Document No. 001-72502 Rev. *C ECN #: 4518042 Cypress Semiconductor Product Qualification Report QTP# 072401 VERSION*C September, 2014 General Purpose Low Power 4PLL w/Programmable Spread Spectrum Clock Generator, L8C-3R Technology, Fab 4 CY2544Cxxx / CY2544Ixxx CY2545Cxxx /CY2545Ixxx CY2548Cxxx / CY2548Ixxx M60xxLFXI / M80xxLFXI CY2546Cxxx/CY2546Ixxx CY2547Cxxx/CY2547Ixxx CY25404ZXC-xxx/ CY25404ZXI-xxx 9xxLFXI / M7xxLFXI M6xxLFXI /M3xxLFXI M2xxLFXI CY25403SXCxxx/CY25423SXCxxx CY25483SXCxxx/CY25403SXIxxx CY25423SXIxxx, CY25483SXIxxx CY25402SXCxxx/CY25422SXCxxx CY25412SXCxxx/CY25432SXCxxx CY25482SXCxxx/CY25402SXIxxx CY25422SXIxxx/CY25412SXIxxx CY25432SXIxxx/CY25482SXIxxx 3.3/3.0/2.5V Programmable Clock Generator4x4mm 24Lead QFN Package 1.8V Programmable Clock Generator4x4mm 24Lead QFN Package 3.3/3.0/2.5V Programmable Clock Generator20Lead TSSOP Package 3.3/3.0/2.5/1.8V Programmable Clock Generator – 3x3mm 16Lead QFN Package Three PLL Programmable Clock Generator with Spread Spectrum – 8L SOIC Two PLL Programmable Clock Generator with Spread Spectrum – 8L SOIC Four-PLL Programmable Clock Generator for Portable Applications 1.8V Input, 2.5/3.0/3.3V Quad PLL Programmable Spread Spectrum Clock Generator with 2 Wire Serial Interface and Frequency Select M4000 CY2542 FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date Comp 053301 Qualify L8C-3R Technology Derivative of the C8 Technology at Fab4 using CY5077 Device Sep 06 053408 Qualify 7C84400A Device in L8C-3R Technology, Fab4 Jul 06 072401 Qualify 7C84501B Device in L8C-3R Technology, Fab4 Sep 07 073705 Qualify 7C84502BC, Metal option of 7C84501B Nov 07 120102 Qualification of Bond Device Options M4000 / CY2542 on 24 QFN Package, L8C-3R Technology in CMI Fab 4 Feb 12 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify CY2546C Device on L8C-3R Technology at Fab4 Marketing Part #: CY2544/45C/Ixxx, CY2546/47C/Ixxx, CY25404ZXI-xxx, CY25403SXC/I-xxx , CY25402SXC/I-xxx , M600xLFXI, M800xLFXI, M60x, M30x, M20x, M40x, CY2542 Device Description: 1.8V, 2.5V, 3.3V PLL Programmable Clock Generator (Commercial & Industrial) Cypress Division: Cypress Semiconductor Corporation – Memory Product Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 4 Metal Composition: Metal 1: 100A Ti/3,200A Al 0.5% Cu /300A TiW Metal 2: 150A Ti/4,230A Al 0.5% Cu/300A TiW Metal 3: 150A Ti/4,230A Al 0.5% Cu/300A TiW Metal 4: 150A Ti/8,000A Al 0.5% Cu/300A TiW Passivation Type and Materials: 1,000A TeOs / 7,000A Si3N4 Generic Process Technology/Design Rule (µ-drawn): CMOS, 0.13µm Gate Oxide Material/Thickness (MOS): SiO2 DGOX 32/55A Name/Location of Die Fab (prime) Facility: CMI / Bloomington MN Die Fab Line ID/Wafer Process ID: Fab4, L8C-3R PACKAGE AVAILABILITY PACKAGE ASSEMBLY SITE FACILITY 24-Pin QFN Amkor- SEOUL (L) 16-Pin QFN Amkor- PHILIPPINES (M) 20-Lead TSSOP OSE- TAIWAN (T) 8-Lead SOIC CML - PHILIPPINES (RA) Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: LY24 24-Pin Quad Flat No-Lead (QFN) Sumitomo EME G700 UL-94 V-0 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation: 001-15874 Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0mil Thermal Resistance Theta JA °C/W: 23°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-10994 Name/Location of Assembly (prime) facility: SEOUL-L MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc Max=2.07V, 150°C Result P/F P Dynamic Operating Condition, Vcc Max=2.35V, 150°C Early Failure Rate Dynamic Operating Condition, Vcc Max=3.8V, 150°C JESD22-A108 High Temperature Operating Life Latent Failure Rate Dynamic Operating Condition, Vcc Max=2.07V, 150°C Dynamic Operating Condition, Vcc Max=2.35V, 150°C P Dynamic Operating Condition, Vcc Max=3.8V, 150°C JESD22-A108 Long Life Verification Dynamic Operating Condition, Vcc Max=2.35V, 150°C P JESD22-A108 High Temperature Steady State Life 150°C, 2.35V, Vcc Max