QTP#083204:WEST BRIDGE ASTORIA-SWITCH (7C07101C) AT FAB 5 QUALIFICATION REPORT

Document No. 001-61381 Rev. *A
ECN #:4005056
Cypress Semiconductor
Product Qualification Report
QTP# 083204
May 2013
C8Q-3RL Technology, Fab 5
CYWB0224ABS
CYWB0225ABS
CYWB0226ABS
CYWB0227ABS
CYWB0228ABS
CYWB0229ABS
CYWB0230ABS
CYWB0231ABS
CYWB0224ABSX
CYWB0225ABSX
CYWB0226ABSX
CYWB0227ABSX
CYWB0228ABSX
CYWB0229ABSX
CYWB0230ABSX
CYWB0231ABSX
West Bridge™: Astoria™ USB
and Mass
Storage Peripheral Controller
CYWB0220ABSX2
West Bridge®: Astoria Lite SP
CYWB0321ABX
West Bridge®: Arroyo-I
CYWB0320ABX
West Bridge®: Arroyo-II
West Bridge®: Astoria SP
CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
Mira Ben-Tzur
Reliability Director
(408) 943-2675
Rene Rodgers
Reliability Engineer, MTS
(408) 943-2732
Company Confidential
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Page 1 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
PRODUCT QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
065201
Qualify FX2LP18 Device Family on C8Q-3R Technology at GSMC Foundry
(Fab 5)
Sep 07
072404
Qualify West Bridge Antioch (7C07100A) on C8Q-3RL Technology at Fab 5
Jan 08
081206
083204
082901
100805
Qualify West Bridge Astoria-Switch (7C07101B, 100VFBGA 6X6mm) on
C8Q-3RL Technology at Fab 5
Qualify West Bridge Astoria-Switch Rev C (7C07101C, 100VFBGA 6X6mm)
at Fab 5
Qualify 7C071011B Astoria Grace SP 81-Ball WLCSP (Wafer Level Chip
Scale Package) at
Amkor- Taiwan (AU)
Qualify CYWB0220ABSX2 and CYWB0320ABX 81-Ball WLCSP (Wafer
Level Chip Scale Package) at Amkor- Taiwan (AU)
Company Confidential
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Page 2 of 15
Aug 08
Nov 08
Nov 08
Apr 10
Document No. 001-61381 Rev. *A
ECN #:4005056
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: Qualify West Bridge Astoria-Switch Rev C (7C07101C, 100VFBGA 6X6mm) at Fab 5
Marketing Part #:
CYWB0224/5/6/7/8/9ABS*, CYWB0230/31ABS*, CYWB0224ABM*, CYWB0226ABM*,
Device Description:
Astoria Switch- Handset Peripheral Controller
Cypress Division:
Cypress Semiconductor Corporation – Data Com Division (DCD)
Number of Metal Layers:
TECHNOLOGY/FAB PROCESS DESCRIPTION
Metal 1: 400ATiN/2900A Al/600A TiN
4
Metal Composition:
Metal 2: 550ATiN/3600A Al/600A TiN
Metal 3: 550ATiN/3600A Al/600A TiN
Metal 4: 500ATiN/6500A Al/250A TiN
Passivation Type and Materials:
1000A TEOS/7000 Nitride
Number of Transistors in device:
3.9M
Number of Gates in device:
250K
Generic Process Technology/Design Rule (µ-drawn):
CMOS, 0.13 µm
Gate Oxide Material/Thickness (MOS):
SiO2 DGOX 32/55A
Name/Location of Die Fab (prime) Facility:
GSMC
Die Fab Line ID/Wafer Process ID:
CQ8-3RL, Fab5
PACKAGE AVAILABILITY
PACKAGE
ASSEMBLY SITE FACILITY
100-Ball VFBGA
CML-RA, AT-INDONESIA
81- Ball WLCSP
Amkor, Taiwan
Note: Package Qualification details upon request.
