Document No. 001-87621 Rev. *C ECN #: 5140439 Cypress Semiconductor Product Qualification Report QTP# 123803 VERSION*C February 2016 USB-Serial Device Family S8PF-10R Technology, Fab 4 (CMI) CY7C65215 USB-Serial Dual Channel (UART/I2C/SPI) Bridge with CapSense® and BCD CY7C65213 USB-UART LP Bridge Controller CY7C65211 USB-Serial Single-Channel (UART/I2C/SPI) Bridge with Capsense ® and BCD CY7C65210 USB BILLBOARD Controller FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Sr. Reliability Engineer Reviewed By: Rene Rodgers (RT) Sr. MTS Reliability Engineer Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 083401 Qualify SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC Krypton Device Jan 09 113905 Qualify device 8C20400BC S8P12-10P Technology Fabricated at Fab 4 (CMI) Jan 12 123803 Qualify USB-Serial Device Family, S8PF-10R Technology in Fab 4 (CMI) May 13 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify USB-Serial Device Family, S8PF-10R Technology in Fab 4 (CMI) Marketing Part #: CY7C65215, CY7C65213, CY7C65211 Device Description: Full-Speed USB Peripheral Controller Cypress Division: Cypress Semiconductor Corporation – Data Communication Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Composition: Metal 1 & 2 : 100A Ti + 3200A Al-0.5%Cu + 300A TiW Metal 3 & 4 : 150A Ti + 7200A Al-0.5%Cu + 350A TiW Metal 5 : 300A Ti + 1200A Al-0.5%Cu + 300A TiW 1kA Oxide + 6kA Nitride (flat wafer thickness) Passivation Type and Thickness: Generic Process Technology/Design Rule (-drawn): S8PF-10R / 0.13um Gate Oxide Material/Thickness (MOS): 32A (1.8V) / 120A (5V) Name/Location of Die Fab (prime) Facility: Cypress Semiconductor - Minnesota Die Fab Line ID/Wafer Process ID: S8PF-10P PACKAGE AVAILABILITY PACKAGE WIRE MATERIAL ASSEMBLY FACILITY SITE QTP NUMBER 24 QFN Cu CML-RA Cu: 120207, Pkg: 124105 24 QFN Cu ASE-Taiwan (G) Cu: 120604, Pkg: 114401 32 QFN Cu CML-RA Cu and Pkg: 120204 32 QFN Cu ASE-Taiwan (G) Cu and Pkg: 114907 Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: LT32B Mold Compound Flammability Rating: 32 Quad Flat No-Lead (QFN) GE7470L-A/Nitto UL94 – V0 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: QMI-519 Die Attach Method: Epoxy Bond Diagram Designation: 001-83370 Wire Bond Method: Thermosonic Wire Material/Size: Cu 0.8 mil Thermal Resistance Theta JA °C/W: 18.36 C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-87319 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R, CML-RA, ASE-Taiwan (G) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Temperature Steady State life Low Temperature Operating Life Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc Max=2.1V/2.07V, Vddd=1.95V,Vbus= 3.45V,150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=2.1V/2.07V, Vddd=1.95V,Vbus= 3.45V,150°C JESD22-A-108 150°C, 2.1V, Vcc Max JESD22-A-108 -30°C, 2.1V JESD22-A-108 Result P/F P P P P -40°C, No Bias Low Temperature Storage Life High Accelerated Saturation Test (HAST) Temperature Cycle Pressure Cooker Thermal Shock JESD22-A-108 130°C, 5.5V/5.25V, 85%RH, JESD22-A-110 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C -650C to 1500C, JESD22-A-104 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C 121°C, 100%RH, 15 Psig, JESD22-A102 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C P P P P P Acoustic Microscopy J-STD-020 P Age Bond Strength 200C, 4hrs MIL-STD-883, Method 883-2011 P Bond Pull Mil-Std 883, Method 2011 P Ball Shear JESD22-B116 P Dye Penetrant Test Constructional Analysis Test to determine the existence and extent of cracks, Criteria: No Package Crack Criteria: Meet external and internal characteristics of Cypress package P P Current Density Meets the Technology Device Level Reliability Specifications P Data Retention 150°C, No Bias JESD22-A117 and JESD22-A103 P Dynamic Latch-up 125C, 8.5V P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V / 3300V JESD22, Method A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Electrostatic Discharge 200V, 220V, 275V, 330V JESD22-A115 P Machine Model (ESD-MM) Endurance Test MIL-STD-883, Method 883-1033/ JESD22-A117 P Static Latch-up 125C, +/- 200mA JESD 78 P SEM Analysis MIL-STD-883, Method 2018 P Pre/Post LFR AC/DC Char AC/DC Critical Parameter Char at 0 hour/500 hours P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 1,524 0 N/A N/A 0 PPM 1 High Temperature Operating Life Long Term Failure Rate 703,000 DHRs 0 0.7 170 8 FIT 2 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. K = Boltzmann’s constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 1 Early Failure Rate was computed from QTPs 123803 2 Long Term Failure Rate was computed from QTPs 083401, 113905 & 123803 LFR Data Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R COMP 3 0 CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 STRESS: STATIC LATCH-UP (85C, 8.25V) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4837410 410.23.02 Promex COMP 6 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 3300 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 3300 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 3300 3 0 STRESS: ESD-MACHINE MODEL, (200V) CY8C20236A (8C202662A) 4126494 611143319 KOREA-L 200 5 0 CY8C20236A (8C202662A) 4125077 611143627 PHIL-MB 200 5 0 STRESS: ESD-MACHINE MODEL, (220V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 220 6 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 220 6 0 STRESS: ESD-MACHINE MODEL, (275V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 275 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 275 3 0 STRESS: ESD-MACHINE MODEL, (330V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 