High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 2.35V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 3 P JESD22-A108 P 192 Hrs, 30C/60%RH+ Reflow, 260°C +0, -5°C Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 3 Pressure Cooker JESD22-A102: 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 3 P 192 Hrs, 30C/60%RH+ Reflow, 260°C +0, -5°C P 192 Hrs, 30C/60%RH+ Reflow, 260°C +0, -5°C Electrostatic Discharge Human Body Model (ESD-HBM) 2100V/2200V JEDEC EIA/JESD22-A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Acoustic Microscopy J-STD-020 P Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C +0, -5°C Dynamic Latch-up 6.25V P JESD78 High Temperature Storage JESD22-A103: 150°C, no bias P Latch up Sensitivity 125°C, ± 50mA P JESD78 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 RELIABILITY FAILURE RATE SUMMARY Stress/Test 3 Device Tested/ Device Hours # Fails Activation Energy Thermal A.F Failure Rate High Temperature Operating 1 Life Early Failure Rate 3,261 Devices 0 N/A N/A 0 PPM High Temperature Operating 1,2 Life Long Term Failure Rate 489,100 DHRs 0 0 .7 170 11 FIT 1 2 3 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 k = Boltzmann's constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. 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Page 6 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 053301 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CML-RA COMP 16 0 Failure Mechanism STRESS: ACOUSTIC-MSL3 CY5077 (7C850003A) 4538565 610555083 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M COMP 15 0 CY5077 (7C850003A) 4615715 610637084 COMP 15 0 COMP 2 0 COMP 2 0 COMP 9 0 PHIL-M STRESS: DYNAMIC LATCH-UP, 5.0V CY5077 (7C850003A) STRESS: DYNAMIC LATCH-UP, 6.25V CY5077 (7C850003A) STRESS: ESD-CHARGE DEVICE MODEL (500V) CY5077 (7C850003A) 4538565 610555083 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M COMP 9 0 CY5077 (7C850003A) 4615715 610637084 COMP 9 0 CML-RA PHIL-M STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2200V CY5077 (7C850003A) 4538565 610555083 CML-RA COMP 9 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M COMP 9 0 CY5077 (7C850003A) 4615715 610637084 COMP 3 0 PHIL-M STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, 2200V CY5077 (7C850003A) 4538565 610555083 CML-RA COMP 3 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M COMP 3 0 CY5077 (7C850003A) 4615715 610637084 3 0 PHIL-M COMP STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.35V, Vcc Max) CY5077 (7C850003A) 4538565 610555083 CML-RA 48 519 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 48 1061 0 CY5077 (7C850003A) 4615715 610637084 PHIL-M 48 500 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.35V) CY5077 (7C850003A) 4538565 610555083 CML-RA 80 79 0 CY5077 (7C850003A) 4538565 610555083 CML-RA 168 79 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 7 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 053301 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.35V, Vcc Max) CY5077 (7C850003A) 4538565 610555083 CML-RA 80 120 0 CY5077 (7C850003A) 4538565 610555083 CML-RA 500 120 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 80 120 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 500 120 0 CY5077 (7C850003A) 4615715 610637084 PHIL-M 80 120 0 CY5077 (7C850003A) 4615715 610637084 PHIL-M 500 120 0 1000 119 0 STRESS: LONG LIFE VERIFICATION TEST (150C, 2.35V, Vcc Max) CY5077 (7C850003A) 4538565 610555083 CML-RA STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 2.35V), PRE COND 192 HR, 30C/60%RH, MSL3 CY5077 (7C850003A) 4538565 610555083 CML-RA 128 48 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 128 48 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 256 47 0 STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 500 50 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 1000 50 0 STRESS: STATIC LATCH-UP