Document No. 001-90444 Rev. *B ECN #: 4596444 Cypress Semiconductor Product Qualification Report QTP # 134002 VERSION*B December 2014 PSoC Capsense Controller Device Family S8DIN-5R, Fab 4 CMI CY8C20055 1.8V Capsense Controller with SmartSense Autotuning (16QFN/16SOIC 8K flash/1KB SRAM option) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 PRODUCT QUALIFICATION HISTORY QTP Number 083401 091801 134002 Description of Qualification Purpose Qualify SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC Device Qualify 2um Top Metal-3 Process on S8DI-5R Technology at CMI Using 8C20066EC Rev. E1 (Note: For marketing part number with ‘A’) Qualification of Capsense (CY8C20055) Device in Fab 4 CMI on S8DIN5R Process. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 14 Date Jan 09 Sep 09 Dec 13 Document No. 001-90444 Rev. *B ECN #: 4596444 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualification of Capsense (CY8C20055) Device in Fab 4 CMI on S8DIN-5R Process Marketing Part #: CY8C20055 Device Description: 1.7V – 5.5V Industrial 24MHz Programmable System on a Chip Cypress Division: Cypress Semiconductor – Programmable Systems Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 3 Metal Composition: Metal 1: 100A Ti / 3,200A Al 0.5%Cu / 300A TiW Metal 2: 100A Ti / 3,200A Al 0.5%Cu / 300A TiW Metal 3: 500A Ti / 20,000A Al 0.5%Cu / 300A TiW Passivation Type and Thickness: 9000A Si3N4 / 1000A SiO2 Generic Process Technology/Design Rule (-drawn): S8, 0.13um Gate Oxide Material/Thickness (MOS): SiO2/120A & SiO2/32A Name/Location of Die Fab (prime) Facility: Fab 4, CMI-Minnesota Die Fab Line ID/Wafer Process ID: FAB4 / S8DIN-5R PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE 16-Lead QFN ASE-Taiwan 16-Lead SOIC CML-RA, OSE-Taiwan Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: LQ48 48-Lead Saw Quad Flat No Lead (QFN) Nitto GE7470 Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Blade Sawing Die Attach Supplier: Henkel Die Attach Material: QMI519 Die Attach Method: Die Attach Epoxy Bond Diagram Designation: 001-72720 Wire Bond Method: Thermosonic Wire Material/Size: Au/0.8 mil Thermal Resistance Theta JA °C/W: 46°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: 16-Lead QFN: CML-R, ASE-Taiwan, KYEC-Taiwan 16-Lead SOIC: CML-R, CML-RA, KYEC-Taiwan Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Temperature Steady State life Low Temperature Operating Life High Accelerated Saturation Test (HAST) Temperature Cycle Pressure Cooker Acoustic Microscopy Age Bond Strength Ball Shear Constructional Analysis Current Density Data Retention Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc Max=2.1V, 150°C JESD22-A108 Dynamic Operating Condition, Vcc Max=2.1V, 150°C JESD22-A108 150°C, 2.1V, Vcc Max JESD22-A108 -30°C, 2.1V JESD22-A108 JEDEC STD 22-A110: 130°C, 5.25V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C JESD22-A102 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C 200C, 4hrs MIL-STD-883, Method 883-2011 JESD22-B116 Criteria: Meet external and internal characteristics of Cypress package Meets the Technology Device Level Reliability Specifications 150°C, No Bias JESD22-A117 and JESD22-A103 125C, 8.5V JESD78 Dynamic Latch-up Result P/F P P P P P P P P P P P P P P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V / 3300V JESD22, Method A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Electrostatic Discharge P Machine Model (ESD-MM) 200V, 220V, 275V, 330V JESD22-A115 Endurance Test MIL-STD-883, Method 883-1033 P Static Latch-up 125C, +/- 200mA JESD 78 P SEM Analysis MIL-STD-883, Method 2018 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate 1,2 High Temperature Operating Life Long Term Failure Rate 3 3 3 Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate 5, 516 Device 1 N/A N/A 181 PPM 585, 000 DHRs 0 0.7 170 9 FIT Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R COMP 3 0 CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 STRESS: STATIC LATCH-UP (85C, 