QTP 120501:PSOC5 LP DEVICE FAMILY S8P12-10P TECHNOLOGY, FAB4 CMI

Document No. 001-85637 Rev. *F
ECN #: 4343084
Cypress Semiconductor
Product Qualification Report
QTP# 120501 VERSION *F
April 2014
PSoC5 LP Device Family
S8P12-10P Technology, Fab4 CMI
CY8C5265
CY8C5266
CY8C5267
CY8C5268
CY8C5288/7
CY8C5465
CY8C5466
CY8C5467
CY8C5468
CY8C5488
CY8C5666
CY8C5667
CY8C5668
CY8C5688
CY8C5686
CY8C5687
CY8C5866
CY8C5867
CY8C5868
CY8C5886
CY8C5887
CY8C5888
PsoC® 5LP CY8C52LP Family Programmable System-on-Chip
(PsoC®)
PsoC® 5LP CY8C54LP Family Programmable System-on-Chip
(PsoC®)
PsoC® 5LP CY8C56LP Family Programmable System-on-Chip
(PsoC®)
PsoC® 5LP CY8C58LP Family Programmable System-on-Chip
(PsoC®)
PsoC® 5LP CY8C58LP Family Programmable System-on-Chip
(PsoC®)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Zhaomin Ji
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
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Page 1 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
PACKAGE/PRODUCT QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
083401
Qualify SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC
Krypton Device
Jan 09
080902
Qualification of 8C38000BC revision ES2 on S8Q-5R at CMI
Apr 10
101101
Qualification of all layer tapeout 8C38000CC device revision ES3
Feb 11
110905
114110
120501
Qualification of PsoC5 (8C55000B) New Device in Fab4 MI Using S8P-5P
technology
PsoC5 device and fab process change qualification, reduce last metal
layer to 12K Metal, and increase the oxide passivation to 10K, at Fab4
CMI using S8P- 5P technology.
PsoC5 LP 8C56000AC Device, 8P12-10P Technology in CMI-Fab 4
Company Confidential
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Page 2 of 18
Sep 11
Jan 12
Nov 12
Document No. 001-85637 Rev. *F
ECN #: 4343084
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose: To qualify PsoC5 LP (8C56000A) New Device in S8P12-10P Technology, Fab4
Marketing Part #:
CY8C526x, CY8C546x, CY8C566x, CY8C586x, CY8C5488, CY8C5288/7
Device Description:
Industrial Programmable System on a Chip in 100L TQFP and 68 QFN package
Cypress Division:
Cypress Semiconductor Corporation – Programmable Systems Division (PSD)
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number of Metal Layers:
5
Metal Composition:
Passivation Type and Thickness:
Metal 1: 100Å Ti / 3200 Å Al – 0.5%Cu / 300Å TiW
Metal 2: 100Å Ti / 3200 Å Al – 0.5%Cu / 350Å TiW
Metal 3: 150Å Ti / 7200 Å Al – 0.5%Cu / 350Å TiW
Metal 4: 150Å Ti / 7200 Å Al – 0.5%Cu / 350Å TiW
Metal 5: 300Å Ti / 12,000 Å Al –0.5%Cu/ 300Å TiW
9000Å SiO2 /5400 Å Si3N4
Generic Process Technology/Design Rule (-drawn): S8P-5P/ 0.13u
Gate Oxide Material/Thickness (MOS):
Thermal oxide / 32Å (1.8V) or 120Å (5.0V))
Name/Location of Die Fab (prime) Facility:
Cypress Semiconductor – Bloomington, MN
Die Fab Line ID/Wafer Process ID:
Fab4/ S8P12-10P
PACKAGE AVAILABILITY
ASSEMBLY FACILITY SITE
PACKAGE
100-Lead TQFP
68 – QFN
JT-China, CML-RA
CML-RA, ASE-K
Note: Package Qualification details upon request.
