QTP 150416:Automotive 44L TSOP (400MIL) NIPDAU Lead Finish, AU WIRE MSL3, 260C Reflow JCET-CHINA (JT).pdf

Document No.002-03893 Rev. **
ECN # 4949578
Cypress Semiconductor Automotive
Package Qualification Report
QTP# 150416 VERSION **
October 2015
44L TSOP (400mil)
NiPdAu leadfinish, Au Wire
MSL3, 260C Reflow
JCET-China (JT)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 10
Document No.002-03893 Rev. **
ECN # 4949578
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
150416
Qualification of 44L TSOP II (400mil) in JCET-China (JT) using 0.8mil Au
wire with KE-G6000DA mold compound, QMI-509 die attach material, Cu
leadframe and Roughened NiPdAu PPF leadfinish.
Sept
2015
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 10
Document No.002-03893 Rev. **
ECN # 4949578
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
ZW44A
Package Outline, Type, or Name:
44L TSOPII (400mils)
Mold Compound Name/Manufacturer:
KE-G6000DA / Kyocera
Mold Compound Flammability Rating:
V0 UL94
Mold Compound Alpha Emission Rate:
<0.001 CPH/cm2
Oxygen Rating Index: >28%
28%
Lead Frame Designation:
FMP with thru slots
Lead Frame Material:
Cu
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Roughened NiPdAu PPF
Die Backside Preparation Method/Metallization:
Backgrind to 7mils
Die Separation Method:
Laser Groove + Mech’l Saw
Die Attach Supplier:
Ablestik
Die Attach Material:
QMI-509
Bond Diagram Designation
001-95778
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au / 0.8 mil
Thermal Resistance Theta JA C/W:
66.82 C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
002-03840
Name/Location of Assembly (prime) facility:
JCET - China (JT)
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
Chipmos Taiwan (GO)
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 10
Document No.002-03893 Rev. **
ECN # 4949578
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
High Accelerated Saturation Test
(HAST)
Test Condition
(Temp/Bias)
AEC-Q100-008 and JESD22-A108, 125°C
Dynamic Operating Condition, Vcc Max = 1.44V
JESD22-A108, 125°C
Dynamic Operating Condition, Vcc Max = 1.44V
JESD22-A110, 130C, 5.55V, 85%RH
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
Result
P/F
P
P
P
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
Temperature Cycle
JESD22-A104, -65C to 150C
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
JESD22-A102, 121C, 100%RH, 15 Psig
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
Pressure Cooker
P
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
AEC-Q100-002
500V/1000V/1500V/2000V
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
AEC-Q100-011
250V/500V/ 750v (corner pins)
P
Wire Ball Shear
AEC-Q100-001
P
Wire Bond Pull
Mil-Std 883, Method 2011
P
Electrical Distribution
AEC-Q100-009
P
Latch up Sensitivity
AEC-Q100-004
P
Final Visual
JESD22-B101B
P
Physical Dimensions
JESD22-B100/108
P
Solderability
JESD22-B102
P
Solder Ball Shear
AEC Q100-010
P
Post Temperature Cycle Wire
Bond Pull
Mil-Std 883, Method 2011
High Temperature Storage Life
JESD22-A103, 150 C
Test
Dye Penetrant Test
Criteria: No Package Crack
Constructional Analysis
Criteria: Meet external and internal characteristics of Cypress package
Acoustic
J-STD-020
Precondition: JESD22-A113 Moisture Sensitivity MSL 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 10
P
P
P
P
Document No.002-03893 Rev. **
ECN # 4949578
Reliability Test Data
QTP #: 150416
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
STRESS: ACOUSTIC, MSL3
CY62147G30 (7A172147AO)
ZW44A
9508002
611520074
JCET-JT
COMP
30
0
CY7C1041G30 (7A171041AO)
ZW44A
9508002
611527878
JCET-JT
COMP
30
0
CY7C1041G30 (7A171041AO)
ZW44A
9508002
611527879
JCET-JT
COMP
29
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
150
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
150
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
COMP
150
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
150
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
150
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
COMP
150
0
9507001
611517301
JCET-JT
COMP
150
0
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY7C1041G30 (7A171041AO)
ZW44A
STRESS: DYE PENETRANT TEST
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
15
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
15
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
COMP
15
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 1.44V, Vcc Max
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
96
3495
0
CY62147G30 (7A172147AO)
ZW44A
9508002
611520074
JCET-JT
96
3497
0
CY7C1041G30 (7A171041AO)
ZW44A
9507003
611519245
JCET-JT
96
3497
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 10
Failure Mechanism
Document No.002-03893 Rev. **
ECN # 4949578
Reliability Test Data
QTP #: 150416
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
Failure Mechanism
STRESS: ELECTRICAL DISTRIBUTION