8.25V) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4837410 410.23.02 Promex COMP 6 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (3,300V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 3300 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 3300 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 3300 3 0 STRESS: ESD-MACHINE MODEL, (200V) CY8C20236A (8C202662A) 4126494 611143319 KOREA-L 200 5 0 CY8C20236A (8C202662A) 4125077 611143627 PHIL-MB 200 5 0 STRESS: ESD-MACHINE MODEL, (220V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 220 6 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 220 6 0 STRESS: ESD-MACHINE MODEL, (275V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 275 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 275 3 0 STRESS: ESD-MACHINE MODEL, (330V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 330 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 330 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 330 3 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 STRESS: Read NV Latch (1) HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 (1) Destroyed during failure analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Reliability Test Data QTP #: 091801 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: AGED BOND CY8C20466 (8C204662AC) 4909973 610916428 Malaysia-CA COMP 3 0 CY8C20466 (8C204662AC) 4909973 610921200 Malaysia-CA COMP 3 0 CY8C20466 (8C204662AC) 4909973 610916429 Malaysia-CA COMP 10 0 CY8C20466 (8C204662AC) 4909973 610921200 Malaysia-CA COMP 10 0 Malaysia-CA COMP 5 0 STRESS: BALL SHEAR STRESS: CONSTRUCTIONAL ANALYSIS CY8C20466 (8C204662AC) 4909973 610916428 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20466 (8C204662AC) 4909973 610916428 Malaysia-CA 48 748 0 CY8C20466 (8C204662AC) 4909973 610921200 Malaysia-CA 48 750 0 STRESS: ESD-CHARGE DEVICE MODEL (500V) CY8C20066 (8C200662AC) 4909973 610916427 Malaysia-CA COMP 9 0 CY8C20466 (8C204662AC) 4909973 610921200 Malaysia-CA COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8C20066 (8C200662AC) 4909973 610916427 Malaysia-CA COMP 8 0 CY8C20466 (8C204662AC) 4909973 610921200 Malaysia-CA COMP 8 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C204662AC) 4909973 610916428 Malaysia-CA 128 76 0 CY8C20466 (8C204662AC) 4909973 610921200 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C204662AC) 4909973 610916428 Malaysia-CA 168 77 0 CY8C20466 (8C204662AC) 4909973 610916428 Malaysia-CA 288 77 0 CY8C20066 (8C200662AC) 4909973 610921199 Malaysia-CA 168 77 0 CY8C20066 (8C200662AC) 4909973 610921199 Malaysia-CA 288 77 0 Malaysia-CA COMP 6 0 STRESS: STATIC LATCH-UP 85C, 5.25V, ±200mA) CY8C20066 (8C200662AC) 4909973 610916427 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Reliability Test Data QTP #: 091801 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C204662AC) 4909973 610916428 Malaysia-CA 500 77 0 CY8C20466 (8C204662AC) 4909973 610916428 Malaysia-CA 1000 77 0 CY8C20066 (8C200662AC) 4909973 610921199 Malaysia-CA 500 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Reliability Test Data QTP #: 134002 Device STRESS: Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism ESD-CHARGE DEVICE MODEL, (500V) CY8C20055 4307375 611309526 CML-RA COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8C20055 4307375 611309526 CML-RA COMP 8 0 CML-RA COMP 6 0 STRESS: STATIC LATCH-UP (85C, 8.25V, 140mA) CY8C20055 4307375 611309526 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 14 Document No. 001-90444 Rev. *B ECN #: 4596444 Document History Page Document Title: Document Number: Rev. ECN No. ** 4596444 *A 4258505 QTP#134002: PSoC Capsense Controller Device Family "CY8C20055" S8DIN-5R, Fab 4 CMI 001-90444 Orig. of Change HSTO HSTO *B 4596444 HSTO Distribution: WEB Posting: Description of Change Initial Spec Release Update the “TECHNOLOGY/FAB PROCESS DESCRIPTION” table in page 3. Align qualification report based on the new template in the front page None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 14