QTP 50701 8/14/16-Lead SOIC Package (150 mil) NiPdAu, MSL3 235C 260C Reflow OSE-Taiwan (T).pdf

Document No.001-89465 Rev. *A
ECN # 4516853
Cypress Semiconductor
Package Qualification Report
QTP# 050701VERSION*A
September 2014
8/14/16-Lead SOIC Package (150 mil)
NiPdAu, MSL3
235C & 260C Reflow
OSE-Taiwan (T)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-89465 Rev. *A
ECN # 4516853
PACKAGE QUALIFICATION HISTORY
QUAL
REPORT
DESCRIPTION OF QUALIFICATION PURPOSE
DATE
COMP.
050701
8/14/16-lead (150 mil) SOIC package, NiPdAu Leadfinish, MSL1, 260C Reflow, OSETaiwan Assembly
May 05
050701
Cypress established policy requiring MSL and Reflow Peak Temperature alignment for
Cypress and its Assembly Subcontractors. Downgrade from MSL1 to MSL3
Nov 06
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Document No.001-89465 Rev. *A
ECN # 4516853
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
S16
16-Lead Plastic Small Outline IC Package (SOIC)
Hitachi CEL9220THF
V-O per UL94
Oxygen Rating Index:
None
Lead Frame Material:
Copper base
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrinding
Die Separation Method:
Sawing
Die Attach Supplier:
Hitatchi
Die Attach Material:
EN4900G
Die Attach Method:
Epoxy
Wire Bond Method:
Thermosonic
Wire Material/Size:
1.0mil
Thermal Resistance Theta JA °C/W:
131°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
49-35999M
Name/Location of Assembly (prime) facility:
OSE-Taiwan (T)
MSL Level
3
Reflow Profile
235C & 260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
Cypress Philippines (CML-R)
Note: Please contact a Cypress Representative for other packages availability
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-89465 Rev. *A
ECN # 4516853
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition
(Temp/Bias)
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity MSL 1
Pressure Cooker
121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity MSL 1
Result
P/F
P
168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C
P
168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C
High Accelerated Saturation Test
(HAST)
130°C, 3.3V, 85%RH
Precondition: JESD22 Moisture Sensitivity MSL 1
P
168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C
Acoustic Microscopy
J-STD-020
P
Adhesion of Lead Finish
MIL-STD-883, Method 2025
P
Ball Shear
JESD22-B116A
P
Bond Pull
MIL-STD-883 – Method 2011
P
External Visual
MIL-PRF-38535, MILSTD-883, METHOD 2009
P
Internal Visual
MIL-STD-883-2014
P
Lead Integrity
JESD22-B105, MIL STD 883
P
Physical Dimensions
MIL-STD-1835, JESD22-B100
P
Solderability
J-STD-002, JESD22-B102
P
SEM X-Section
MIL-STD-883, Method 883-2018-2
P
Wetting Balance
Mil-Std-883F Method 2022.2
P
X-Ray
MIL-STD-883C, Method 2012
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
Document No.001-89465 Rev. *A
ECN # 4516853
Reliability Test Data
QTP #:050701
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
COMP
15
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
COMP
15
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
COMP
15
0
STRESS:
STRESS:
Rej
ACOUSTIC , MSL1
ADHESION OF LEAD FINISH
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
COMP
3
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
COMP
3
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
COMP
3
0
8410347
610421810
TAIWAN-T
COMP
10
0
8410347
610421810
TAIWAN-T
COMP
10
0
W W129AGT (W129DF)
8410347
610421810
TAIWAN-T
COMP
15
0
129AGT (W129DF)
8410347
610421811
TAIWAN-T
COMP
15
0
8410347
610421810
TAIWAN-T
COMP
3
0
8410347
610421810
TAIWAN-T
COMP
3
0
STRESS:
BALL SHEAR
W129AGT (W129DF)
STRESS:
BOND PULL
W129AGT (W129DF)
STRESS:
STRESS:
Failure Mechanism
EXTERNAL VISUAL
INTERNAL VISUAL
W129AGT (W129DF)
STRESS: LEAD INTEGRITY
W129AGT (W129DF)
STRESS:
PHYSICAL DIMENSIONS
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
COMP
5
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
COMP
5
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
COMP
5
0
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
COMP
3
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
COMP
3
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
COMP
3
0
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
COMP
5
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
COMP
5
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
COMP
5
0
STRESS:
SOLDERABILITY
STRESS: SEM X-SECTION
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-89465 Rev. *A
ECN # 4516853
Reliability Test Data
QTP #:050701
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
Failure Mechanism
HI-ACCEL SATURATION TEST, 130C, 3.3V, 85%RH, PRE COND 168 HR 85C/85%RH, MSL 1
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
128
47
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
128
48
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1
W129AGT (W129DF)
STRESS:
8410347
610421810
TAIWAN-T
168
50
0
TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH, MSL1
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
300
50
0
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
1000
50
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
300
50
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
1000
50
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
300
50
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
1000
50
0
W129AGT (W129DF)
8410347
610421810
TAIWAN-T
COMP
5
0
W129AGT (W129DF)
8410347
610421811
TAIWAN-T
COMP
5
0
W129AGT (W129DF)
8410347
610421812
TAIWAN-T
COMP
5
0
8410347
610421810
TAIWAN-T
COMP
15
0
STRESS:
STRESS:
WETTING BALANCE
X-RAY
W129AGT (W129DF)
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-89465 Rev. *A
ECN # 4516853
Document History Page
Document Title: QTP#050701:8/14/16-Lead SOIC Package (150 mil) NiPdAu, MSL3 235C & 260C Reflow OSE-Taiwan
(T)
Document Number: 001-89465
Rev. ECN
Orig. of
No.
Change
**
4142063 HSTO
*A
4516853 HSTO
Description of Change
Initial Spec Release
Initiate report as per memo LGQ-622.
Align qualification report based on the new template in the front page
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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