QTP# 144001:Automotive PSoC4A Device Family, S8PF-10P Technology, Fab 4.pdf

Document No. 002-10599 Rev. *A
ECN #: 5310650
Cypress Semiconductor Automotive
Product Qualification Report
QTP# 144001 VERSION *A
June 2016
Automotive PSoC4A Device Family
S8PF-10P Technology, Fab4
CY8C4124
CY8C4125
CY8C4244
CY8C4245
AUTOMOTIVE PROGRAMMABLE
SYSTEM-ON-CHIP (PSOC(R))
FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] :
OR VIA LINK A CYLINK CRM CASE
Prepared By:
Josephine Pineda (JYF)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Engineer MTS
Approved By:
Don Darling (DCDA)
Reliability Director
Company Confidential
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Page 1 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
PRODUCT QUALIFICATION HISTORY
QTP
Number
144001
Description of Qualification Purpose
Qualification of Automotive PSoC4A Device S8PF-10P Technology in CMI (Fab4)
Company Confidential
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Page 2 of 13
Date
Dec 15
Document No. 002-10599 Rev. *A
ECN #: 5310650
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: Qualify Automotive PSoC4A Device S8PF-10P Technology in CMI (Fab 4)
CY8C4124, CY8C4125, CY8C4244, CY8C4245
Marketing Part #:
Device Description:
Automotive PSOC Programmable System – On – Chip
Cypress Division:
Cypress Semiconductor Corporation – Programmable Systems Division (PSD)
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number of Metal Layers:
5
Metal
Metal 1: 100A Ti / 3200A Al 0.5%Cu / 300A TiW
Composition: Metal 2: 100A Ti / 3200A Al 0.5%Cu / 350A TiW
Metal 3: 150A Ti / 7200A AI 0.5%Cu / 350A TiW
Metal 4: 150A Ti / 7200A Al 0.5%Cu / 350A TiW
Metal 5: 300A Ti / 12000A Al 0.5%Cu / 300A TiW
Passivation Type and Materials:
Generic Process Technology/Design Rule ( -drawn):
Gate Oxide Material/Thickness (MOS):
Name/Location of Die Fab (prime) Facility:
Die Fab Line ID/Wafer Process ID:
NFUSOX/ Nitride
S8PF-10P
SiO2 / 32A/120A
CMI / Minnesota
Fab 4, S8PF-10P
PACKAGE AVAILABILITY
PACKAGE
ASSEMBLY FACILITY SITE
QTP NUMBER
28-Lead SSOP
CML-RA
144202
Company Confidential
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Page 3 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
SP282
Package Outline, Type, or Name:
28L- SSOP Package (209mils)
Mold Compound Name/Manufacturer:
KEG3000 / Kyocera
Mold Compound Flammability Rating:
V-O per UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index:
70%
Lead Frame Designation:
Pre-plated with slot design
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAuAg (Roughened)
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Wafer saw
Die Attach Supplier:
Henkel
Die Attach Material:
QMI 509
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-93568
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au / 0.8mil
Thermal Resistance Theta JA °C/W:
61.10 C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
001-93568
Name/Location of Assembly (prime) facility:
CML-RA
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA, CML-R
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
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Page 4 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
Endurance /High Temperature
Operating Life Latent Failure Rate
High Accelerated Saturation Test
(HAST)
Temperature Cycle
Pressure Cooker
Test Condition
(Temp/Bias)
AEC-Q100-008 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.34V
JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.34V
AEC-Q100-005 and JESD22-A108, 150°C
Dynamic Operating Condition, Vcc Max = 2.34V
JESD22-A110, 130C, 5.5V, 85%RH
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30 C, 60% RH, 260 C Reflow)
JESD22-A104, -65 C to 150 C
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30 C, 60% RH, 260 C Reflow)
JESD22-A102, 121C, 100%RH, 15 Psig
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
(192 Hrs., 30 C, 60% RH, 260 C Reflow)
Result
P/F
P
P
P
P
P
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
AEC-Q100-002
500V/1000V/1500V/2000V/4000V/6000V
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
AEC-Q100-011
250V/500V/ 750V (corner pins)
P
Wire Ball Shear
AEC-Q100-001
P
Wire Bond Pull
Mil-Std 883, Method 2011
P
Electrical Distribution
AEC-Q100-009
P
Endurance/Data Retention
AEC-Q100-005, 150 C, non-biased
P
Final Visual
JESD22-B101
P
High Temperature Storage Life
JESD22-A103, 150 C
P
Solderability
JESD22-B102
P
Acoustic Microscopy
JEDEC JSTD-020
P
Static Latch-up
AEC-Q100-004, 85C, 140mA
P
Mil-Std 883, Method 2011
P
Constructional Analysis
Criteria: Meet external and internal characteristics
of Cypress package
P
Dye Penetrant Test
Criteria: No Package Crack
P
Post Temperature Cycle Wire
Bond Pull
Company Confidential
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Page 5 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life Early
Failure Rate
NVM Endurance / High Temperature
Operating Life1,2 Long Term Failure Rate
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
AF3
Failure
Rate
10, 189 Devices
0
N/A
N/A
0 PPM
179,520 Device Hours
0
0.7
170
30 FIT
1
Assuming an ambient temperature of 55 C and a junction temperature rise of 15 C.
