Document No. 001-68152 Rev. *A ECN #4364914 Cypress Semiconductor Automotive Package Qualification Report QTP# 105210 VERSION *A April 2014 Automotive 28L TSOP (8x13.4mm) NiPdAu, MSL3, 235C Reflow JCET-China (JT) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Lorena R. Zapanta (ILZ) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro(RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No. 001-68152 Rev. *A ECN #4364914 PRODUCT QUALIFICATION HISTORY QTP Number 105202 105210 Description of Qualification Purpose New Assembly Site (JCET) Qual – Automotive TSOP 28ld_8 x 13.4 mm body – Pb-free (KEG6000, QMI 509, 1.0 mil Wire, NiPdAu) New Assembly Site (JCET) Qual – Automotive TSOP 28ld_8 x 13.4 mm body – Standard (KEG6000, QMI 509,1.0 mil Wire, NiPdAu) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Date Feb 2011 Feb 2011 Document No. 001-68152 Rev. *A ECN #4364914 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: ZT28R Package Outline, Type, or Name: 28L TSOP (8x13.4mm) Mold Compound Name/Manufacturer: KEG6000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: 0.002 CPH/cm2 Oxygen Rating Index: >28% N/A Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafersaw Die Attach Supplier: Henkel Die Attach Material: QMI509 Bond Diagram Designation 10-06591, 10-06589 Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil / Au Thermal Resistance Theta JA C/W: N/A Package Cross Section Yes/No: Yes Assembly Process Flow: 001-67698/001-6769 Name/Location of Assembly (prime) facility: JT-JCET China MSL LEVEL 3 REFLOW PROFILE 235C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 9 Document No. 001-68152 Rev. *A ECN #4364914 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Latch-up Sensitivity High Temperature Operating Life Early Failure Rate AEC-Q100-002 P AEC-Q100-011 P AEC-Q100-004 AEC-Q100-008 and JESD22-A108, 150 C Dynamic Operating Condition, Vcc = 5.75V P High Temperature Operating Life Latent Failure Rate JESD22-A108, 150 C /125C Dynamic Operating Condition, Vcc = 5.75V,150C P High Accelerated Saturation Test (HAST) JESD22-A110,130 C, 85%RH, 3.63V Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A103, 150 C P JESD22- A104, -65 C to 150 C Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) Mil-Std 883, Method 2011 P P Wire Bond Shear JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) AEC Q100-001 Wire Bond Pull Mil-Std 883, Method 2011 P Solderability JESD22-B102 P Physical Dimensions JESD22B100 and B108 P Electrical Distributions AEC Q100-009 P Lead Integrity JESD22-B105 P High Temperature Storage Life Test Temperature Cycle Post Temperature Cycle Wire Bond Pull Pressure Cooker Test Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 9 P P P P Document No. 001-68152 Rev. *A ECN #4364914 Reliability Test Data QTP #: 105202 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 22 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 22 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 22 0 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 30 0 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 30 0 611060243 JT-CHINA COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BOND SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY62256VLL (7A622574NDC) 4040361 STRESS: DYE PENETRATION TEST CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 15 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 15 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 15 0 JT-CHINA COMP 3 0 JT-CHINA COMP 3 0 JT-CHINA COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, 250V CY62256VLL (7A622574NDC) 4040361 611060243 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY62256VLL (7A622574NDC) 4040361 611060243 STRESS: ESD-CHARGE DEVICE MODEL, 750V CY62256VLL (7A622574NDC) 4040361 611060243 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 9 Document No. 001-68152 Rev. *A ECN #4364914 Reliability Test Data QTP #: 105202 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (500V) CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 3 0 COMP 3 0 COMP 3 0 COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1000V) CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1500V) CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (2000V) CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 5.75V, Vcc Core CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA 48 799 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA 48 798 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA 48 799 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 5.75V, Vcc Core CY62256NLL (7A62256ZEC) 4013150 611057996 JT-CHINA 408 79 0 CY62256VNLL (7A622574NDC) 4037633 611057997 JT-CHINA 408 80 0 CY62256VNLL (7A622574NDC) 4037633 611058668 JT-CHINA 408 80 0 JT-CHINA COMP 6 0 STRESS: STATIC LATCH-UP TESTING, 125C, +/-140Ma CY62256VLL (7A622574NDC) 4040361 611060243 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA 96 80 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA 96 80 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA 96 80 0 611060243 JT-CHINA 1000 80 0 STRESS: HIGH TEMP STORAGE CY62256VLL (7A622574NDC) 4040361 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 6 of 9 Document No. 001-68152 Rev. *A ECN #4364914 Reliability Test Data QTP #: 105202 Device Fab Lot # Assy Lot # Assy Loc 4040361 611060243 Duration Samp Rej Failure Mechanism STRESS: LEAD INTEGRITY CY62256VLL (7A622574NDC) JT-CHINA COMP 5 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA 96 80 0 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA 168 80 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA 96 80 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA 168 80 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA 96 80 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA 168 80 0 STRESS: PHYSICAL DIMENSION CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 30 0 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 30 0 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 15 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 15 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 15 0 STRESS: DIE SHEAR STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No. 001-68152 Rev. *A ECN #4364914 Reliability Test Data QTP #: 105202 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA 500 87 0 CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA 1000 82 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA 500 79 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA 1000 79 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA 500 80 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA 1000 80 0 4040361 611060243 JT-CHINA COMP 5 0 STRESS: POST TC BOND PULL CY62256VLL (7A622574NDC) STRESS: ELECTRICAL DISTRIBUTIONS CY62256VLL (7A622574NDC) 4040361 611060243 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611058006 JT-CHINA COMP 30 0 CY62256NLL (7A622574NDC) 4013150 611057998 JT-CHINA COMP 30 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No. 001-68152 Rev. *A ECN #4364914 Document History Page Document Title: Qualification Report Document Number: Rev. ECN No. ** 3178043 *A 4364914 QTP 105210: Automotive 28L TSOP (8x13.4mm) NiPdAu, MSL3, 235C Reflow JCET-China (JT) 001-68152 Orig. of Change NRG ILZ Description of Change Initial Spec Release Sunset spec review Updated front page to reflect new qualification report template per Spec 001-57717 Page 3 – Major package information table – Replaced assembly process flow spec# 001-64159 with 001-67698/001-67699 Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9