QTP#134002:PSOC CAPSENSE CONTROLLER DEVICE FAMILY CY8C20055 S8DIN-5R, FAB 4 CMI

Document No. 001-90444 Rev. *B
ECN #: 4596444
Cypress Semiconductor
Product Qualification Report
QTP # 134002 VERSION*B
December 2014
PSoC Capsense Controller Device Family
S8DIN-5R, Fab 4 CMI
CY8C20055
1.8V Capsense Controller with SmartSense Autotuning (16QFN/16SOIC 8K flash/1KB SRAM option)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Zhaomin Ji
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
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Page 1 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
PRODUCT QUALIFICATION HISTORY
QTP
Number
083401
091801
134002
Description of Qualification Purpose
Qualify SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC
Device
Qualify 2um Top Metal-3 Process on S8DI-5R Technology at CMI
Using 8C20066EC Rev. E1 (Note: For marketing part number
with ‘A’)
Qualification of Capsense (CY8C20055) Device in Fab 4 CMI on S8DIN5R Process.
Company Confidential
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Page 2 of 14
Date
Jan 09
Sep 09
Dec 13
Document No. 001-90444 Rev. *B
ECN #: 4596444
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: Qualification of Capsense (CY8C20055) Device in Fab 4 CMI on S8DIN-5R Process
Marketing Part #:
CY8C20055
Device Description:
1.7V – 5.5V Industrial 24MHz Programmable System on a Chip
Cypress Division:
Cypress Semiconductor – Programmable Systems Division
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number of Metal Layers:
3
Metal Composition:
Metal 1: 100A Ti / 3,200A Al 0.5%Cu / 300A TiW
Metal 2: 100A Ti / 3,200A Al 0.5%Cu / 300A TiW
Metal 3: 500A Ti / 20,000A Al 0.5%Cu / 300A TiW
Passivation Type and Thickness:
9000A Si3N4 / 1000A SiO2
Generic Process Technology/Design Rule (-drawn): S8, 0.13um
Gate Oxide Material/Thickness (MOS):
SiO2/120A & SiO2/32A
Name/Location of Die Fab (prime) Facility:
Fab 4, CMI-Minnesota
Die Fab Line ID/Wafer Process ID:
FAB4 / S8DIN-5R
PACKAGE AVAILABILITY
PACKAGE
ASSEMBLY FACILITY SITE
16-Lead QFN
ASE-Taiwan
16-Lead SOIC
CML-RA, OSE-Taiwan
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Page 3 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
LQ48
48-Lead Saw Quad Flat No Lead (QFN)
Nitto GE7470
Mold Compound Flammability Rating:
V-O per UL94
Oxygen Rating Index:
None
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation
Method/Metallization:
Backgrind
Die Separation Method:
Blade Sawing
Die Attach Supplier:
Henkel
Die Attach Material:
QMI519
Die Attach Method:
Die Attach Epoxy
Bond Diagram Designation:
001-72720
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au/0.8 mil
Thermal Resistance Theta JA °C/W:
46°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
11-21099
Name/Location of Assembly (prime) facility:
CML-RA
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
16-Lead QFN: CML-R, ASE-Taiwan, KYEC-Taiwan
16-Lead SOIC: CML-R, CML-RA, KYEC-Taiwan
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
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Page 4 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life Early
Failure Rate
High Temperature Operating Life Latent
Failure Rate
High Temperature Steady State life
Low Temperature Operating Life
High Accelerated Saturation Test (HAST)
Temperature Cycle
Pressure Cooker
Acoustic Microscopy
Age Bond Strength
Ball Shear
Constructional Analysis
Current Density
Data Retention
Test Condition (Temp/Bias)
Dynamic Operating Condition, Vcc Max=2.1V, 150°C
JESD22-A108
Dynamic Operating Condition, Vcc Max=2.1V, 150°C
JESD22-A108
150°C, 2.1V, Vcc Max
JESD22-A108
-30°C, 2.1V
JESD22-A108
JEDEC STD 22-A110: 130°C, 5.25V, 85%RH
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C
JESD22-A102
121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C
200C, 4hrs
MIL-STD-883, Method 883-2011
JESD22-B116
Criteria: Meet external and internal characteristics of
Cypress package
Meets the Technology Device Level Reliability Specifications
150°C, No Bias
JESD22-A117 and JESD22-A103
125C, 8.5V
JESD78
Dynamic Latch-up
Result
P/F
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V / 3300V
JESD22, Method A114
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
JESD22-C101
P
Electrostatic Discharge
P
Machine Model (ESD-MM)
200V, 220V, 275V, 330V
JESD22-A115
Endurance Test
MIL-STD-883, Method 883-1033
P
Static Latch-up
125C, +/- 200mA
JESD 78
P
SEM Analysis
MIL-STD-883, Method 2018
P
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Page 5 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life
Early Failure Rate
1,2
High Temperature Operating Life
Long Term Failure Rate
3
3
3
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
AF3
Failure Rate
5, 516 Device
1
N/A
N/A
181 PPM
585, 000 DHRs
0
0.7
170
9 FIT
Assuming an ambient temperature of 55C and a junction temperature rise of 15C.