TESTING (125C, 3.0V, ±200mA), 1.8V Option CY5077 (7C850003A) 4538565 610555083 CML-RA COMP 3 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M COMP 3 0 CY5077 (7C850003A) 4615715 610637084 COMP 3 0 COMP 3 0 PHIL-M STRESS: STATIC LATCH-UP TESTING (125C, 6.5V, ±200mA), 3.3V Option CY5077 (7C850003A) 4538565 610555083 CML-RA STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA), 3.3V Option CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M COMP 3 0 CY5077 (7C850003A) 4615715 610637084 COMP 3 0 PHIL-M Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 053301 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY5077 (7C850003A) 4538565 610555083 CML-RA 300 50 0 CY5077 (7C850003A) 4538565 610555083 CML-RA 500 50 0 CY5077 (7C850003A) 4538565 610555083 CML-RA 1000 50 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 300 50 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 500 50 0 CY5077 (7C850003A) 4550443 61033232/3/915 PHIL-M 1000 50 0 CY5077 (7C850003A) 4615715 610637084 PHIL-M 300 49 0 CY5077 (7C850003A) 4615715 610637084 PHIL-M 500 49 0 CY5077 (7C850003A) 4615715 610637084 PHIL-M 1000 48 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 053408 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC-MSL3 CY27044 (7C870442A) 4547637 610615630 KOREA-L COMP 15 0 CY27044 (7C870442A) 4549015 610621941 KOREA-L COMP 15 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L COMP 15 0 STRESS: ESD-CHARGE DEVICE MODEL (500V) CY27044 (7C870442A) 4547637 610615630 KOREA-L COMP 9 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L COM P 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2200V CY27044 (7C870442A) 4547637 610615630 KOREA-L COMP 9 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, 2,200V CY27044 (7C870442A) 4547637 610615630 KOREA-L COMP 3 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L COMP 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.35V, Vcc Max) CY27044 (7C870442A) 4547637 610615630 KOREA-L 48 339 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY27044 (7C870442A) 4549015 610621941 KOREA-L 48 355 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.35V, Vcc Max) CY27044 (7C870442A) 4547637 610615630 KOREA-L 80 120 0 CY27044 (7C870442A) 4547637 610615630 KOREA-L 500 120 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY27044 (7C870442A) 4549015 610621941 KOREA-L 80 120 0 CY27044 (7C870442A) 4549015 610621941 KOREA-L 500 120 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 2.35V), PRE COND 192 HR, 30C/60%RH, MSL3 CY27044 (7C870442A) 4547637 610615630 KOREA-L 128 48 0 STRESS: STATIC LATCH-UP TESTING (125C, 3.0V, ±200mA) CY27044 (7C870442A) 4547637 610615630 KOREA-L COMP 3 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L COMP 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 053408 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY27044 (7C870442A) 4547637 610615630 KOREA-L 300 50 0 CY27044 (7C870442A) 4547637 610615630 KOREA-L 500 50 0 CY27044 (7C870442A) 4547637 610615630 KOREA-L 1000 50 0 CY27044 (7C870442A) 4549015 610621941 KOREA-L 300 50 0 CY27044 (7C870442A) 4549015 610621941 KOREA-L 500 50 0 CY27044 (7C870442A) 4549015 610621941 KOREA-L 1000 50 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L 300 50 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L 500 50 0 CY27044 (7C870442A) 4614301 610628571 KOREA-L 1000 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 072401 Device Fab Lot # Assy Lot # Assy Loc 4716297 610737565 KOREA-L Duration Samp Rej COMP 15 0 Failure Mechanism STRESS: ACOUSTIC-MSL3 CY2546C (7C8B5401B) STRESS: ESD-CHARGE DEVICE MODEL (500V) CY2546C (7C8B5401B) 4716297 610737565 KOREA-L COMP 9 0 CY2544C (7C8A5401B) 4716297 610737566 KOREA-L COMP 9 0 M202 (7C825416B) 4716297 610733912 PHIL-M COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2200V CY2546C (7C8B5401B) 4716297 610737565 KOREA-L COMP 