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
30
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
30
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
COMP
30
0
STRESS: ESD-CHARGE DEVICE MODEL
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
250
3
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
250
3
0
CY621472G30 (7A1721472AO)
ZW44A
9507003
611519244
JCET-JT
250
3
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
500
3
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
500
3
0
CY621472G30 (7A1721472AO)
ZW44A
9507003
611519244
JCET-JT
500
3
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
750
3
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
750
3
0
CY621472G30 (7A1721472AO)
ZW44A
9507003
611519244
JCET-JT
750
3
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 10
Document No.002-03893 Rev. **
ECN # 4949578
Reliability Test Data
QTP #: 150416
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
Failure Mechanism
STRESS: ESD-HUMAN BODY MODEL
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
500
3
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
500
3
0
CY621472G30 (7A1721472AO)
ZW44A
9507003
611519244
JCET-JT
500
3
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
1000
3
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
1000
3
0
CY621472G30 (7A1721472AO)
ZW44A
9507003
611519244
JCET-JT
1000
3
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
2000
3
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
2000
3
0
CY621472G30 (7A1721472AO)
ZW44A
9507003
611519244
JCET-JT
2000
3
0
STRESS: FINAL VISUAL
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
5571
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
2240
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
COMP
2252
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.55V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
96
84
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
96
84
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
96
85
0
0
STRESS: HIGH TEMPERATURE STORAGE
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
1000
85
ZW44A
9507001
611517301
JCET-JT
COMP
5
STRESS: LEAD INTEGRITY
CY7C1041G30 (7A171041AO)
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 10
Document No.002-03893 Rev. **
ECN # 4949578
Reliability Test Data
QTP #: 150416
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 125C, 1.44V, Vcc Max
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
1000
80
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
1000
80
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
1000
80
0
STRESS: PRESSURE COOKER TEST
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
96
85
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
168
85
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
96
85
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
168
85
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
96
85
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
168
85
0
STRESS: PHYSICALDIMENSION
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
30
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
30
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
COMP
30
0
611517301
JCET-JT
500
5
STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL
CY7C1041G30 (7A171041AO)
ZW44A
9507001
0
STRESS: PRE/POST LFR CRITICAL PARAMETER
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
30+2
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
30+2
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
COMP
30+2
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 10
Document No.002-03893 Rev. **
ECN # 4949578
Reliability Test Data
QTP #: 150416
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
Failure Mechanism
STRESS: STATIC LATCH-UP (+/-140mA 125C)
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
6
0
CY62147G30 (7A172147AO)
ZW44A
9508002
611517303
JCET-JT
COMP
6
0
CY621472G30 (7A1721472AO)
ZW44A
9507003
611519244
JCET-JT
COMP
6
0
STRESS: SOLDERABILITY
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
COMP
15
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
COMP
15
0
CY62147G30 (7A172147AO)
ZW44A
9508002
611517303
JCET-JT
COMP
15
0
STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
500
84
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517301
JCET-JT
1000
79
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
500
84
0
CY7C1041G30 (7A171041AO)
ZW44A
9507001
611517304
JCET-JT
1000
84
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
500
85
0
CY62147G30 (7A172147AO)
ZW44A
9507001
611517303
JCET-JT
1000
85
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 10
Document No.002-03893 Rev. **
ECN # 4949578
Document History Page
Document Title:
Document Number:
QTP#150416: AUTOMOTIVE 44L TSOP (400MIL) NIPDAU LEADFINISH, AU WIRE MSL3,
260C REFLOW JCET-CHINA (JT)
002-03893
Rev. ECN
Orig. of
No.