Chi-squared 60% estimations used to calculate the failure rate.
Thermal Acceleration Factor is calculated from the Arrhenius equation
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
where:
EA =The Activation Energy of the defect mechanism.
-5
K = Boltzmann’s constant = 8.62x10 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the
device at use conditions.
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Page 6 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Reliability Test Data
QTP #: 083401
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA COMP
15
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA COMP
15
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA COMP
15
0
STRESS: AGE BOND STRENGTH
CY8C20566 (8C20566AC)
4827949
610844164
CML-R
COMP
3
0
CY8C20466 (8C20466AC)
4804681
610822808
Malaysia-CA COMP
3
0
CY8C20666 (8C20666AC)
4836589
610852813
Malaysia-CA COMP
3
0
STRESS: DATA RETENTION, PLASTIC, 150C
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
1000
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
78
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
1000
78
0
CY8C20566 (8C20566AC)
4836589
610851914
CML-R
500
78
0
CY8C20566 (8C20566AC)
4836589
610851914
CML-R
1000
78
0
CY8C20566 (8C20566AC)
4810486
610830786
CML-R
168
77
0
CY8C20566 (8C20566AC)
4815537
610835437
CML-R
168
77
0
CY8C20566 (8C20566AC)
4827949
610844164
CML-R
168
79
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
168
78
0
CY8C20566 (8C20566AC)
4836589
610851914
CML-R
168
76
0
STRESS: ENDURANCE
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
500
9
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
9
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
9
0
N/A
N/A
COMP
1
0
STRESS:
SEM CROSS SECTION
CY8C20066 (8C20066AC)
4810486
STRESS: STATIC LATCH-UP (85C, 8.25V)
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA COMP
6
0
CY8C20666 (8C20666AC)
4836589
610852813
Malaysia-CA COMP
6
0
CY8C20666 (8C20666AC)
4837410
410.23.02
Promex
COMP
6
0
Company Confidential
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Page 7 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Reliability Test Data
QTP #: 083401
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
2200
8
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
2200
8
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
2200
8
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (3,300V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
3300
3
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
3300
3
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
3300
3
0
STRESS: ESD-MACHINE MODEL, (200V)
CY8C20236A (8C202662A) 4126494
611143319
KOREA-L
200
5
0
CY8C20236A (8C202662A) 4125077
611143627
PHIL-MB
200
5
0
STRESS: ESD-MACHINE MODEL, (220V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
220
6
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
220
6
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
220
6
0
STRESS: ESD-MACHINE MODEL, (275V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
275
3
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
275
3
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
275
3
0
STRESS: ESD-MACHINE MODEL, (330V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
330
3
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
330
3
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
330
3
0
STRESS: DYNAMIC LATCH-UP (125C, 8.5V)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA COMP
5
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA COMP
5
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA COMP
5
0
Company Confidential
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Page 8 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Reliability Test Data
QTP #: 083401
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max)
CY8C20566 (8C20566AC)
4827949
610844164
CML-R
48
1002
0
CY8C20566 (8C20566AC)
4815537
610835437
CML-R
48
1008
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
48
1004
1
CY8C20466 (8C20466AC)
4836589
610851747
Malaysia-CA
48
1004
0
STRESS:
Read NV Latch (1)
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max)
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
48
45
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
48
45
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
96
45
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max)
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
80
390
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
390
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
80
390
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
390
0
CY8C20466 (8C20466AC)
4836589
610851747
Malaysia-CA
80
390
0
CY8C20466 (8C20466AC)
4836589
610851747
