Document No.001-75588 Rev. *A ECN # 4656924 Cypress Semiconductor Package Qualification Report QTP# 114904 VERSION *A February 2015 40 QFN (6x6x1.0mm) NiPdAu, 100% Cu Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-75588 Rev. *A ECN # 4656924 PACKAGE QUALIFICATION HISTORY QTP Number 114904 Description of Qualification Purpose Qualification of Copper wire bond on 40 QFN 6x6x1mm package dimensions (LT40A) at ASEKH (G) using G631 mold compound and EN4900 Date Jan 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-75588 Rev. *A ECN # 4656924 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT40A Package Outline, Type, or Name: 40 Quad Flat Not Lead (QFN) 6x6x1mm Package Dimension Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN4900 Bond Diagram Designation 001-68161 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Cu Thermal Resistance Theta JA C/W: 21.2°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999M Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: KY Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-75588 Rev. *A ECN # 4656924 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F 130 C, 85%RH, 3.03V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 150 C, no bias P P Ball Shear J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-B116A, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Pressure Cooker Test Temperature Cycle High Temp Storage Acoustic Microscopy P P P P Internal Visual Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged J-STD-002, JESD22-B102 95% solder coverage minimum P Constructional Analysis Dye Penetrant Test MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and P P P P Thermal Shock JESD22-A106B, Condition C, -55 C to 125C X-Ray MIL-STD-883 - 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 - 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 Document No.001-75588 Rev. *A ECN # 4656924 Reliability Test Data QTP #: 114904 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 15 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 15 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 15 0 CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 15 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 15 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 15 0 STRESS: ELECTRICAL CHARACTERIZATION CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN COMP 30 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN COMP 30 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.03V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN 128 78 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN 128 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-75588 Rev. *A ECN # 4656924 Reliability Test Data QTP #: 114904 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN 1000 80 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN 1000 80 0 CY8C20466A (8C2046625AK) 5104069 611128980 G-TAIWAN 1000 80 0 CY8C20466A (8C2046625AK) 5104069 611128981 G-TAIWAN 1000 80 0 CY8CTMA301E (8C20313DC) 4102579 611121438 G-TAIWAN 1000 80 0 CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN 168 120 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN 168 120 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN 168 120 0 STRESS: PHYSICAL DIMENSION CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 5 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 5 0 611144730 G-TAIWAN COMP 3 0 611144730 G-TAIWAN COMP 3 0 G-TAIWAN COMP 15 0 STRESS: POST MSL3 BALL SHEAR CYRF6986 (7B6936B) 4022630 STRESS: POST MSL3 BOND PULL CYRF6986 (7B6936B) 4022630 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CYRF6986 (7B6936B) 4022630 611144730 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN 128 5 0 STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8C20466A (8C2046625AK) 5104069 611128980 G-TAIWAN 1000 5 0 CY8CTMA301E (8C20313DC) 4102579 611121438 G-TAIWAN 1000 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-75588 Rev. *A ECN # 4656924 Reliability Test Data QTP #: 114904 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN 168 5 0 611144730 G-TAIWAN 500 5 0 STRESS: POST TC BALL SHEAR CYRF6986 (7B6936B) 4022630 STRESS: POST HIGH TEMP STORAGE BOND PULL CY8C20466A (8C2046625AK) 5104069 611128980 G-TAIWAN 1000 5 0 CY8CTMA301E (8C20313DC) 4102579 611121438 G-TAIWAN 1000 5 0 128 5 0 STRESS: POST HI-ACCEL SATURATION TEST BOND PULL CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN STRESS: POST PRESSURE COOKER TEST BOND PULL TEST CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN 168 5 0 611144730 G-TAIWAN 500 5 0 STRESS: POST TC BOND PULL CYRF6986 (7B6936B) 4022630 STRESS: SOLDERABILITY TEST CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 3 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 3 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 3 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN 500 120 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN 500 126 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN 500 125 0 4125006 611145342 G-TAIWAN 200 92 0 CYRF6986 (7B6936B) 4022630 611144730 G-TAIWAN COMP 15 0 CYRF6986 (7B6936B) 4125006 611145342 G-TAIWAN COMP 15 0 CYRF6986 (7B6936B) 4125006 611145344 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK CYRF6986 (7B6936B) STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-75588 Rev. *A ECN # 4656924 Document History Page Document Title: TAIWAN (G) Document Number: Rev. ECN No. ** 3490665 *A 4656924 QTP 114904: 40 QFN (6X6X1.0MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW ASEK001-75588 Orig. of Change NSR HSTO Description of Change Initial spec release Align qualification report based on the new template in the front page Removed reference Cypress spec in the reliability test performed table and replaced with industry standard reference Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8