20L -SOIC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 SZ B1: 549.9901 mg B2: 550.0000 mg B3: 550.4266 mg Body Size (mil/mm) Package Weight – Site 2 300 mils B1: 550.0000 mg B2: 544.3501 mg SUMMARY The 20L- SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 030802, 041601, 054502, 125106 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ20CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 1 of 11 20L -SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Standard Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Fused Silica Solid Epoxy Resin Phenol Resin Antimony Trioxide Crystalline Silica Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 210.5517 5.1876 0.1513 0.2594 0.1930 0.0035 0.0035 0.1596 0.0190 0.0095 0.0008 0.0008 0.0004 % weight of substance per Homogenous material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 84.0000% 10.0000% 5.0000% 0.4000% 0.4000% 0.2000% 7440-21-3 7440-57-5 60676-86-0 Trade Secret 2.8100 1.0700 243.5522 32.9570 100.0000% 100.0000% 73.9000% 10.0000% Trade Secret 1309-64-4 36.2527 4.2844 11.0000% 1.3000% 9.8871 3.0000% CAS Number Weight by mg PPM 382,828 9,432 275 472 351 6 6 290 35 17 1 1 1 5,109 1,945 442,830 59,923 65,915 0.5109% 0.1945% 44.2830% 5.9923% 6.5915% 0.7790% 7,790 14808-60-7 1333-86-4 Package Weight (mg): 2.6366 549.9901 0.8000% 1.7977% 17,977 4,794 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L % weight of substance per package 38.2828% 0.9432% 0.0275% 0.0472% 0.0351% 0.0006% 0.0006% 0.0290% 0.0035% 0.0017% 0.0001% 0.0001% 0.0001% Page 2 of 11 0.4794% 100.0000 20L -SOIC Pb-Free Package B2. Material Composition (Note 3) Using Green Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Die Wire Adhesive Circuit Interconnect Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary Bismaleimide Proprietary Polymer Methacrylate Acylate ester Organic Peroxide Si Au Silica Phenol Resin Epoxy Resin CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 173.1842 4.2669 0.1245 0.2133 2.1342 0.0384 0.0385 0.1584 %weight of substance per Homogeneo us material 97.4100% 2.4000% 0.0700% 0.1200% 96.5204% 1.7370% 1.7427% 80.0000% 0.0178 Weight by mg % weight of substance per package PPM 314,880 7,758 226 388 3,880 70 70 288 31.4880% 0.7758% 0.0226% 0.0388% 0.3880% 0.0070% 0.0070% 0.0288% 9.0000% 32 0.0032% 0.0099 0.0040 0.0040 5.0000% 2.0000% 2.0000% 18 7 7 0.0018% 0.0007% 0.0007% 0.0040 2.7720 1.1183 325.6613 18.2956 21.9547 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 7 5,040 2,033 592,112 33,265 39,918 0.0007% 0.5040% 0.2033% 59.2112% 3.3265% 3.9918% Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Package Weight (mg): 550.0000 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 3 of 11 100.0000 20L -SOIC Pb-Free Package B3. Material Composition (Note 3) Copper wire using NiPdAu and Halogen-free Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary Bismaleimide Proprietary Polymer Methacrylate Acylate ester Organic Peroxide Si Cu Silica Phenol Resin Epoxy Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 173.1842 4.2669 0.1245 0.2133 2.1341 0.0385 0.0385 0.1584 %weight of substance per Homogeneo us material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 80.0000% 0.0178 Weight by mg % weight of substance per package PPM 314,637 7,752 226 388 3,877 70 70 288 31.4637% 0.7752% 0.0226% 0.0388% 0.3877% 0.0070% 0.0070% 0.0288% 9.0000% 32 0.0032% 0.0099 5.0000% 18 0.0018% Trade Secret Trade Secret Trade Secret 0.0040 0.0040 2.0000% 2.0000% 7 7 0.0007% 0.0007% 0.0040 2.0000% 7 0.0007% 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret 1333-86-4 2.7720 0.5215 326.5721 18.3468 21.0988 0.9173 100.0000% 100.0000% 89.0000% 5.0000% 5.7500% 0.2500% 5,036 947 593,307 33,332 38,332 1,667 0.5036% 0.0947% 59.3307% 3.3332% 3.8332% 0.1667% Trade Secret Package Weight (mg): 550.4266 %Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 4 of 11 100.0000 20L -SOIC Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 5 of 11 20L -SOIC Pb-Free Package ASSEMBLY Site 2: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 113906, 113907, 143703 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ20JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 6 of 11 20L -SOIC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: USING GOLD WIRE Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Die Wire Adhesive Circuit Interconnect Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary Bismaleimide Proprietary Polymer Methacrylate Acylate ester Organic Peroxide Si Au Silica Phenol Resin Epoxy Resin CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 173.1842 4.2669 0.1245 0.2133 2.1342 0.0384 0.0385 0.1584 %weight of substance per Homogeneo us material 97.4100% 2.4000% 0.0700% 0.1200% 96.5204% 1.7370% 1.7427% 80.0000% 0.0178 Weight by mg % weight of substance per package PPM 314,880 7,758 226 388 3,880 70 70 288 31.4880% 0.7758% 0.0226% 0.0388% 0.3880% 0.0070% 0.0070% 0.0288% 9.0000% 32 0.0032% 0.0099 0.0040 0.0040 5.0000% 2.0000% 2.0000% 18 7 7 0.0018% 0.0007% 0.0007% 0.0040 2.7720 1.1183 325.6613 18.2956 21.9547 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 7 5,040 2,033 592,112 33,265 39,918 0.0007% 0.5040% 0.2033% 59.2112% 3.3265% 3.9918% Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Package Weight (mg): 550.0000 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 7 of 11 100.0000 20L -SOIC Pb-Free Package B2: USING COPPER PALLADIUM WIRE Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogeneous 0.0220 0.0045 0.0015 7440-22-4 3.9160 0.8010 0.2670 4.0940 7440-50-8 168.9220 Nickel Silicon Magnesium 7440-02-0 7440-21-3 7439-95-4 Silver Copper Tin 7440-31-5 Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate 7440-22-4 Trade Secret Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 Package Weight (mg): 2.8600 PPM %% Weight of Substance per package 0.0230 7,194 1,471 490 7,521 0.7194% 0.1471% 0.0490% 0.7521% 0.9490 310,319 31.0319% 5,254 0.5254% 291 0.0291% 33 0.0033% 0.0018% 0.0007% 1.0000 0.1584 0.8000 0.0178 0.0099 0.0900 0.0500 0.0040 0.0200 18 7 0.0040 0.0040 2.7720 0.5109 0.0091 10.8000 10.8000 18.0000 319.3200 1.0800 0.0200 0.0200 1.0000 0.9825 0.0175 0.0300 0.0300 0.0500 0.8870 0.0030 7 7 5,092 939 17 19,840 19,840 33,067 586,608 1,984 0.0007% 0.0007% 0.5092% 0.0939% 0.0017% 1.9840% 1.9840% 3.3067% 58.6608% 0.1984% % Total: 100.0000 544.3501 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 8 of 11 20L -SOIC Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 9 of 11 20L -SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 20L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03049 ** *A ECN No. Orig. of Change 385598 GFJ 2264886 HLR *B 2678536 HLR *C 2882692 HLR *D 3290724 MAHA *E *F 3392264 3589011 REYD HLR *G 4007746 UDR *H 4065631 YUM *I 4354901 HLR Description of Change New document Updated Cypress Logo Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition. Added CAS Number for Antimony Trioxide Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table Added Note 4 on Footer Section and added CAS number for Fused Silica. Added CAS number for Crystalline Silica and Carbon Black Added package weight and QTP reference 054502 for B2 of assembly site 1. Added Table B2. NiPdAu using Green Molding Compound to assembly site 1. Added Assembly Site 2 – JCET. Updated the material composition table to reflect 4 decimal places on values on Assembly Site 1 – B1. Added B3 for Assembly Site 1 Added QTP # 125106 at Assembly Site 1 Package Qualification Reports. Added B3. Material Composition - Using Copper Wire using NiPdAu and Halogen-free Mold Compound. Added assembly site name in the assembly heading in site 1 and 2. Changed assembly code to assembly site name in 1 and 2. Removed Tray and End Pin in the Indirect Materials section. Changed the total package weight of Assembly Site 1.B2 and Assembly Site 2 material composition. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 10 of 11 20L -SOIC Pb-Free Package Rev. *J ECN No. Orig. of Change 4498496 REYD *K *L 4743012 5261331 HLR HLR MEL Description of Change Added B2 in Package Weight and QTP# 143703 under Site 2. Updated Material Composition Table under Assembly Site 2-B2. Sunset Due – No Change. Changed the substances with “------------- “ and Proprietary to “Trade Secret Removed distribution and posting from the document history page. Changed Cypress Logo. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-03049 Rev. *L Page 11 of 11