Malaysia-CA
500
390
0
STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
80
77
0
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
80
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
168
77
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
80
77
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
168
77
0
STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V
CY8C20566 (8C20566AC)
4815537
610835437
CML-R
500
77
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
500
77
0
(1)
Destroyed during failure analysis
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Page 9 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Reliability Test Data
QTP #: 083401
Device
Fab Lot # Assy Lot #
Assy Lot
Duration
Samp
Rej
Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
128
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
128
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
256
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
128
77
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
333
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
288
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
288
77
0
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
1000
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
1000
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
1000
77
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 10 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Reliability Test Data
QTP #: 091801
Device
Fab Lot # Assy Lot #
Assy Lot
Duration
Samp
Rej
Failure Mechanism
STRESS: AGED BOND
CY8C20466 (8C204662AC) 4909973
610916428
Malaysia-CA COMP
3
0
CY8C20466 (8C204662AC) 4909973
610921200
Malaysia-CA COMP
3
0
CY8C20466 (8C204662AC) 4909973
610916429
Malaysia-CA COMP
10
0
CY8C20466 (8C204662AC) 4909973
610921200
Malaysia-CA COMP
10
0
Malaysia-CA COMP
5
0
STRESS: BALL SHEAR
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C20466 (8C204662AC) 4909973
610916428
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max)
CY8C20466 (8C204662AC) 4909973
610916428
Malaysia-CA
48
748
0
CY8C20466 (8C204662AC) 4909973
610921200
Malaysia-CA
48
750
0
STRESS:
ESD-CHARGE DEVICE MODEL (500V)
CY8C20066 (8C200662AC) 4909973
610916427
Malaysia-CA COMP
9
0
CY8C20466 (8C204662AC) 4909973
610921200
Malaysia-CA COMP
9
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V)
CY8C20066 (8C200662AC) 4909973
610916427
Malaysia-CA COMP
8
0
CY8C20466 (8C204662AC) 4909973
610921200
Malaysia-CA COMP
8
0
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C20466 (8C204662AC) 4909973
610916428
Malaysia-CA
128
76
0
CY8C20466 (8C204662AC) 4909973
610921200
Malaysia-CA
128
77
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C20466 (8C204662AC) 4909973
610916428
Malaysia-CA
168
77
0
CY8C20466 (8C204662AC) 4909973
610916428
Malaysia-CA
288
77
0
CY8C20066 (8C200662AC) 4909973
610921199
Malaysia-CA
168
77
0
CY8C20066 (8C200662AC) 4909973
610921199
Malaysia-CA
288
77
0
Malaysia-CA COMP
6
0
STRESS: STATIC LATCH-UP 85C, 5.25V, ±200mA)
CY8C20066 (8C200662AC) 4909973
610916427
Company Confidential
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Page 11 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Reliability Test Data
QTP #: 091801
Device
Fab Lot # Assy Lot #
Assy Lot
Duration
Samp
Rej
Failure Mechanism
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3)
CY8C20466 (8C204662AC) 4909973
610916428
Malaysia-CA
500
77
0
CY8C20466 (8C204662AC) 4909973
610916428
Malaysia-CA
1000
77
0
CY8C20066 (8C200662AC) 4909973
610921199
Malaysia-CA
500
77
0
Company Confidential
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Page 12 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Reliability Test Data
QTP #: 134002
Device
STRESS:
Fab Lot # Assy Lot #
Assy Lot
Duration
Samp
Rej
Failure Mechanism
ESD-CHARGE DEVICE MODEL, (500V)
CY8C20055
4307375
611309526
CML-RA
COMP
9
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V)
CY8C20055
4307375
611309526
CML-RA
COMP
8
0
CML-RA
COMP
6
0
STRESS: STATIC LATCH-UP (85C, 8.25V, 140mA)
CY8C20055
4307375
611309526
Company Confidential
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Page 13 of 14
Document No. 001-90444 Rev. *B
ECN #: 4596444
Document History Page
Document Title:
Document Number:
Rev. ECN
No.
**
4596444
*A
4258505
QTP#134002: PSoC Capsense Controller Device Family "CY8C20055" S8DIN-5R, Fab 4 CMI
001-90444
Orig. of
Change
HSTO
HSTO
*B
4596444 HSTO
Distribution: WEB
Posting:
Description of Change
Initial Spec Release
Update the “TECHNOLOGY/FAB PROCESS DESCRIPTION” table in
page 3.
Align qualification report based on the new template in the front page
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 14 of 14
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