QTP 112105:48 QFN (6X6X0.6 MM), 56 QFN (7X7X0.6 MM), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN

Document No.001-70518 Rev. *C
ECN # 4450627
Cypress Semiconductor
Package Qualification Report
QTP# 112105 VERSION*C
July, 2014
48 QFN (6X6X0.6 mm) /
56 QFN (7X7X0.6 mm)
NiPdAu, MSL3, 260°°C Reflow
ASEK-Taiwan (G)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No.001-70518 Rev. *C
ECN # 4450627
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
112105
Qualification of 48/56QFN 6x6x0.6mm/7x7x0.6mm package
dimensions (LQ48A and LQ56A) at ASEKH (G) using G631 mold
compound and EN-4900 epoxy
Jun 2011
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Document No.001-70518 Rev. *C
ECN # 4450627
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Mold Compound Name/Manufacturer:
LQ48A / LQ56A
48 Quad Flat No-Lead (6x6x0.6mm)/
56 Quad Flat No-Lead (7x7x0.6mm)
G631 / Sumitomo
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index: >28%
54 (typical) / 28 (Min. value)
Lead Frame Designation:
Full Metal Pad
Lead Frame Material:
Copper /PPF
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
SAW Process
Die Attach Supplier:
Hitachi
Die Attach Material:
EN-4900
Bond Diagram Designation
001-69142 /001-69184
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.8mil / Au
Thermal Resistance Theta JA °C/W:
20.6°C/W, 18.69°C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
49-41999
Name/Location of Assembly (prime) facility:
G-ASEK Taiwan
MSL LEVEL
3
REFLOW PROFILE
260C
Package Outline, Type, or Name:
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.001-70518 Rev. *C
ECN # 4450627
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
High Accelerated Saturation Test
(HAST)
Pressure Cooker Test
Temperature Cycle
High Temp Storage
Electrostatic Discharge
Human Body Model (ESD-HBM)
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Acoustic Microscopy
Test Condition (Temp/Bias)
Dynamic Operating Condition, Vcc = 2.07, 150 C
JESD22-A108
Dynamic Operating Condition, Vcc = 2.07V, 150 C
JESD22-A108
JEDEC STD 22-A110, 130 C, 85%RH, 5.25V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
MIL-STD-883, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-A103, 150 C, no bias
Result
P/F
P
P
P
P
P
P
P
Ball Shear
(2200V)
JEDEC EIA/JESD22-A114
(500V)
JESD22-C101
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-B116, Cpk : 1.33, Ppk : 1.66
Bond Pull
MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66
P
Constructional Analysis
Die Shear
Dye Penetrant Test
Criteria: Meet external and internal characteristics of
Cypress package
MIL-STD-883, Method 2019
Per die size:
• <3000 sq. mils = 1.2 kgf
• 30001-5000 sq. mils = 1.2 kgf
• >5001 sq. mils = 1.2 kgf
P
P
P
P
P
P
Internal Visual
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
MIL-STD-883-2014
Final Visual Inspection
JESD22-B101
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Thermal Shock
MIL-STD-883, Method 1011, Condition B, -55 C to 125C and
JESD22-A106, Condition C, -55 C to 125C
Solderability, Steam Aged
J-STD-002, JESD22-B102
P
P
P
95% solder coverage minimum
X-Ray
MIL-STD-883 - 2012
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
P
Document No.001-70518 Rev. *C
ECN # 4450627
Reliability Test Data
QTP #: 112105
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
15
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
15
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
15
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
10
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
10
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
10
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
10
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
10
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
10
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
5
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
5
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
5
0
STRESS: DYE PENETRATION TEST
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
15
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
15
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
15
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
15
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
15
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
15
0
G-TAIWAN
COMP
9
0
COMP
8
0
STRESS: DIE SHEAR
STRESS: ESD-CHARGE DEVICE MODEL, (500V)
CY8C24794 (8C24795A)
5051012
611120647
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No.001-70518 Rev. *C
ECN # 4450627
Reliability Test Data
QTP #: 112105
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
128
80
0
STRESS: HIGH TEMP STORAGE, 150C
CY7C60323 (8C214340A)
4008254
611114333
G-TAIWAN
500
80
0
CY7C60323 (8C214340A)
4008254
611114333
G-TAIWAN
1000
80
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
5
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
5
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.07V, Vcc Core
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
48
1500
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Core
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
500
116
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
168
80
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
288
80
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
168
80
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
288
80
0
STRESS: PHYSICAL DIMENSION
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
30
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
30
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
30
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
3
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
3
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
3
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
200
80
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
1000
80
0
STRESS: SOLDERABILITY
STRESS: THERMAL SHOCK
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No.001-70518 Rev. *C
ECN # 4450627
Reliability Test Data
QTP #: 112105
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
500
80
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
1000
80
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
500
80
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
1000
80
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
500
79
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
1000
79
0
CY8C24794 (8C24795A)
5051012
611120647
G-TAIWAN
COMP
15
0
CY8C24794 (8C24795A)
5051012
611120648
G-TAIWAN
COMP
15
0
CY8CTMA301E5 (8C203135D)
5101114
611120229
G-TAIWAN
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.001-70518 Rev. *C
ECN # 4450627
Document History Page
Document Title:
QTP 112105: 48 QFN (6X6X0.6 MM), 56 QFN (7X7X0.6 MM), NIPDAU, MSL3 260C REFLOW
ASEK- TAIWAN
001-70518
Document Number:
Rev. ECN
No.
**
3283659
*A
3657926
Orig. of
Change
NSR
NSR
*B
4055318 JYF
*C
4450627 JYF
Description of Change
Initial spec release
Sunset Review.
Remove the reference Cypress specs on the reliability test conditions
and replace with the industry standards.
Remove version 1.0 in the QTP# in title page.
Added TCT 1000 Cycles and PCT 288H robustness readpoints.
Sunset Review:
Deleted revisions of ref. Jedec/Military standards in Reliability Tests
Performed table. Revision changes from time to time.
Sunset Review:
Updated QTP title page for template alignment.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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