Company Confidential
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Page 3 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
AZ100
100L TQFP 14x14mm / Thin Quad Flatpack package
KE-G6000 / Kyocera
Mold Compound Flammability Rating:
V-O per UL94
Oxygen Rating Index:
None
Lead Frame Material:
Copper
Lead Finish, Composition
NiPdAu
Die Backside Preparation
Method/Metallization:
Backgrind
Die Separation Method:
Sawing
Die Attach Supplier:
Dexter
Die Attach Material:
QMI509
Die Attach Method:
Die Attach Epoxy
Bond Diagram Designation:
001-75839, 001-75838
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au. 0.8 mil
Thermal Resistance Theta JA °C/W:
44.66°C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
001-73775
Name/Location of Assembly (prime) facility:
CML-RA
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
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Page 4 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition (Temp/Bias)
High Temperature Operating Life
Dynamic Operating Condition, 150°C, 2.07V/2.1V, 48 Hours
Early Failure Rate (EFR)
JESD22-A108
High Temperature Operating Life
Dynamic Operating Condition, 150°C, 2.07V/2.1V, 500 Hours
Latent Failure Rate (LFR)
JESD22-A108
High Temperature Steady State life
Low Temperature Operating Life
150°C, 2.1V, Vcc Max
JESD22-A108
-30°C, 2.1V
JESD22-A108
Result P/F
P
P
P
P
Endurance
Per datasheet, JESD22-A117
P
Data Retention
JESD22-A117 and JESD22-A103, 150°C, No Bias
P
Temperature Cycle
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C, 500 Cycles
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C
P
P
(HAST)
JEDEC STD 22-A110:130°C, 85%RH, 5.5V/5.25, 128 Hours
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C
High Temp Storage
JESD22-A103: 150 C, no bias
P
Pressure Cooker
JESD22-A102: 121°C /100%RH, 168 Hours
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C
P
Acoustic Microscopy
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C
P
Aged Bond Strength
200C, 4hrs, MIL-STD-883, Method 883-2011
P
Bond Pull
MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66
P
Ball Shear
JESD22-B116, Cpk : 1.33, Ppk : 1.66
Current Density
Meets the Technology Device Level Reliability Specifications
P
Dynamic Latch-up
125°C, 8.5V
JESD78
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2200V, JESD22-A114
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V, JESD22-C101
P
High Accelerated Saturation Test
± 140mA, 85°C
Static Latch-up
P
JESD78
2
Neutron Single Latch-up (SEL)
6.26E+09 n/cm , Vccmax, 85°C, JESD89
SEM Cross Section
MIL-STD-883, Method 2018
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Page 5 of 18
<10
FITs/Device
P
Document No. 001-85637 Rev. *F
ECN #: 4343084
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life
1
Early Failure Rate
1, 2
High Temperature Operating Life
Long Term Failure Rate
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
AF3
Failure Rate
1538 Devices
0
N/A
N/A
0 PPM
1,203,080 DHRs
0
0.7
170
4 FIT
1
2
Assuming an ambient temperature of 55C and a junction temperature rise of 15C.
Chi-squared 60% estimations used to calculate the failure rate.
Thermal Acceleration Factor is calculated from the Arrhenius equation
(1)
2
3
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
where:
EA =The Activation Energy of the defect mechanism.
-5
K = Boltzmann’s constant = 8.62x10 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the
device at use conditions.
1
2
EFR PPM Failure Rate was computed based from QTP 120501 data only.
