Document No.001-89029 Rev. *C ECN # 5150834 Cypress Semiconductor Package Qualification Report QTP# 133309 VERSION*B September 2014 QFN48L(7x7x1.0mm) / QFN68L(8x8x1.0mm) Pure Sn, CuPd Wire MSL3, 260C Reflow ASE-G FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-89029 Rev. *C ECN # 5150834 PACKAGE QUALIFICATION HISTORY QTP Number 133309 Description of Qualification Purpose Qualification of QFN48L (7x7x1.0mm) / QFN68L (8x8x1.0mm) in ASEK assembly using 0.8mil CuPd wire, G700LA / G700SLA mold comp, EN4900F die attach epoxy with Pure Sn leadfinish. This is large die qual for 68L QFN assembled in ASEK. 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Page 2 of 7 Date Aug 2013 Document No.001-89029 Rev. *C ECN # 5150834 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: QFN68L Package Outline, Type, or Name: Oxygen Rating Index: >28% QFN68L (8x8x1.0mm) G700LA / Sumitomo G700SLA / Sumitomo V-0 / UL94 G700LA – n/a G700SLA - <0.001 cph/m2 54% (typical) Lead Frame Designation: RMP (with slots) Lead Frame Material: Copper Substrate Material: n/a Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: HITACHI Die Attach Material: EN4900F Bond Diagram Designation 001-76055 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 14.17 C/W Package Cross Section Yes/No: n/a Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASE-G MSL LEVEL 3 REFLOW PROFILE 260C Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML (R) Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 7 Document No.001-89029 Rev. *C ECN # 5150834 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P X-Ray Criteria: Meet external and internal characteristics of package JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow MIL-STD-883 - 2012 Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Internal Visual MIL-STD-883-2014 P High Temp Storage JESD22-A103: 150 C, no bias P Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883, Method 2019 Constructional Analysis High Accelerated Saturation Test (HAST) Die Shear Thermal Shock Bond Pull MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22-A106B MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P P P P P Document No.001-89029 Rev. *C ECN # 5150834 Reliability Test Data QTP #: 133309 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 150 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 150 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 150 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 150 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 150 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 150 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 5 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 5 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 5 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 15 0 STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G 128 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G 128 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G 128 37 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 7 Document No.001-89029 Rev. *C ECN # 5150834 Reliability Test Data QTP #: 133309 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY8CTMA4634 (8CC20411BC) LQ56B 4225607 611318686 ASE-G 500 78 0 CY8CTMA4634 (8CC20411BC) LQ56B 4225607 611318688 ASE-G 500 78 0 CY8CTMA4634 (8CC20411BC) LQ56B 4225607 611318689 ASE-G 500 78 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 5 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 37 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G 168 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G 288 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G 168 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G 288 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G 168 80 0 STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G 500 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G 1000 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G 500 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G 1000 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G 500 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G 1000 80 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314399 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314401 ASE-G COMP 15 0 CY8C5868LTI (8C560681AC) LT68G 4304019 611314402 ASE-G COMP 15 0 STRESS: XRAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-89029 Rev. *C ECN # 5150834 Document History Page Document Title:QTP#133309:QFN48L(7x7x1.0mm) / QFN68L(8x8x1.0mm) Pure Sn, CuPd Wire MSL3, 260C Reflow ASE-G Document Number: 001-89029 Rev. ECN No. ** 4112412 *A 4122369 *B *C Orig. of Change HSTO HSTO 4495798 HSTO 5150834 HSTO Description of Change Initial spec release Updated the package information in page 1 & 2. Updated HTS data in page 6. Align qualification report based on the new template in the front page Update contact person for Reliability Director Add G700SLA mold compound in Major Package Information table Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7