Chi-squared 60% estimations used to calculate the failure rate..
3
Thermal Acceleration Factor is calculated from the Arrhenius equation
2
AF = exp
EA
k
1
-
1
T2 T1
where:
EA =The Activation Energy of the defect mechanism.
K = Boltzmann’s constant = 8.62x10-5 Ev/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at
use conditions.
Company Confidential
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Page 6 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
Reliability Test Data
QTP #:
Device
144001
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
22
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
22
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
22
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
COMP
30
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
COMP
30
0
4407790
611507486
CML-RA
COMP
5
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
15
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
15
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
15
0
Failure Mechanism
STRESS: ACOUSTICS
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C4245PVA (8A44200BC)
STRESS: DYE PENETRANT
STRESS: ELECTRICAL DISTRIBUTION
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
30
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
30
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.34V, Vcc Max
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
48
412
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
48
2527
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
48
969
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
48
2735
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
48
860
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
48
2686
0
Company Confidential
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Page 7 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
Reliability Test Data
QTP #:
Device
Fab Lot #
Assy Lot #
Assy Loc
144001
Duration
Samp
Rej
Failure Mechanism
STRESS: ENDURANCE / DATA RETENTION TEST
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
1000
78
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
1000
79
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
1000
79
0
STRESS: ENDURANCE / HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
408
75
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
408
75
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
408
73
0
STRESS: ESD-CHARGE DEVICE MODEL
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
250
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
750
3
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
1000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
2000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
4000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
6000
3
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
1400
0
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
2800
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
1400
0
CY8C4245PVS (8A44200BC)
4405548
611507318
CML-RA
COMP
2800
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
1400
0
CY8C4125PVS (8A44200BC)
4424970
611507320
CML-RA
COMP
2800
0
STRESS: FINAL VISUAL
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
96
77
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
96
76
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
96
77
0
Company Confidential
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Page 8 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
Reliability Test Data
QTP #:
Device
Fab Lot #
Assy Lot #
Assy Loc
611423519
CML-RA
144001
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMPERATURE STORAGE
CY8C4245PVA (8A44200BC)
4407790
1000
80
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
408
75
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
408
75
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
408
73
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
96
78
0
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
168
78
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
96
78
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
168
78
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
96
78
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
168
78
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
96
80
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
96
80
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
96
80
0
STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
5
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
5
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
500
5
0
STRESS: PRE /POST LFR CRITICAL PARAMETER
CY8C4245PVA (8A44200BC)
4407790
611507487
CML-RA
COMP
30+2
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
30+2
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
30+2
0
CML-RA
COMP
6
0
STRESS: STATIC LATCH-UP TESTING, (+/-140Ma 85C)
CY8C4245PVA (8A44200BC)
4407790
611507486
Company Confidential
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Page 9 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
Reliability Test Data
QTP #:
Device
144001
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
COMP
15
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
COMP
15
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
COMP
15
0
Failure Mechanism
STRESS: SOLDERABILITY
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611423519
CML-RA
1000
80
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611423646
CML-RA
1000
85
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611423520
CML-RA
1000
85
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
500
85
0
CY8C4245PVA (8A44200BC)
4407790
611507486
CML-RA
1000
80
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
500
85
0
CY8C4245PVS (8A44200BC)
4405548
611507317
CML-RA
1000
80
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
500
85
0
CY8C4125PVS (8A44200BC)
4424970
611507319
CML-RA
1000
85
0
Company Confidential
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Page 10 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
Reliability Test Data
ER #: 162021
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max
CY8C4245PVS (844200BC)
4405548
611507487
CML-RA
408
123
0
Company Confidential
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Page 11 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
Reliability Test Data
ER #: 162036
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max
CY8C4245PVS (844200BC)
4405548
611507318
CML-RA
408
94
0
Company Confidential
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Page 12 of 13
Document No. 002-10599 Rev. *A
ECN #: 5310650
Document History Page
Document Title:
Document Number:
Rev. ECN No.
**
*A
5071108
5310650
QTP# 144001: Automotive PSoC4A Device Family, S8PF-10P Technology, Fab 4
002-10599
Orig. of
Change
JYF
HSTO
Description of Change
Initial spec release
Added ER162021 and ER162036 LFR result
Re-computed Device hours and FIT Rate
Company Confidential
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Page 13 of 13
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