8 0 CY2544C (7C8A5401B) 4716297 610737566 KOREA-L COMP 8 0 M202 (7C825416B) 4716297 610733912 PHIL-M COMP 8 0 CY25404 (7C8A5423B) 4716297 610731870 TAIWAN-T COMP 8 0 COMP 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2100V CY25404 (7C8A5423B) 4716297 610731870 TAIWAN-T STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY2546C (7C8B5401B) 4649571 CY2546C (7C8B5401B) 4716297 610737565 KOREA-L 48 1080 0 KOREA-L 48 1078 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 3.8V, Vcc Max) CY2544C (7C8A5401B) 4716297 610737566 KOREA-L 48 1103 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY2546C (7C8B5401B) 4649571 KOREA-L 80 120 0 CY2546C (7C8B5401B) 4649571 KOREA-L 500 120 0 CY2546C (7C8B5401B) 4716297 610737565 KOREA-L 80 120 0 CY2546C (7C8B5401B) 4716297 610737565 KOREA-L 500 120 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE--LATENT FAILURE RATE (150C, 3.8V, Vcc Max) CY2544C (7C8A5401B) 4716297 610737566 KOREA-L 80 120 0 KOREA-L COMP 6 0 KOREA-L COMP 6 0 STRESS: STATIC LATCH-UP TESTING (125C, 3.0V, ±200mA) CY2546C (7C8B5401B) 4716297 610737565 STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA) CY2544C (7C8A5401B) 4716297 610737566 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 072401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej 6 0 Failure Mechanism STRESS: STATIC LATCH-UP TESTING (125C, 5.4V/3.0V, ±200mA) M202 (7C825416B) 4716297 610733912 PHIL-M COMP STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 psig, PRE COND 192HR, 30C/60%RH, MSL3 CY2546C (7C8B5401B) 4716297 610737565 KOREA-L 168 80 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY2546C (7C8B5401B) 4649571 KOREA-L 500 84 0 CY2546C (7C8B5401B) 4649571 KOREA-L 1000 84 0 CY2546C (7C8B5401B) 4716297 KOREA-L 500 80 0 610737565 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 073705 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL (500V) CY25403S (7C8A5402B) 4723974 610757075 CML-RA COMP 9 0 CY25482S (7C8A5404B) 4723974 610757087 CML-RA COMP 9 0 CY25422S (7C8B5402B) 4723974 610757088 CML-RA COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2200V CY25403S (7C8A5402B) 4723974 610757075 CML-RA COMP 8 0 CY25482S (7C8A5404B) 4723974 610757087 CML-RA COMP 8 0 CY25422S (7C8B5402B) 4723974 610757088 CML-RA COMP 8 0 STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA) CY25403S (7C8A5402B) 4723974 610757075 CML-RA COMP 6 0 CY25482S (7C8A5404B) 4723974 610757087 CML-RA COMP 6 0 CML-RA COMP 6 0 COMP COMPARABLE STRESS: STATIC LATCH-UP TESTING (125C, 2.7V, ±200mA) CY25422S (7C8B5402B) 4723974 610757088 STRESS: SORT YIELD CY25403S (7C8A5402B) 4723974 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Reliability Test Data QTP #: 120102 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114 , 2200V M4000LFXI (7C8C5401B) 4803133 610913282 L-KOREA COMP 8 0 CY2542FCI (7C8C5405B) 4843704 610938584 L-KOREA COMP 8 0 STRESS: STATIC LATCH-UP TESTING (125C, 1.9V, ± 50mA) M4000LFXI (7C8C5401B) 4803133 610913282 L-KOREA COMP 8 0 CY2542FCI (7C8C5405B) 4843704 610938584 L-KOREA COMP 8 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 16 Document No. 001-72502 Rev. *C ECN #: 4518042 Document History Page Document Title: 072401: GENERAL PURPOSE LOW POWER 4PLL W/PROGRAMMABLE SPREAD SPECTRUM CLOCK GENERATOR, L8C-3R TECHNOLOGY, FAB 4 001-72502 Document Number: Rev. ECN No. ** 3360918 *A 3530371 Orig. of Change HGA NSR *B 4131677 JYF *C 4518042 JYF Description of Change Initial spec release Added QTP 120102 in the history page and QTP data. Added CY2542 and M4000 devices in the title page. Remove QTP version 2.1 in the title page Sunset Spec Review: Complete re-write of Reliability Tests Performed table to align with current spec template. Sunset review: - Updated QTP title page for template alignment; - Updated device division from DCD to MPD. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 16