Document No. 002-11529 Rev. ** ECN #: 5164534 Cypress Semiconductor Package Qualification Report QTP# 152602 VERSION ** March 2016 100L TQFP (14x20x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Sr. Reliability Engineer Reviewed By: Rene Rodgers (RT) Sr. MTS Reliability Engineer Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No. 002-11529 Rev. ** ECN #: 5164534 PACKAGE QUALIFICATION HISTORY QTP Number 152602 Description of Qualification Purpose Qualification of 100L TQFP (14x20x1.4mm) at ASEK-Taiwan (G) using G631 Mold Compound, CRM1076 Die Attach Epoxy, Pure Sn Leadfinish, 0.8 mil CuPd Wire at MSL 3, 260°C reflow temperature Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date Oct. 2015 Document No. 002-11529 Rev. ** ECN #: 5164534 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ0AA Package Outline, Type, or Name: 100L-Thin Quad Flat Package (14x20x1.4mm) Mold Compound Name/Manufacturer: G631/Sumitomo Mold Compound Flammability Rating: V-0 per UL94 Mold Compound Alpha Emission Rate: 0.001 (low alpha mold compound) Oxygen Rating Index: 54% Lead Frame Designation: Slotted Full Metal Pad (FMP) Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer saw Die Attach Supplier: Sumitomo Die Attach Material: CRM1076 Die Attach Method: Epoxy Bond Diagram Designation: 001-98412 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8 mil Thermal Resistance Theta JA °C/W: 37.95 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 002-09793 Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No. 002-11529 Rev. ** ECN #: 5164534 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Ball Shear JESD22-B116 P Bond Pull JESD22-B116 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Dye Penetrant Test MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack High Accelerated Saturation Test (HAST) JESD22-A110, 130C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P High Temperature Storage Life JESD22-A103, 150C P Internal Visual MIL-STD-883-2014 P Die Shear Pressure Cooker Temperature Cycle X-Ray JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P P P P Document No. 002-11529 Rev. ** ECN #: 5164534 Reliability Test Data QTP #: Device 152602 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN COMP 15 0 CY7C1383KVE33 (7CP1383K) 9527002 611529845 G-TAIWAN COMP 15 0 CY7C1370KV33 (7CP1370K) 9527002 611529844 G-TAIWAN COMP 15 0 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN COMP 24 0 CY7C1383KVE33 (7CP1383K) 9527002 611529845 G-TAIWAN COMP 24 0 CY7C1370KV33 (7CP1370K) 9527002 611529844 G-TAIWAN COMP 24 0 CY7C1370KE33 (7CP1376K) 9527002 611526472 G-TAIWAN COMP 24 0 CY7C1372KV33 (7CP1377K) 9527002 611526473 G-TAIWAN COMP 24 0 CY7C1381KE33 (7CP1381K) 9527002 611526474 G-TAIWAN COMP 24 0 CY7C13709KV25 (7CP13709K) 9527002 611526471 G-TAIWAN COMP 24 0 CY7C1383KE33 (7CP1383K) 9527002 611526475 G-TAIWAN COMP 24 0 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN COMP 24 0 CY7C1383KVE33 (7CP1383K) 9527002 611529845 G-TAIWAN COMP 24 0 CY7C1370KV33 (7CP1370K) 9527002 611529844 G-TAIWAN COMP 24 0 CY7C1370KE33 (7CP1376K) 9527002 611526472 G-TAIWAN COMP 24 0 CY7C1372KV33 (7CP1377K) 9527002 611526473 G-TAIWAN COMP 24 0 CY7C1381KE33 (7CP1381K) 9527002 611526474 G-TAIWAN COMP 24 0 CY7C13709KV25 (7CP13709K) 9527002 611526471 G-TAIWAN COMP 24 0 CY7C1383KE33 (7CP1383K) 611526475 G-TAIWAN COMP 24 0 9527002 611526357 G-TAIWAN COMP 5 0 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN COMP 4 0 CY7C1383KVE33 (7CP1383K) 9527002 611529845 G-TAIWAN COMP 4 0 CY7C1370KV33 (7CP1370K) 9527002 611529844 G-TAIWAN COMP 4 0 CY7C1370KE33 (7CP1376K) 9527002 611526472 G-TAIWAN COMP 4 0 Failure Mechanism STRESS: ACOUSTICS STRESS: BALL SHEAR STRESS: BOND PULL 9527002 STRESS: CONSTRUCTIONAL ANALYSIS CY7C1370KVE33 (7CP1376K) STRESS: DIE SHEAR Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 7 Document No. 002-11529 Rev. ** ECN #: 5164534 Reliability Test Data QTP #: Device 152602 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN COMP 15 0 CY7C1383KVE33 (7CP1383K) 9527002 611529845 G-TAIWAN COMP 15 0 CY7C1370KV33 (7CP1370K) 9527002 611529844 G-TAIWAN COMP 15 0 Failure Mechanism STRESS: DYE PENETRANT STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 96 25 0 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 192 25 0 STRESS: HIGH TEMPERATURE STORAGE CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 500 78 0 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 1000 78 0 9527002 611526357 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL CY7C1370KVE33 (7CP1376K) STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 168 80 0 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 288 80 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 500 80 0 CY7C1370KVE33 (7CP1376K) 9527002 611526357 G-TAIWAN 1000 80 0 CY7C1383KVE33 (7CP1383K) 9527002 611529845 G-TAIWAN 500 79 0 CY7C1370KV33 (7CP1370K) 9527002 611529844 G-TAIWAN 500 80 0 9527002 611526357 G-TAIWAN COMP 15 0 STRESS: X-RAY CY7C1370KVE33 (7CP1376K) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No. 002-11529 Rev. ** ECN #: 5164534 Document History Page Document Title: Document Number: QTP#152602: 100L TQFP (14X20X1.4MM) PURE SN LEADFINISH, CUPD WIRE, MSL3, 260C REFLOW, ASEK-TAIWAN (G) 002-11529 Rev. ECN Orig. of No. Change ** 5164534 JYF Description of Change Initial spec release. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7