INTEGRATED CIRCUITS
DATA SHEET
PCF1303T
18-element bar graph LCD driver
Product specification
File under Integrated Circuits, IC01
November 1986
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
GENERAL DESCRIPTION
The PCF1303T is an 18-element bar graph LCD driver with linear relation to control voltage (Vc) when in pointer or
thermometer mode.
Fig.1 Block diagram.
PACKAGE OUTLINE
PCF1303T: 28-lead mini-pack; plastic (SO28; SOT136A); SOT136-1; 1996 September 02.
November 1986
2
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
PIN DESCRIPTION
PIN NO.
SYMBOL
NAME AND FUNCTION
1
Vosc
oscillator pin
4
I1
mode select input
5
VSS
ground (0 V)
6 to 23
Q1 to Q18
segment outputs
24
QR
back-plane output
25
Vc
control voltage
26
Vref min
reference voltage inputs
27
Vref max
28
VDD
positive supply voltage
FUNCTION TABLE
I1
MODE
L
pointer
H
thermometer
H = HIGH voltage level
L = LOW voltage level
(1) Pins 2 and 3 should be connected to VSS.
Fig.2 Pin configuration.
November 1986
3
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
FUNCTIONAL DESCRIPTION
The PCF1303T is an 18-element bar graph LCD driver with linear relation to the control voltage when in pointer or
thermometer mode.
The first segment will energize when the control voltage is less than the trigger voltage (VT(bar)2 see equation (3)).
The circuit has analogue and digital sections.
The analogue section consists of a comparator with the inverting input coupled to the input control voltage. The
non-inverting input of the comparator is connected via 17 analogue switches to the nodes of an 18-element resistor
divider. The extremities of the resistor divider are coupled via high-input impedance amplifiers to the maximum reference
voltage input and the minimum reference voltage input.
The control input functions with Schmitt trigger action.
The digital section has one reference output (QR) to drive the back-plane and 18 outputs (Q1 to Q18) to drive the
segments.
The segment outputs incorporate two latches and some gates.
The circuit is driven by an on-chip oscillator with external resistors and capacitors. The outputs are driven at typical
100 Hz.
LINEARITY
V step = V step′ ± ∆V step
(1)
Vstep′ is the voltage drop (internal) across the resistor-ladder network.
∆Vstep is the differential on Vstep.
( V ref max ± ∆V 2′ ) – ( V ref min ± ∆V 2 )
V step′ = -------------------------------------------------------------------------------------------18
(2)
∆V2 and ∆V2′ are the maximum offset voltage spread of the on-chip voltage followers.
ABSOLUTE VOLTAGE TRIGGER LEVEL
The absolute voltage trigger level at the Vc pin is VT(bar)n;
V T ( bar ) n = ( V ref min ± ∆V 2 ) + { ( n – 1 ) V step′ ± ∆V R } ± ∆V 1 ± V H
n = number of segments; 2 ≤ n ≤ 18.
∆VR is the voltage deviation at step n of the resistor-ladder network (for n = 2 or 18, ∆VR = ∆Vstep).
∆V1 is the offset voltage for the on-chip comparator.
VH is the hysteresis voltage: 30% Vstep ≥ VH ≥ 10% Vstep.
Note to equation (3)
For ∆V2 the same sign (+ or −) should be used as in equation (2).
November 1986
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(3)
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
RATINGS
Limiting values as in accordance with the Absolute Maximum System (IEC 134)
Supply voltage
VDD
−0,5 to + 15
Voltage on any input
VI
−0,5 to VDD + 0,5 V
D.C. current into any input or output
± II
max. 10
mA
Storage temperature range
Tstg
−25 to + 125
°C
Operating ambient temperature range
Tamb
−40 to + 85
°C
V
D.C. CHARACTERISTICS
VSS = 0 V
Tamb (°C)
PARAMETER
VDD
−40
SYMBOL
V
MIN.
MAX.
+25
MIN.
TYP.
+85
MAX.
MIN.
UNIT
NOTES
MAX.
