Document No.001-75450 Rev. *B ECN # 4648768 Cypress Semiconductor Package Qualification Report QTP# 114404 VERSION*B February, 2015 56 QFN(7x7x0.6mm) NiPdAu, Cu-Pd Wire MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-75450 Rev. *B ECN # 4648768 PACKAGE QUALIFICATION HISTORY QTP Number 114404 Description of Qualification Purpose Qualification of Copper (Cu-Pd) wire bond on 56 QFN(7x7x0.6mm) package dimensions at ASE , Kaohsiung Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Jan 2012 Document No.001-75450 Rev. *B ECN # 4648768 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ56A Package Outline, Type, or Name: 56 Quad Flat No-Lead (7X7X0.6mm) Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-69159 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Cu- Pd Thermal Resistance Theta JA °C/W: 28.00°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-70516M Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 8 Document No.001-75450 Rev. *B ECN # 4648768 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Dye Penetrant Test Test Condition (Temp/Bias) JEDEC STD 22-A110: 130°C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-A102: 121°C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-A103:150°C, no bias J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) JESD22-B116 Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack Result P/F P P P P P P P P P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and JESD22-A106, Condition C, -55°C to 125°C P X-Ray MIL-STD-883 - 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 - 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 Document No.001-75450 Rev. *B ECN # 4648768 Reliability Test Data QTP #: 114404 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 15 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 15 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 15 0 CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 15 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 15 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 15 0 STRESS: ELECTRICAL CHARACTERIZATION CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN COMP 30 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN COMP 30 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN 128 80 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN 128 80 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN 128 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-75450 Rev. *B ECN # 4648768 Reliability Test Data QTP #: 114404 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN 1000 80 0 CY8C20466A(8C2046625AK) 5104069 611128981 G-TAIWAN 1000 80 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN 1000 80 0 CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN 168 100 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN 168 100 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN 168 100 0 STRESS: PHYSICAL DIMENSION CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 5 0 611144589 G-TAIWAN COMP 1 0 611144589 G-TAIWAN COMP 1 0 STRESS: POST MSL3 BALL SHEAR CY8C24794(8C24794AC) 4101028 STRESS: POST MSL3 BOND SHEAR CY8C24794(8C24794AC) 4101028 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 1 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 1 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 1 0 COMP 5 0 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-75450 Rev. *B ECN # 4648768 Reliability Test Data QTP #: 114404 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 611144589 G-TAIWAN COMP 5 0 G-TAIWAN COMP 5 0 G-TAIWAN COMP 5 0 STRESS: POST TC BALL SHEAR CY8C24794(8C24794AC) 4101028 STRESS: POST HI-ACCEL SATURATION TEST BOND SHEAR CY8C24794(8C24794AC) 4101028 611144589 STRESS: POST HIGH TEMP STORAGE BOND SHEAR CY8C24794(8C24794AC) 4101028 611144589 STRESS: POST PRESSURE COOKER TEST BOND SHEAR TEST CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 5 0 611144589 G-TAIWAN COMP 5 0 STRESS: POST TC BOND SHEAR CY8C24794(8C24794AC) 4101028 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN 500 220 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN 500 220 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN 500 220 0 4101028 611144589 G-TAIWAN COMP 5 0 CY8C24794(8C24794AC) 4101028 611144589 G-TAIWAN COMP 15 0 CY8C24794(8C24794AC) 4101028 611144725 G-TAIWAN COMP 15 0 CY8C24794(8C24794AC) 4103270 611144588 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK CY8C24794(8C24794AC) STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-75450 Rev. *B ECN # 4648768 Document History Page Document Title: TAIWAN (G) Document Number: Rev. ECN No. ** 3481084 *A 4272218 *B 4648768 QTP 114404: 56QFN (7X7X0.6MM) NIPDAU, CU-PD Wire, MSL3 260C REFLOW ASEK001-75450 Orig. of Change ILZ JYF JYF Description of Change Initial spec release No Change Sunset review: Updated QTP title page and Reliability Tests Performed table (Acoustic, HAST, PCT, HTS, Ball Shear, Bond Pull, CA, DPT, IVI/FVI, Physical Dimension) for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8