Company Confidential
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Page 3 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
Mold Compound Alpha Emission Rate:
BZ100
100-Ball Very Fine Ball Grid Array (VFBGA)
KE-G2270E
V-O per UL94
N/A
Oxygen Rating Index:
N/A
Substrate Material
SUBZ100H
Lead Finish, Composition / Thickness:
SnAgCu
Die Backside Preparation Method /
Metallization:
Backgrind
Die Separation Method:
100% Saw
Die Attach Supplier:
Henkel
Die Attach Material:
QMI506
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-14167
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au, 0.8mil
Thermal Resistance Theta JA °C/W:
44.21
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
11-21099
Name/Location of Assembly (prime) facility:
CML-RA
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
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Page 4 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
High Temperature Operating Life
Early Failure Rate
Test Condition
(Temp/Bias)
Dynamic Operating Condition, Vcc Max=3.8V, 125°C
Dynamic Operating Condition, Vcc Max=3.8V, 150°C
JESD22-A108
High Temperature Operating Life
Dynamic Operating Condition, Vcc Max=3.8V, 150°C
Latent Failure Rate
JESD22-A108
High Temperature Steady State life
Dynamic Operating Condition, Vcc Max=3.63V, 150°C
JESD22-A108
Low Temperature Operating Life
Dynamic Operating Condition, Vcc=4.3V, -30C
High Temperature Storage
JESD22-A108
JESD22-A103: 150 C, no bias
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110: 130°C, 1.8V/3.63V, 85%RH
Precondition: JESD22 Moisture Sensitivity Level 3
Result
P/F
P
P
P
P
P
P
192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level 3
P
192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C
JESD22-A102: 121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity Level 3
Pressure Cooker
P
192 Hrs, 30C/60%RH+Reflow, 260°C+0, -5°C
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
JESD22, Method A114
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
JESD22-C101
P
Acoustic Microscopy
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level 3
P
192 Hrs, 30C/60%RH+R-Reflow, 260°C+0, -5°C
Static Latch-up
125C, ± 200
JESD78
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Page 5 of 15
P
Document No. 001-61381 Rev. *A
ECN #:4005056
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life
1
Early Failure Rate
1,2
High Temperature Operating Life
Long Term Failure Rate
1
2
3
3
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
A.F
Failure
Rate
1,716 Devices
0
N/A
N/A
0 PPM
810,168 DHRs
0
0 .7
170
12 FIT
Assuming an ambient temperature of 55 C and a junction temperature rise of 15 C.
Chi-squared 60% estimations used to calculate the failure rate.
Thermal Acceleration Factor is calculated from the Arrhenius equation
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
where:
EA =The Activation Energy of the defect mechanism.
-5
k = Boltzmann's constant = 8.62x10 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use
conditions.
Company Confidential
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Page 6 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 065201
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
COMP
15
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
COMP
15
0
610739937
TAIWN-G
COMP
15
0
Failure Mechanism
STRESS: ACOUSTIC-MSL3
CY7C68053 (7C680510BK)
4727325
STRESS: ESD-CHARGE DEVICE MODEL (500V)
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
COMP
9
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
COMP
9
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
COMP
8
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
COMP
8
0
STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 3.63V)
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
80
80
0
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
168
80
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 3.8V, Vcc Max)
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
48
338
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
48
348
0
CY7C68053 (7C680510BK) 4727325
610739215
CML-R
48
340
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.8V, Vcc Max)
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
80
182
0
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
500
182
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
80
182
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
500
182
0
CY7C68053 (7C680510BK) 4727325
610739215
CML-R
80
180
0
CY7C68053 (7C680510BK) 4727325
610739215
CML-R
500
180
0
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.65V), PRE COND 192 HR, 30C/60%RH, MSL3
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
128
50
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
128
45
0
500
45
0
STRESS: LOW TEMPERATURE OPERATING LIFE (-30C, 4.3V)
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
Company Confidential
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Page 7 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 065201
Device
Fab Lot #
Assy Lot #
Assy Loc Duration Samp
Rej
Failure Mechanism
STRESS: STATIC LATCH-UP TESTING (125C, ±200mA)
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
COMP
3
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
COMP
6
0
STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
500
50
0
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
1000
50
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR, 30C/60%RH, MSL3
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
168
48
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
168
50
0
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
300
50
0
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
1000
50
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
500
50
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
1000
50
0
CY7C68053 (7C680510BK) 4727325
610739937
TAIWN-G
300
50
0
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Page 8 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 072404
Device
Fab Lot #
Assy Lot #
Assy Loc Duration Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC-MSL3
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
COMP
15
0
CYWB0124AB (7C07100B) 4739848
610756608
CML-RA
COMP
5
0
CYWB0124AB (7C07100B) 4739848
610756609
CML-RA
COMP
5
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
COMP
5
0