330 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 330 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 330 3 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 STRESS: Read NV Latch (1) HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 (1) Destroyed during failure analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data ER114031 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: LOW TEMPERATURE STORAGE, -40C, No Bias CY8C20236A (8C202662A) 4137730 611155459 L-KOREA 1000 100 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 10 0 STRESS: BOND PULL STRESS: DATA RETENTION, 150C CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 80 0 4130520 611147744 G-TAIWAN COMP 15 0 4130520 611147744 G-TAIWAN 168 80 0 CML-RA COMP 9 0 COMP 3 0 COMP 8 0 STRESS: DYE PENETRANT TEST CY8CTMA443 (8C20401A) STRESS : ENDURANCE CY8CTMA443 (8C20401A) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA443 (8C20401B) 4140358 611153802 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (1100V) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (1600V) CY8CTMA443 (8C20401B) 4140358 611153801 CML-RA STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 128 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 128 78 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max) CY8CTMA443 (8C20401A) 4130520 611147745 G-TAIWAN 48 45 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 48 1492 0 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 1074 2 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 418 1 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4141585 611156224 G-TAIWAN 48 1500 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 48 1000 0 CY8CTMA443 (8C20401A) 4131142 611148870 G-TAIWAN 48 500 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 80 116 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 116 0 4130520 611147744 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL CY8CTMA443 (8C20401A) STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 168 77 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 288 77 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 288 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 288 80 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 500 83 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 1000 83 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 79 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 79 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 1000 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: THERMAL SHOCK (COND. B, -55C TO 125C) CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 200 80 0 G-TAIWAN COMP 2 0 COMP 6 0 STRESS: THERMAL JUNCTION MEASUREMENT CY8CTMA443 (8C20401A) 4130520 611147744 STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-140mA) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 123803 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY7C65215 (7CC68400AC) 4252341 611302953 CML-RA COMP 9 0 CY7C65215 (7CC68400AC) 4307374 611310391 CML-RA COMP 9 0 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (2,200V) CY7C65215 (7CC68400AC) 4252341 611302953 CML-RA COMP 8 0 CY7C65215 (7CC68400AC) 4307374 611310391 CML-RA COMP 8 0 STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-140mA) CY7C65215 (7CC68400AC) 4252341 611302953 CML-RA COMP 6 0 CY7C65215 (7CC68400AC) 4307374 611310391 CML-RA COMP 6 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, VDDD=1.95V,VBUS= 3.45V, Vcc Max) CY7C65215 (7CC68400AC) 4307374 611310386 CML-RA 48 1524 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON RATE (150C, VDDD=5.5V,VBUS= 5.25V, Vcc Max) CY7C65215 (7CC68400AC) 4307374 611310386 CML-RA 48 50 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, VDDD=1.95V,VBUS= 3.45V, Vcc Max) CY7C65215 (7CC68400AC) 4252341 611302956 CML-RA 80 120 0 CY7C65215 (7CC68400AC) 4252341 611302956 CML-RA 500 120 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 128 78 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 256 77 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 500 77 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 1000 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 168 78 0 4252342 611305295 CML-RA COMP 15 0 STRESS: ACOUSTIC, MSL3 CY7C65215 (7CC68400AC) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Reliability Test Data QTP #: 123803 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION, 150C CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 96 80 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 168 80 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 500 80 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 1000 80 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 168 78 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 500 78 0 STRESS : ENDURANCE STRESS : PRE/POST LFR CRITICAL PARAMETERS CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 0 30+2 0 CY7C65215 (7CC68400AC) 4252342 611305295 CML-RA 500 30+2 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 17 Document No. 001-87621 Rev. *C ECN #: 5140439 Document History Page Document Title: Document Number: QTP#123803: USB-SERIAL DEVICE FAMILY S8PF-10R TECHNOLOGY, FAB 4 (CMI) 001-87621 Rev. ECN Orig. of No. Change ** 4003364 JYF *A 4399294 JYF *B *C 4553702 5140439 JYF JYF SLLO Description of Change Initial Spec Release Sunset Review: Updated QTP title page for template alignment. Added Pre/Post LFR Parameter data. Added CY7C65210 in the MPN coverage. Removed Distribution and Posting from the document history page. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 17 of 17