LFR FIT Rate was computed based from QTP 083401, 080902, 101101, 110905, 114110 and 120501
Company Confidential
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Page 6 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 083401
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA COMP
15
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA COMP
15
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA COMP
15
0
STRESS: AGE BOND STRENGTH
CY8C20566 (8C20566AC)
4827949
610844164
CML-R
COMP
3
0
CY8C20466 (8C20466AC)
4804681
610822808
Malaysia-CA COMP
3
0
CY8C20666 (8C20666AC)
4836589
610852813
Malaysia-CA COMP
3
0
STRESS: DATA RETENTION, PLASTIC, 150C
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
1000
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
78
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
1000
78
0
CY8C20566 (8C20566AC)
4836589
610851914
CML-R
500
78
0
CY8C20566 (8C20566AC)
4836589
610851914
CML-R
1000
78
0
CY8C20566 (8C20566AC)
4810486
610830786
CML-R
168
77
0
CY8C20566 (8C20566AC)
4815537
610835437
CML-R
168
77
0
CY8C20566 (8C20566AC)
4827949
610844164
CML-R
168
79
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
168
78
0
CY8C20566 (8C20566AC)
4836589
610851914
CML-R
168
76
0
STRESS: ENDURANCE
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
500
9
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
9
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
9
0
N/A
N/A
COMP
1
0
STRESS:
SEM CROSS SECTION
CY8C20066 (8C20066AC)
4810486
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Page 7 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 083401
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: STATIC LATCH-UP (85C, 8.25V)
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA COMP
6
0
CY8C20666 (8C20666AC)
4836589
610852813
Malaysia-CA COMP
6
0
410.23.02
Promex
6
0
CY8C20666 (8C20666AC)
4837410
COMP
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V)
CY8C20566 (8C20566AC)
4810486
610830371
CML-R
2200
8
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
2200
8
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
2200
8
0
STRESS: DYNAMIC LATCH-UP (125C, 8.5V)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA COMP
5
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA COMP
5
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA COMP
5
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max)
CY8C20566 (8C20566AC)
4827949
610844164
CML-R
48
1002
0
CY8C20566 (8C20566AC)
4815537
610835437
CML-R
48
1008
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
48
1004
1
CY8C20466 (8C20466AC)
4836589
610851747
Malaysia-CA
48
1004
0
STRESS:
Read NV Latch (1)
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max)
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
48
45
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
48
45
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
96
45
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max)
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
80
390
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
390
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
80
390
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
390
0
CY8C20466 (8C20466AC)
4836589
610851747
Malaysia-CA
80
390
0
CY8C20466 (8C20466AC)
4836589
610851747
Malaysia-CA
500
390
0
(1) Destroyed during analysis
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Page 8 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 083401
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
80
77
0
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
80
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
168
77
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
80
77
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
168
77
0
STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V
CY8C20566 (8C20566AC)
4815537
610835437
CML-R
500
77
0
CY8C20566 (8C20566AC)
4835945
610848270
CML-R
500
77
0
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
128
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
128
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
256
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
128
77
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
333
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
288
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
168
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
288
77
0
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3)
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4810486
610828990
Malaysia-CA
1000
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4815537