CYWB0124AB (7C07100B) 4739893
610756142
CML-RA
COMP
5
0
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
COMP
5
0
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
COMP
5
0
610754005/6/7/8 CML-RA
COMP
9
0
8
0
STRESS: ESD-CHARGE DEVICE MODEL (500V)
CYWB0124AB (7C07100B) 4738561
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
COMP
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max)
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
96
817
0
CYWB0124AB (7C07100B) 4739848
610756608
CML-RA
96
268
0
CYWB0124AB (7C07100B) 4739848
610756609
CML-RA
96
270
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
96
269
0
CYWB0124AB (7C07100B) 4739893
610756142
CML-RA
96
270
0
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
96
270
0
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
96
270
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max)
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
168
180
0
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
1000
179
0
CYWB0124AB (7C07100B) 4739848
610756608
CML-RA
168
60
0
CYWB0124AB (7C07100B) 4739848
610756608
CML-RA
1000
60
0
CYWB0124AB (7C07100B) 4739848
610756609
CML-RA
168
60
0
CYWB0124AB (7C07100B) 4739848
610756609
CML-RA
1000
60
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
168
60
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
1000
60
0
CYWB0124AB (7C07100B) 4739893
610756142
CML-RA
168
60
0
Company Confidential
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Page 9 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 072404
Device
Fab Lot #
Assy Lot #
Assy Loc Duration Samp
Rej
CYWB0124AB (7C07100B) 4739893
610756142
CML-RA
1000
60
0
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
168
60
0
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
1000
60
0
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max)
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
168
59
0
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
1000
59
0
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), PRE COND 192 HR, 30C/60%RH, MSL3
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
128
76
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR, 30C/60%RH, MSL3
CYWB0124AB (7C07100B) 4739848
610756608
CML-RA
168
26
0
CYWB0124AB (7C07100B) 4739848
610756609
CML-RA
168
26
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
168
26
0
CYWB0124AB (7C07100B) 4739893
610756142
CML-RA
168
26
0
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
168
24
0
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
168
26
0
COMP
6
0
STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA)
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
300
50
0
CYWB0124AB (7C07100B) 4738561
610754005/6/7/8 CML-RA
500
50
0
CYWB0124AB (7C07100B) 4739848
610756608
CML-RA
300
32
0
CYWB0124AB (7C07100B) 4739848
610756608
CML-RA
500
32
0
CYWB0124AB (7C07100B) 4739848
610756609
CML-RA
300
32
0
CYWB0124AB (7C07100B) 4739848
610756609
CML-RA
500
32
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
300
32
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
500
32
0
CYWB0124AB (7C07100B) 4739848
610756607
CML-RA
1000
32
0
CYWB0124AB (7C07100B) 4739893
610756142
CML-RA
300
32
0
CYWB0124AB (7C07100B) 4739893
610756142
CML-RA
500
32
0
Company Confidential
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Page 10 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 072404
Device
Fab Lot #
Assy Lot #
Assy Loc Duration Samp
Rej
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
300
31
0
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
500
31
0
CYWB0124AB (7C07100B) 4739893
610756144
CML-RA
1000
31
0
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
300
31
0
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
500
31
0
CYWB0124AB (7C07100B) 4739893
610756145
CML-RA
1000
31
0
Failure Mechanism
Company Confidential
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Page 11 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 081206
Device
Fab Lot #
Assy Lot #
Assy Loc Duration Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max)
CYWB0226ABS (7C07101BK) 4818850
610821607
CML-RA
96
2308
1
CYWB0226ABS (7C07101BK) 4824037
610829451
CML-RA
96
719
0
CML-RA
COMP
9
0
COMP
8
0
COMP
6
0
SCAN REJECT (FA# 081206-1E1)
STRESS: ESD-CHARGE DEVICE MODEL (500V)
CYWB0226ABS (7C07101BK) 4818850
610821607
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V
CYWB0226ABS (7C07101BK) 4818850
610821607
CML-RA
STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA)
CYWB0226ABS (7C07101BK) 4818850
610821607
CML-RA
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3
CYWB0226ABS (7C07101BK) 4818850
610821607
CML-RA
500
77
0
CYWB0226ABS (7C07101BK) 4818850
610821607
CML-RA
1000
77
0
Company Confidential
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Page 12 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 083204
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ESD-CHARGE DEVICE MODEL (500V)
CYWB0224ABS (7C07101CK) 4838923
610846743
CML-RA
COMP
9
0
8
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V
CYWB0224ABS (7C07101CK) 4838923
610846743
CML-RA
COMP
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max)
CYWB0224ABS (7C07101CK) 4838923
610846743
CML-RA
96
1716
0
STRESS: SORT YIELD
7C07101CK
4838923
COMPARABLE
Company Confidential
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Page 13 of 15
Document No. 001-61381 Rev. *A
ECN #:4005056
Reliability Test Data
QTP #: 100805
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
4912526
611014764
N/A
COMPARABLE
4912526
611014764
N/A
COMPARABLE
Samp
Rej
Failure Mechanism
STRESS: SORT YIELD
CYWB0320ABX-FDXIT
STRESS: CLASS YIELD
CYWB0320ABX-FDXIT
Company Confidential
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Page 14 of 15
Document No.001-61381 Rev. *A
ECN #: 4005056
Document History Page
Document Title:
REPORT
Document Number:
QTP#083204: WEST BRIDGE ASTORIA-SWITCH (7C07101C) AT FAB 5 QUALIFICATION
001-61381
Rev. ECN
Orig. of
No.
Change
**
2927399 NSR
*A
4005056 NSR
Description of Change
Initial Spec Release. Added QTP100805 data to the original report
(reference memo HGA-686).
Removed VERSION 2.0 in the title page.
Removed reference Cypress Specs in reliability tests performed table
and added the reference industry standards.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 15 of 15