Document No. 001-61381 Rev. *A ECN #:4005056 Cypress Semiconductor Product Qualification Report QTP# 083204 May 2013 C8Q-3RL Technology, Fab 5 CYWB0224ABS CYWB0225ABS CYWB0226ABS CYWB0227ABS CYWB0228ABS CYWB0229ABS CYWB0230ABS CYWB0231ABS CYWB0224ABSX CYWB0225ABSX CYWB0226ABSX CYWB0227ABSX CYWB0228ABSX CYWB0229ABSX CYWB0230ABSX CYWB0231ABSX West Bridge™: Astoria™ USB and Mass Storage Peripheral Controller CYWB0220ABSX2 West Bridge®: Astoria Lite SP CYWB0321ABX West Bridge®: Arroyo-I CYWB0320ABX West Bridge®: Arroyo-II West Bridge®: Astoria SP CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Reliability Director (408) 943-2675 Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 065201 Qualify FX2LP18 Device Family on C8Q-3R Technology at GSMC Foundry (Fab 5) Sep 07 072404 Qualify West Bridge Antioch (7C07100A) on C8Q-3RL Technology at Fab 5 Jan 08 081206 083204 082901 100805 Qualify West Bridge Astoria-Switch (7C07101B, 100VFBGA 6X6mm) on C8Q-3RL Technology at Fab 5 Qualify West Bridge Astoria-Switch Rev C (7C07101C, 100VFBGA 6X6mm) at Fab 5 Qualify 7C071011B Astoria Grace SP 81-Ball WLCSP (Wafer Level Chip Scale Package) at Amkor- Taiwan (AU) Qualify CYWB0220ABSX2 and CYWB0320ABX 81-Ball WLCSP (Wafer Level Chip Scale Package) at Amkor- Taiwan (AU) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 15 Aug 08 Nov 08 Nov 08 Apr 10 Document No. 001-61381 Rev. *A ECN #:4005056 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify West Bridge Astoria-Switch Rev C (7C07101C, 100VFBGA 6X6mm) at Fab 5 Marketing Part #: CYWB0224/5/6/7/8/9ABS*, CYWB0230/31ABS*, CYWB0224ABM*, CYWB0226ABM*, Device Description: Astoria Switch- Handset Peripheral Controller Cypress Division: Cypress Semiconductor Corporation – Data Com Division (DCD) Number of Metal Layers: TECHNOLOGY/FAB PROCESS DESCRIPTION Metal 1: 400ATiN/2900A Al/600A TiN 4 Metal Composition: Metal 2: 550ATiN/3600A Al/600A TiN Metal 3: 550ATiN/3600A Al/600A TiN Metal 4: 500ATiN/6500A Al/250A TiN Passivation Type and Materials: 1000A TEOS/7000 Nitride Number of Transistors in device: 3.9M Number of Gates in device: 250K Generic Process Technology/Design Rule (µ-drawn): CMOS, 0.13 µm Gate Oxide Material/Thickness (MOS): SiO2 DGOX 32/55A Name/Location of Die Fab (prime) Facility: GSMC Die Fab Line ID/Wafer Process ID: CQ8-3RL, Fab5 PACKAGE AVAILABILITY PACKAGE ASSEMBLY SITE FACILITY 100-Ball VFBGA CML-RA, AT-INDONESIA 81- Ball WLCSP Amkor, Taiwan Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: BZ100 100-Ball Very Fine Ball Grid Array (VFBGA) KE-G2270E V-O per UL94 N/A Oxygen Rating Index: N/A Substrate Material SUBZ100H Lead Finish, Composition / Thickness: SnAgCu Die Backside Preparation Method / Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: QMI506 Die Attach Method: Epoxy Bond Diagram Designation: 001-14167 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 44.21 Package Cross Section Yes/No: N/A Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other packages availability. 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Page 4 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Early Failure Rate Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc Max=3.8V, 125°C Dynamic Operating Condition, Vcc Max=3.8V, 150°C JESD22-A108 High Temperature Operating Life Dynamic Operating Condition, Vcc Max=3.8V, 150°C Latent Failure Rate JESD22-A108 High Temperature Steady State life Dynamic Operating Condition, Vcc Max=3.63V, 150°C JESD22-A108 Low Temperature Operating Life Dynamic Operating Condition, Vcc=4.3V, -30C High Temperature Storage JESD22-A108 JESD22-A103: 150 C, no bias High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 1.8V/3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 3 Result P/F P P P P P P 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 3 P 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C JESD22-A102: 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 3 Pressure Cooker P 192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JESD22, Method A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 3 P 192 Hrs, 30C/60%RH+R-Reflow, 260°C+0, -5°C Static Latch-up 125C, ± 200 JESD78 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 15 P Document No. 001-61381 Rev. *A ECN #:4005056 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life 1 Early Failure Rate 1,2 High Temperature Operating Life Long Term Failure Rate 1 2 3 3 Device Tested/ Device Hours # Fails Activation Energy Thermal A.F Failure Rate 1,716 Devices 0 N/A N/A 0 PPM 810,168 DHRs 0 0 .7 170 12 FIT Assuming an ambient temperature of 55 C and a junction temperature rise of 15 C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 k = Boltzmann's constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 065201 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 15 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 15 0 610739937 TAIWN-G COMP 15 0 Failure Mechanism STRESS: ACOUSTIC-MSL3 CY7C68053 (7C680510BK) 4727325 STRESS: ESD-CHARGE DEVICE MODEL (500V) CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 9 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 8 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 8 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 3.63V) CY7C68053 (7C680510BK) 9714792 610721250 CML-R 80 80 0 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 168 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 3.8V, Vcc Max) CY7C68053 (7C680510BK) 9714792 610721250 CML-R 48 338 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 48 348 0 CY7C68053 (7C680510BK) 4727325 610739215 CML-R 48 340 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.8V, Vcc Max) CY7C68053 (7C680510BK) 9714792 610721250 CML-R 80 182 0 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 500 182 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 80 182 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 500 182 0 CY7C68053 (7C680510BK) 4727325 610739215 CML-R 80 180 0 CY7C68053 (7C680510BK) 4727325 610739215 CML-R 500 180 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.65V), PRE COND 192 HR, 30C/60%RH, MSL3 