610834184
Malaysia-CA
1000
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
500
77
0
CY8C20466 (8C20466AC)
4835945
610847274
Malaysia-CA
1000
77
0
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Page 9 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 080902
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C3866AXI-040ES2
4931690
610940091
CML-R
COMP
15
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
COMP
15
0
CY8C3866AXI-040ES2
4937255
611000644
CML-R
COMP
15
0
STRESS: AGED BOND STRENGTH
CY8C3866AXI-040ES2
4931690
610940091
CML-R
DATA
10
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
DATA
10
0
STRESS: DATA RETENTION, 150C
CY8C3866AXI-040ES2
4931690
610940091
CML-R
1000
77
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
1000
80
0
CY8C3866AXI-040ES2
4937255
611000644
CML-R
1000
77
0
CY8C3866AXI-040ES2
4931690
610940091
CML-R
168
77
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
168
78
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
500
78
0
CY8C3866AXI-040ES2
4937255
611000644
CML-R
168
79
0
STRESS : ENDURANCE
STRESS : ESD-CHARGE DEVICE MODEL, (500V)
CY8C3866AXI-040ES2
4931690
610940091
CML-R
COMP
9
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
COMP
9
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (500V)
CY8C3866AXI-040ES2
4931690
610940091
CML-R
COMP
8
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
COMP
8
0
STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-100mA)
CY8C3866AXI-040ES2
4931690
610940091
CML-R
COMP
6
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
COMP
6
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max)
CY8C3866AXI-040ES2
4931690
610942165
CML-R
48
1000
1
SCAN, non-visual
CY8C3866AXI-040ES2
4936339
610945758
CML-R
48
1028
2
SCAN, non-visual
CY8C3866AXI-040ES2
4937255
611000644
CML-R
48
1006
0
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Page 10 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 080902
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max)
CY8C3866AXI-040ES2
4931690
610942165
CML-R
48
51
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
48
47
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max)
CY8C3866AXI-040ES2
4931690
610942165
CML-R
500
116
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
500
125
0
CY8C3866AXI-040ES2
4937255
611000644
CML-R
500
125
0
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C3866AXI-040ES2
4931690
610940091
CML-R
128
77
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
128
75
0
CML-R
1000
125
0
STRESS: LONG LIFE VERIFICATION (150C, 2.07V, Vcc Max)
CY8C3866AXI-040ES2
4937255
611000644
STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C3866AXI-040ES2
4931690
610940091
CML-R
168
77
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
168
78
0
STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HRS 30C/60%RH (MSL3)
CY8C3866AXI-040ES2
4931690
610940091
CML-R
500
77
0
CY8C3866AXI-040ES2
4936339
610945758
CML-R
500
77
0
CY8C3866AXI-040ES2
4937255
611000644
CML-R
500
77
0
CY8C3866AXI-040ES2
4937255
611000644
CML-R
1000
77
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 11 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 101101
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C3866AXI-040ES3
4014971
611030680
CML-RA
COMP
15
0
STRESS: DATA RETENTION, 150C
CY8C3866AXI-040ES3
4014971
611041229
CML-R
500
80
0
CY8C3866AXI-040ES3
4014971
611041229
CML-R
1000
80
0
CY8C3866AXI-040ES3
4014971
611041229
CML-R
168
78
0
CY8C3866AXI-040ES3
4036951
611057357
CML-R
168
79
0
COMP
9
0
COMP
8
0
COMP
6
0
STRESS : ENDURANCE
STRESS: ESD-CHARGE DEVICE MODEL, (500V)
CY8C3866AXI-040ES3
4016039-21 OFFLINE BUILD CML-R
STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (750V)
CY8C3866AXI-040ES3
4016039
611046656
CML-R
STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-140mA)
CY8C3866AXI-040ES3
4016039-21 OFFLINE BUILD CML-R
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max)
CY8C3866AXI-040ES3
4045350
611104218
CML-R
48
1549
0
CY8C3866AXI-040ES3
4045268
611104217
CML-R
48
1550
1
high via resistance
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max)
CY8C3866AXI-040ES3
4033237
611048454
CML-R
48
56
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C3866AXI-040ES3
4045350
611104218
CML-R
168
80
0
CY8C3866AXI-040ES3
4045268
611104217
CML-R
168
80
0
STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C3866AXI-040ES3
4045350
611104218
CML-R
500
80
0
CY8C3866AXI-040ES3
4045268
611104217
CML-R
500
78
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max)
CY8C3866AXI-040ES3
4045350
611104218
CML-R
500
120
0
CY8C3866AXI-040ES3
4045268