10,0
IDD
1200
1200
1200
µA
1
8,2
IDD
2,0
2,0
2,0
mA
2
Input leakage
6,0
± II
300
300
1000
nA
3
current
8,2
± II
300
300
1000
nA
10,0
± II
300
300
1000
nA
HIGH level
6,0
VIH
4,2
4,2
4,2
V
input voltage
8,2
VIH
5,8
5,8
5,8
V
select input I1
10,0
VIH
7,0
7,0
7,0
V
LOW level input
6,0
VIL
1,8
voltage
8,2
VIL
2,4
select input I1
10,0
VIL
3,0
HIGH level
6,0
VOH
5,95
5,95
5,95
V
Quiescent device
current
Operating supply
current
output voltage
LOW level
output voltage
1,8
2,4
1,8
V
3,0
V
2,4
V
3,0
8,2
VOH
8,15
8,15
8,15
V
10,0
VOH
9,95
9,95
9,95
V
6,0
VOL
0,05
0,05
0,05
V
8,2
VOL
0,05
0,05
0,05
V
10,0
VOL
0,05
0,05
0,05
V
Output current
6,0
−IOH
0,6
0,5
0,35
mA
HIGH
8,2
−IOH
0,85
0,7
0,45
mA
10,0
−IOH
1,0
0,85
0,6
mA
Output current
6,0
IOL
0,65
0,5
0,4
mA
LOW
8,2
IOL
1,0
0,8
0,6
mA
10,0
IOL
1,3
1,0
0,8
mA
November 1986
5
4
4
5
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Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
Tamb (°C)
PARAMETER
VDD
−40
SYMBOL
V
MIN.
MAX.
+25
MIN.
TYP.
+85
MAX.
MIN.
UNIT
MAX.
Input voltage
6,0
VIC
0,0
6,0
0,0
6,0
0,0
6,0
V
control input Vc
8,2
VIC
0,0
8,2
0,0
8,2
0,0
8,2
V
10,0
VIC
0,0
10,0
0,0
10,0
0,0
10,0
V
6,0
VIR max
3,6
5,5
3,6
5,5
3,6
5,5
V
Input voltage
Vref max input
8,2
VIR max
3,6
7,7
3,6
7,7
3,6
7,7
V
10,0
VIR max
3,6
9,5
3,6
9,5
3,6
9,5
V
Input voltage
6,0
VIR min
0,5
1,0
0,5
1,0
0,5
1,0
V
Vref min input
8,2
VIR min
0,5
4,5
0,5
4,5
0,5
4,5
V
10,0
VIR min
0,5
6,0
0,5
6,0
0,5
6,0
Vref max −
6,0
∆VI
3,0
3,0
3,0
V
Vref min
8,2
∆VI
3,0
3,0
3,0
V
10,0
∆VI
3,0
8,2
± VBP
8,2
fBP
8,2
± VIO
120
8,2
± ∆Vstep
Input voltage
6,0
slew rate
Vc input
DC component
3,0
3,0
25
10
110
100
25
NOTES
V
V
25
mV
7
110
Hz
8
120
120
mV
9
50
50
50
mV
10
SR
50
50
50
V/s
11
8,2
SR
50
50
50
V/s
10,0
SR
50
50
50
V/s
bar output to
back-plane output
Back-plane
90
90
frequency
Input offset
voltage
Step voltage
variation
November 1986
6
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
Notes to D.C. characteristics
1. Vref min = 0,5 V, Vref max = 9,5 V, Vc = Vosc = 0 V, I1 at VSS or VDD.
2. See Fig.2.
3. Pin under test at VSS or VDD. All other inputs simultaneously at VSS or VDD.
4. IO = 0, all inputs at VSS or VDD.
5. VOH = VDD − 0,5 V, all inputs at VSS or VDD.
6. VOL = 0,4 V, all inputs at VSS or VDD.
7. fBP = 100 Hz, load segment outputs to back-plane output.
C1 − C18 ≤ 0,01 µF, CBP = C1 + C2 + . . . C18 ≤ 0,05 µF, R1 − R18 ≥ 2 MΩ.
8. Rosc = 0,1 MΩ, Cosc = 390 pF.
9. Number of segments 2 or 18.
For n = 2:
( V ref max ) – ( V ref min )
V IO = V c – V ref min – ------------------------------------------------------------------- ± VH
18
For n = 18:
( V ref max ) – ( V ref min )
V IO = V c – V ref max + --------------------------------------------------------- ± VH
18
10. See equation (1).
11. Condition applies with clock oscillator such that fBP = 100 Hz.
Fig.3 Typical application.
November 1986
7
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
PACKAGE OUTLINE
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
HE
v M A
Z
15
28
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
e
bp
0
detail X
w M
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.71
0.69
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT136-1
075E06
MS-013AE
November 1986
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
8
o
8
0o
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
November 1986
9
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1986
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