Change
**
4949578 HSTO
Description of Change
Initial spec release
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 10 of 10
Similar pages
QTP 144202:Automotive 28L SSOP (209 Mils) NiPdAuAg (Roughened) Leadfinish, Au Wire, MSL3, 260C Reflow, CML-RA.pdf
QTP 110909:100-LEAD TQFP (14X14X1.4 MILS),100LD / 128LD TQFP (14X20X1.4 MILS) NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)
QTP 105210:AUTOMOTIVE 28L TSOP (8X13.4MM) NIPDAU, MSL3, 235C REFLOW JCET-CHINA (JT) QUALIFICATION REPORT
QTP 102610:48-LEAD QFN (7X7X1.0 MM) NIPDAU, MSL3, 260C REFLOW CML-RA
QTP#152603:Automotive 128-Lead TQFP (14x20x1.4mm) Pure Sn Leadfinish, Au Wire MSL3, 260C Reflow ASEK-Taiwan (G)
QTP# 144001:Automotive PSoC4A Device Family, S8PF-10P Technology, Fab 4.pdf
QTP#072108 AUTOMOTIVE 20/28L SSOP MSL3, 260C (AMKOR-M).pdf
QTP 133601:Automotive 16-MBIT Asynchronous SRAM Family ULL65nm (LL65UP-250DR) Technology, UMC Fab12A.pdf
Qtp 92006 56-lead Saw Qfn (quad Flat No-lead) (8 X 8 X 1.0mm) Nipdau, Msl3, 260°c Reflow, Cml-ra.pdf
QTP 133308 Qfn68l (8x8x1.0mm) Nipdau, Cupd Wire Msl3, 260°c Reflow Cml-ra.pdf
QTP 104407:AUTOMOTIVE PSOC KRYPTON CY8C20566A DEVICE FAMILY, S8DIN-5RP TECHNOLOGY, FAB4
QTP 112302.pdf
Qtp#143604:Lq16 Qfn16 (3x3x0.6mm) Lq24 Qfn24 (4x4x0.6mm) Pure Sn, Cupd Wire Msl3, 260 Reflow.pdf
QTP 153701:New Package Qualification of the BKK 24 FBGA, with CuPd, KMC-3580LVA, CRM-1577DB, SAC 305, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4.pdf
QTP 112105:48 QFN (6X6X0.6 MM), 56 QFN (7X7X0.6 MM), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 104802:48L/56L SSOP (300 MILS), NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)
QTP # 072404 :WEST BRIDGE ANTIOCH, (CYWB0113AB, CYWB0124AB) C8Q-3RL TECHNOLOGY, FAB5
QTP 111812:32 QFN (5X5X1.0 MILS) / 40 QFN (6X6X1.0 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 104807:48-LEAD QFN (6X6X0.6MM),24-LEAD QFN (4X4X0.6MM),32-LEAD QFN (5X5X0.6MM) NIPDAU-AG, MSL3, 260C REFLOW K1-AMKOR (L) QUALIFICATION REPORT
QTP 154002:New Package Qualification of the CML 16LD 300-mil SOIC, with CuPd, KEG3000DA, QMI 509, NiPdAu, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4.pdf
QTP# 150414:48 VFBGA (6X8X1.0MM) SAC 105 SOLDER BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, CML-RA
QTP 105201 AUTOMOTIVE 48L SSOP (300 MILS) NIPDAU, MSL3, 260C REFLOW JCET-CHINA (JT).pdf