611104217
CML-R
500
120
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 12 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 110905
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C5588 (8C55881AC)
4052988
611120567
JT-CHINA
COMP
15
0
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
COMP
15
0
CY8C5568 (8C55881AC)
4112653
611122980
CML-R
COMP
15
0
STRESS: DATA RETENTION, PLASTIC, 150C
CY8C5588 (8C55881AC)
4052988
611120441
CML-R
500
77
0
CY8C5588 (8C55881AC)
4052988
611120441
CML-R
1000
77
0
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
500
80
0
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
1000
80
0
CY8C5588 (8C55881AC)
4052988
611120442
CML-R
168
78
0
CY8C5568 (8C55881AC)
4112653
611123644
JT-CHINA
168
80
0
CY8C5568 (8C55881AC)
4112653
611123644
JT-CHINA
500
80
0
STRESS: ENDURANCE
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CY8C5588 (8C55881AC)
4052988
611120442
CML-R
COMP
9
0
CY8C5588 (8C55881AC)
4052988
611120221
CML-RA
COMP
9
0
CML-R
COMP
6
0
8
0
STRESS: STATIC LATCH-UP, 100mA, 85°C, 5.5V
CY8C5568 (8C551001BC)
4113504
611138640
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (750V)
CY8C5588 (8C55881AC)
4052988
611120442
CML-R
COMP
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max)
CY8C5588 (8C55881AC)
4052988
611120441
CML-R
48
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
CY8C5568 (8C55881AC)
4112653
611122980
CML-R
STRESS:
998
0
48
957
0
48
1024
0
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125, 6V, Vcc Max)
CY8C5588 (8C55881AC)
4052988
611120441
CML-R
96
49
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 13 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 110905
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max)
CY8C5588 (8C55881AC)
4052988
611120441
CML-R
80
116
0
CY8C5588 (8C55881AC)
4052988
611120441
CML-R
500
116
0
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
80
116
0
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
500
116
0
CML-R
COMP
30
0
STRESS: PRE/POST LFR PARAMETER ASSESSMENT
CY8C5588 (8C55881AC)
4052988
611120441
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C5588 (8C55881AC)
4052988
611120221
CML-RA
128
77
0
CY8C5568 (8C550681BC)
4112653
611124413
CML-RA
128
83
0
CY8C5568 (8C550681BC)
4113504
611135561
CML-RA
128
79
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C5568 (8C55881AC)
4112653
611123644
JT-CHINA
168
77
0
CY8C5568 (8C55881AC)
4112653
611123644
JT-CHINA
288
77
0
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3)
CY8C5588 (8C55881AC)
4052988
611120567
JT-CHINA
500
77
0
CY8C5588 (8C55881AC)
4052988
611120567
JT-CHINA
1000
74
0
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
500
78
0
CY8C5588 (8C55881AC)
4102901
611121602
CML-R
1000
78
0
CY8C5568 (8C55881AC)
4112653
611122980
CML-R
500
77
0
CY8C5568 (8C55881AC)
4112653
611122980
CML-R
1000
76
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 14 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 114110
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C5568LTI (8C550681B) 4130915
611148399
CML-RA
COMP
15
0
CY8C5568AXI (8C551001B) 4130915
611150107
JT-CHINA
COMP
15
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
COMP
15
0
CY8C5568LTI (8C550681B) 4137655
611154512
CML-RA
COMP
15
0
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
COMP
10
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
COMP
10
0
CY8C5568LTI (8C550681B) 4137655
611154512
CML-RA
COMP
10
0
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
COMP
10
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
COMP
10
0
CY8C5568LTI (8C550681B) 4137655
611154512
CML-RA
COMP
10
0
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
COMP
5
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
COMP
5
0
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
COMP
9
0
CY8C5568AXI (8C551001B) 4130915
611153438
JT-CHINA
COMP
9
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
COMP
9
0
JT-CHINA
COMP
6
0
STRESS: STATIC LATCH-UP, 100mA, 85°C, 5.5V
CY8C5568AXI (8C551001B) 4130915
611150107
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (500V)
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
COMP
3
0
CY8C5568AXI (8C551001B) 4130915
611153438
JT-CHINA
COMP
8
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
COMP
8
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max)
CY8C5568AXI (8C551001B) 4130915
611150107
JT-CHINA
48
118
0
CY8C5568AXI (8C551001B) 4135316
611154627
JT-CHINA
48
1444
1
Intermittent failure
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 15 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 114110
Device
