30 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 30 0 STRESS: SOLDERABILITY TEST CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 3 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 3 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 3 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan 500 25 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan 500 25 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan 500 25 0 CYWUSB6953 (7B6953AC) 4247335 611511200 G-Taiwan 500 90 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.002-03009 Rev. ** ECN # 4906781 Reliability Test Data QTP #: 152902 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYWUSB6953 (7B6953AC) 4243984 611326446M G-Taiwan COMP 15 0 CYWUSB6953 (7B6953AC) 4243984 611326446M1 G-Taiwan COMP 15 0 CYWUSB6953 (7B6953AC) 4243984 611326446 G-Taiwan COMP 15 0 Failure Mechanism STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.002-03009 Rev. ** ECN # 4906781 Document History Page Document Title: Document Number: QTP#152902: 48-LEAD QFN (STACKED DIE) (7X7X1MM) MATTE SN LEADFINISH, AU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G) 002-03009 Rev. ECN Orig. of No. Change ** 4906781 HSTO Description of Change Initial release. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8