Document No.001-70706 Rev. *B ECN # 4490355 Cypress Semiconductor Package Qualification Report QTP# 112603 VERSION*B September, 2014 16 QFN (3x3x0.6mm) NiPdAu-Ag, MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-70706 Rev. *B ECN # 4490355 PACKAGE QUALIFICATION HISTORY QTP Number 112603 Description of Qualification Purpose Qualification of 16QFN 3x3x0.6mm (LG16AA) package dimensions at ASEKH (G) using G631 mold compound and FH900 epoxy Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date Jul 2011 Document No.001-70706 Rev. *B ECN # 4490355 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LG16AA Package Outline, Type, or Name: 16 Quad Flat No-Lead/ Chip on Lead (3X3X0.6mm) Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: FH-900 Bond Diagram Designation 001-69245 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 32.69°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-70706 Rev. *B ECN # 4490355 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Test Condition (Temp/Bias) JEDEC STD 22-A110: 130 C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) 150 C, no bias JESD22-A103 (2200V) JEDEC EIA/JESD22-A114 (500V) JESD22-C101 Result P/F P P P P P P J-STD-020 P Ball Shear Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Internal Visual Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C Constructional Analysis Dye Penetrant Test Solderability, Steam Aged J-STD-002, JESD22-B102 P P P P P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P Document No.001-70706 Rev. *B ECN # 4490355 Reliability Test Data QTP #: 112603 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 15 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 15 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 15 0 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 10 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 10 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 10 0 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 10 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 10 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 5 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 5 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 15 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 15 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20236A (8C202662B) 5049067 611123647 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN 128 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-70706 Rev. *B ECN # 4490355 Reliability Test Data QTP #: 112603 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 1000 80 0 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 5 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 5 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN 168 80 0 STRESS: PHYSICAL DIMENSION CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 30 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 30 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 30 0 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 3 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 3 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN 500 80 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN 500 80 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN 500 80 0 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN 200 80 0 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN 1000 80 0 CY8C20236A (8C202662B) 5049067 611123647 G-TAIWAN COMP 15 0 CY8C20236A (8C202662B) 5049067 611123648 G-TAIWAN COMP 15 0 CY8C20236A (8C202662B) 5049067 611123646 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-70706 Rev. *B ECN # 4490355 Document History Page Document Title: Document Number: Rev. ECN No. ** 3240851 *A 4105770 *B QTP 112603: 16 QFN (3X3X0.6MM), NIPDAU-AG, MSL3 260C REFLOW ASEK- TAIWAN 001-70706 Orig. of Change NSR JYF 4490355 JYF Description of Change Initial spec release Sunset Spec Review: Deleted Version 1.0 in QTP title page; Deleted Cypress’ referenced specs in Reliability Tests Performed Table and replaced with industry standards; Sunset Review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7