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 128 50 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 128 45 0 500 45 0 STRESS: LOW TEMPERATURE OPERATING LIFE (-30C, 4.3V) CY7C68053 (7C680510BK) 9714792 610721250 CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 065201 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP TESTING (125C, ±200mA) CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 3 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 6 0 STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias CY7C68053 (7C680510BK) 9714792 610721250 CML-R 500 50 0 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 1000 50 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR, 30C/60%RH, MSL3 CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G 168 48 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G 168 50 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G 300 50 0 CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G 1000 50 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G 500 50 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G 1000 50 0 CY7C68053 (7C680510BK) 4727325 610739937 TAIWN-G 300 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 072404 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC-MSL3 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA COMP 15 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA COMP 5 0 610754005/6/7/8 CML-RA COMP 9 0 8 0 STRESS: ESD-CHARGE DEVICE MODEL (500V) CYWB0124AB (7C07100B) 4738561 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA COMP STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 96 817 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 96 268 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 96 270 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 96 269 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 96 270 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 96 270 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 96 270 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 168 180 0 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 1000 179 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 1000 60 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 1000 60 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 1000 60 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 168 60 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 072404 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 1000 60 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 1000 60 0 Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 168 59 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 1000 59 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), PRE COND 192 HR, 30C/60%RH, MSL3 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 128 76 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR, 30C/60%RH, MSL3 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 168 24 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 168 26 0 COMP 6 0 STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA) CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 300 50 0 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 500 50 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 500 32 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 500 32 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 500 32 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 1000 32 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 500 32 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 072404 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 300 31 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 500 31 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 1000 31 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 300 31 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 500 31 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 1000 31 0 Failure Mechanism Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 081206 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0226ABS (7C07101BK) 4818850 610821607 CML-RA 96 2308 1 CYWB0226ABS (7C07101BK) 4824037 610829451 CML-RA 96 719 0 CML-RA COMP 9 0 COMP 8 0 COMP 6 0 SCAN REJECT (FA# 081206-1E1) STRESS: ESD-CHARGE DEVICE MODEL (500V) CYWB0226ABS (7C07101BK) 4818850 610821607 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CYWB0226ABS (7C07101BK) 4818850 610821607 CML-RA STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA) CYWB0226ABS (7C07101BK) 4818850 610821607 CML-RA STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CYWB0226ABS (7C07101BK) 4818850 610821607 CML-RA 500 77 0 CYWB0226ABS (7C07101BK) 4818850 610821607 CML-RA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 083204 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL (500V) CYWB0224ABS (7C07101CK) 4838923 610846743 CML-RA COMP 9 0 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CYWB0224ABS (7C07101CK) 4838923 610846743 CML-RA COMP STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0224ABS (7C07101CK) 4838923 610846743 CML-RA 96 1716 0 STRESS: SORT YIELD 7C07101CK 4838923 COMPARABLE Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 15 Document No. 001-61381 Rev. *A ECN #:4005056 Reliability Test Data QTP #: 100805 Device Fab Lot # Assy Lot # Assy Loc Duration 4912526 611014764 N/A COMPARABLE 4912526 611014764 N/A COMPARABLE Samp Rej Failure Mechanism STRESS: SORT YIELD CYWB0320ABX-FDXIT STRESS: CLASS YIELD CYWB0320ABX-FDXIT Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 15 Document No.001-61381 Rev. *A ECN #: 4005056 Document History Page Document Title: REPORT Document Number: QTP#083204: WEST BRIDGE ASTORIA-SWITCH (7C07101C) AT FAB 5 QUALIFICATION 001-61381 Rev. ECN Orig. of No. Change ** 2927399 NSR *A 4005056 NSR Description of Change Initial Spec Release. Added QTP100805 data to the original report (reference memo HGA-686). Removed VERSION 2.0 in the title page. Removed reference Cypress Specs in reliability tests performed table and added the reference industry standards. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 15