Document No.002-03694 Rev. ** ECN # 4932395 Cypress Semiconductor Package Qualification Report QTP# 134515 VERSION ** September 2015 40L QFN (6x6x0.6mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.002-03694 Rev. ** ECN # 4932395 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 134515 Qualification of 40L-QFN (6x6x0.6mm) in ASEK-Taiwan (G) using 0.8mil CuPd wire with G700LA mold compound, FH900 die attach film, Copper with Ag-spot LF and Pure Sn leadfinish at MSL3, 260C Reflow Temperature. Feb 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.002-03694 Rev. ** ECN # 4932395 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ40 Package Outline, Type, or Name: 40L-QFN (6x6x0.6mm) Mold Compound Name/Manufacturer: G700 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: >28% 54% (typical) Lead Frame Designation: FMP Lead Frame Material: Cu with Ag-spot plating Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Hitachi Die Attach Material: FH-900 Bond Diagram Designation 001-72735 Wire Bond Method: Thermosonic Wire Material/Size: CuPd 0.8mil Thermal Resistance Theta JA C/W: 15.52 C/W Package Cross Section Yes/No: No Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML ® Note: Please contact a Cypress Representative for other package availability. RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.002-03694 Rev. ** ECN # 4932395 Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Acoustic Microscopy Result P/F P P X-Ray Criteria: Meet external and internal characteristics of package MIL-STD-883 – 2012 Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Internal Visual Inspection MIL-STD-883-2014 P Pressure Cooker Test JESD22-A102, 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Constructional Analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P P Document No.002-03694 Rev. ** ECN # 4932395 Reliability Test Data QTP #: 134515 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G COMP 15 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G COMP 15 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G COMP 15 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G COMP 10 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G COMP 10 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G COMP 10 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G COMP 10 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G COMP 10 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G COMP 10 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G COMP 5 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G COMP 5 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G COMP 5 0 STRESS: CRATER TEST NOMARSKI CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G COMP 5 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G COMP 5 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G COMP 5 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G COMP 5 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G COMP 5 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G COMP 5 0 STRESS: INTERNAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.002-03694 Rev. ** ECN # 4932395 Reliability Test Data QTP #: 134515 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G 168 80 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G 288 80 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G 168 80 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G 288 80 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G 168 80 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G 288 80 0 STRESS: TEMPERATURE CYCLE TEST CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G 500 79 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G 1000 79 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G 500 80 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G 1000 79 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G 500 80 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G 1000 79 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323541 ASEK-G COMP 15 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323542 ASEK-G COMP 15 0 CY8C4245LQI (8CP44200AC) LQ40 4308770 611323543 ASEK-G COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.002-03694 Rev. ** ECN # 4932395 Document History Page Document Title: QTP#134515: 40L QFN (6X6X0.6MM) PURE SN LEADFINISH, CUPD WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G) Document Number: 002-03694 Rev. ECN Orig. of No. Change ** 4932395 HSTO Description of Change Initial spec release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7