QTP#144405 - 56L QFN (7X7X0.6MM) PURE SN, CUPD WIRE MSL3, 260C REFLOW, ASE-TAIWAN(G).pdf

Document No.001-97305 Rev. **
ECN # 4733346
Cypress Semiconductor
Package Qualification Report
QTP# 144405 VERSION**
May, 2015
56L QFN (7x7x0.6mm)
Pure Sn Leadfinish, CuPd Wire
MSL3, 260C Reflow
ASE-Taiwan (G)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda (JYF)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Manager
Approved By:
Don Darling (DCDA)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-97305 Rev. **
ECN # 4733346
PACKAGE QUALIFICATION HISTORY
QTP
Number
144405
Description of Qualification Purpose
Qualification of PSoC4A-BLE in 56 QFN (7x7x0.6mm) at ASE-Taiwan (G) using
EME-G700LA Mold Compound, EN-4900F Die Attach Epoxy, Pure Sn Leadfinish,
0.8 mil CuPd Wire at MSL 3, 260°C Reflow Temperature
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Date
April 2015
Document No.001-97305 Rev. **
ECN # 4733346
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
LQ56A
56 Quad Flat No-Lead (7x7x0.6mm)
EME-G700LA/Sumitomo
UL-94 V0
Oxygen Rating Index:
54%
Leadframe Material:
Copper
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Saw
Die Attach Supplier:
Hitachi
Die Attach Material:
EN-4900F
Bond Diagram Designation:
001-94504
Wire Bond Method:
Thermosonic
Wire Material/Size:
CuPd, 0.8 mil
Thermal Resistance Theta JA °C/W:
16.9°C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
49-41999
Name/Location of Assembly (prime) facility:
ASE-Taiwan (G)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST/FINISH DESCRIPTION
Test Location
CML-RA
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-97305 Rev. **
ECN # 4733346
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
Acoustic Microscopy
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Ball Shear
JESD22-B116
P
Bond Pull
MIL-STD-883 – Method 2011
P
Cross Section
Meets Cypress requirements
P
Dye Penetrant Test
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
P
Final Visual
JESD22-B101
P
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110: 130°C, 85%RH, 5.5V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Internal Visual
MIL-STD-883-2014
P
Pressure Cooker
JESD22-A102: 121C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
Temperature Cycle
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow)
P
X-Ray
MIL-STD-883 - 2012
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
Document No.001-97305 Rev. **
ECN # 4733346
Reliability Test Data
QTP #: 144405
Device
Fab Lot #
Assy Lot #
Ass Loc
Duration
Samp
Rej Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C4247LQI (8CP42478A)
4430358
611441948
G-TAIWAN
COMP
80
0
CY8C4247LQI (8CP42478A)
4440150
611443939
G-TAIWAN
COMP
80
0
CY8C4247LQI (8CP42478A)
4440150
611443938
G-TAIWAN
COMP
78
0
4430358
611441948
G-TAIWAN
COMP
10
0
4430358
611441948
G-TAIWAN
COMP
10
0
CY8C4247LQI (8CP42478A)
4430358
611441948
G-TAIWAN
COMP
5
0
CY8C4247LQI (8CP42478A)
4440150
611443939
G-TAIWAN
COMP
5
0
CY8C4247LQI (8CP42478A)
4440150
611443938
G-TAIWAN
COMP
5
0
STRESS: BALL SHEAR
CY8C4247LQI (8CP42478A)
STRESS: BOND PULL
CY8C4247LQI (8CP42478A)
STRESS: CROSS SECTION
STRESS: DYE PENETRANT TEST
CY8C4247LQI (8CP42478A)
4430358
611441948
G-TAIWAN
COMP
15
0
CY8C4247LQI (8CP42478A)
4440150
611443939
G-TAIWAN
COMP
15
0
CY8C4247LQI (8CP42478A)
4440150
611443938
G-TAIWAN
COMP
15
0
4430358
611441948
G-TAIWAN
COMP
457
0
STRESS: FINAL VISUAL
CY8C4247LQI (8CP42478A)
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3
CY8C4247LQI (8CP42478A)
4440150
611443939
G-TAIWAN
96
28
0
4430358
611441948
G-TAIWAN
COMP
5
0
STRESS: INTERNAL VISUAL
CY8C4247LQI (8CP42478A)
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY8C4247LQI (8CP42478A)
4440150
611443939
G-TAIWAN
168
80
0
CY8C4247LQI (8CP42478A)
4440150
611443938
G-TAIWAN
168
80
0
CY8C4247LQI (8CP42478A)
4449923
611505289
G-TAIWAN
168
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-97305 Rev. **
ECN # 4733346
Reliability Test Data
QTP #: 144405
Device
Fab Lot #
Assy Lot #
Ass Loc
Duration
Samp
Rej Failure Mechanism
STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CY8C4247LQI (8CP42478A)
4440150
611443939
G-TAIWAN
500
80
0
CY8C4247LQI (8CP42478A)
4440150
611443939
G-TAIWAN
1000
80
0
CY8C4247LQI (8CP42478A)
4440150
611443938
G-TAIWAN
500
79
0
CY8C4247LQI (8CP42478A)
4440150
611443938
G-TAIWAN
1000
79
0
CY8C4247LQI (8CP42478A)
4449923
611505289
G-TAIWAN
500
80
0
CY8C4247LQI (8CP42478A)
4449923
611505289
G-TAIWAN
1000
80
0
4430358
611441948
G-TAIWAN
COMP
15
0
STRESS: X-RAY
CY8C4247LQI (8CP42478A)
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-97305 Rev. **
ECN # 4733346
Document History Page
Document Title:
QTP# 144405: 56L QFN (7X7X0.6MM) PURE SN, CUPD WIRE MSL3, 260C REFLOW, ASETAIWAN (G)
001-97305
Document Number:
Rev. ECN
Orig. of
No.
Change
**
4733346 JYF
Description of Change
Initial spec release.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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