Fab Lot # Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max)
CY8C5568AXI (8C551001B) 4130915
611150107
JT-CHINA
80
118
0
CY8C5568AXI (8C551001B) 4130915
611150107
JT-CHINA
500
117
0
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3)
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
128
27
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
128
27
0
STRESS: HIGH TEMPERATURE STORAGE TEST, 150C
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
500
80
0
CY8C5568LTI (8C550681B) 4130915
611148398
CML-RA
1000
80
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C5568LTI (8C550681B) 4130915
611148399
CML-RA
168
80
0
CY8C5568LTI (8C550681B) 4130915
611148399
CML-RA
288
80
0
CY8C5568AXI (8C551001B) 4130915
611153438
JT-CHINA
168
37
0
CY8C5568AXI (8C551001B) 4130915
611153438
JT-CHINA
288
37
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
168
80
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
288
80
0
611148398
CML-RA
COMP
2
0
STRESS: SEM X-SECTION
CY8C5568LTI (8C550681B) 4130915
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3)
CY8C5568LTI (8C550681B) 4130915
611148399
CML-RA
500
80
0
CY8C5568LTI (8C550681B) 4130915
611148399
CML-RA
1000
74
0
CY8C5568AXI (8C551001B) 4130915
611150107
JT-CHINA
500
80
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
500
77
0
CY8C5568LTI (8C550681B) 4137655
611154512
CML-RA
500
84
0
CY8C5568LTI (8C550681B) 4130915
611148399
CML-RA
500
5
0
CY8C5568LTI (8C550681B) 4130915
611148399
CML-RA
1000
5
0
CY8C5568AXI (8C551001B) 4130915
611150107
JT-CHINA
500
1
0
CY8C5568LTI (8C550681B) 4135316
611153052
CML-RA
500
5
0
CY8C5568LTI (8C550681B) 4137655
611154512
CML-RA
500
5
0
STRESS: POST TCT X-SECTION
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 16 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Reliability Test Data
QTP #: 120501
Device
Fab Lot #
Assy Lot #
Assy Loc Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY8C5888AXI (8C561001A) 4221483
611221588
CML-RA
COMP
15
0
STRESS: DATA RETENTION, PLASTIC, 150C
CY8C5888AXI (8C561001A) 4221483
611221588
CML-RA
500
85
0
CY8C5888AXI (8C561001A) 4221483
611221588
CML-RA
1000
85
0
STRESS:
ESD-CHARGE DEVICE MODEL, (500V)
CY8C5888AXI (8C561001A) 4221483
611221588
CML-RA
COMP
9
0
CY8C5868LTI (8C560681A) 4223514
611224643
CML-RA
COMP
9
0
CML-RA
COMP
6
0
8
0
STRESS: STATIC LATCH-UP, 140mA, 85°C
CY8C5888AXI (8C561001A) 4221483
611221588
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2200V)
CY8C5888AXI (8C561001A) 4221483
STRESS:
611221588
CML-RA
COMP
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 2.07V, Vcc Max)
CY8C5868AXI (8C561001A) 4223514
611224639/4640 CML-RA
48
53
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max)
CY8C5868AXI (8C561001A) 4223514
611224639/4640 CML-RA
48
1538
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max)
CY8C5868AXI (8C561001A) 4223514
611224639/4640 CML-RA
80
126
0
CY8C5868AXI (8C561001A) 4223514
611224639/4640 CML-RA
500
126
0
611224639/4640 CML-RA
COMP
30
0
CY8C5868AXI (8C561001A) 4223514
611224639/4640 CML-RA
168
79
0
CY8C5868AXI (8C561001A) 4223514
611224639/4640 CML-RA
192
79
0
CY8C5868AXI (8C561001A) 4223514
611224639/4640 CML-RA
500
79
0
STRESS: PRE/POST LFR PARAMETER ASSESSMENT
CY8C5868AXI (8C561001A) 4223514
STRESS: ENDURANCE
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY8C5888AXI (8C561001A) 4221483
611221588
CML-RA
168
79
0
STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3)
CY8C5888AXI (8C561001A) 4221483
611221588
CML-RA
500
80
0
CY8C5888AXI (8C561001A) 4221483
611221588
CML-RA
1000
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 17 of 18
Document No. 001-85637 Rev. *F
ECN #: 4343084
Document History Page
Document Title:
Document Number:
Rev. ECN
No.
**
3864500
*A
3919420
QTP 120501: PSOC5 LP DEVICE FAMILY S8P12-10P TECHNOLOGY, FAB4 CMI
001-85637
Orig. of
Change
NSR
ILZ
*B
4002680 ZIJ
*C
4024711 NSR
*D
4246966 JYF
*E
4319808 HSTO
*F
4343084 HSTO
Description of Change
Initial Spec Release
Added ASE-K as additional assembly site on Package Availability
section on Page 3
Include PRE/POST LFR PARAMETER ASSESSMENT data in the
reliability database page 14.
Delete redundant devices CY8C5866, CY8C5867, CY8C5868 in front
page.
Sunset Review:
Updated Reliability Tests Performed table to standard template.
Align qualification report based on the new template in the front page
Added device CY8C5288/7 and CY8C5488 in the cover page and
page3 at Marketing Part# in reference to memo UVS-730.
Updated Static Latch-Up and ESD-HBM test condition in page 5.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 18 of 18
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