Document No. 001-85637 Rev. *F ECN #: 4343084 Cypress Semiconductor Product Qualification Report QTP# 120501 VERSION *F April 2014 PSoC5 LP Device Family S8P12-10P Technology, Fab4 CMI CY8C5265 CY8C5266 CY8C5267 CY8C5268 CY8C5288/7 CY8C5465 CY8C5466 CY8C5467 CY8C5468 CY8C5488 CY8C5666 CY8C5667 CY8C5668 CY8C5688 CY8C5686 CY8C5687 CY8C5866 CY8C5867 CY8C5868 CY8C5886 CY8C5887 CY8C5888 PsoC® 5LP CY8C52LP Family Programmable System-on-Chip (PsoC®) PsoC® 5LP CY8C54LP Family Programmable System-on-Chip (PsoC®) PsoC® 5LP CY8C56LP Family Programmable System-on-Chip (PsoC®) PsoC® 5LP CY8C58LP Family Programmable System-on-Chip (PsoC®) PsoC® 5LP CY8C58LP Family Programmable System-on-Chip (PsoC®) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 083401 Qualify SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC Krypton Device Jan 09 080902 Qualification of 8C38000BC revision ES2 on S8Q-5R at CMI Apr 10 101101 Qualification of all layer tapeout 8C38000CC device revision ES3 Feb 11 110905 114110 120501 Qualification of PsoC5 (8C55000B) New Device in Fab4 MI Using S8P-5P technology PsoC5 device and fab process change qualification, reduce last metal layer to 12K Metal, and increase the oxide passivation to 10K, at Fab4 CMI using S8P- 5P technology. PsoC5 LP 8C56000AC Device, 8P12-10P Technology in CMI-Fab 4 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 18 Sep 11 Jan 12 Nov 12 Document No. 001-85637 Rev. *F ECN #: 4343084 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: To qualify PsoC5 LP (8C56000A) New Device in S8P12-10P Technology, Fab4 Marketing Part #: CY8C526x, CY8C546x, CY8C566x, CY8C586x, CY8C5488, CY8C5288/7 Device Description: Industrial Programmable System on a Chip in 100L TQFP and 68 QFN package Cypress Division: Cypress Semiconductor Corporation – Programmable Systems Division (PSD) TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Composition: Passivation Type and Thickness: Metal 1: 100Å Ti / 3200 Å Al – 0.5%Cu / 300Å TiW Metal 2: 100Å Ti / 3200 Å Al – 0.5%Cu / 350Å TiW Metal 3: 150Å Ti / 7200 Å Al – 0.5%Cu / 350Å TiW Metal 4: 150Å Ti / 7200 Å Al – 0.5%Cu / 350Å TiW Metal 5: 300Å Ti / 12,000 Å Al –0.5%Cu/ 300Å TiW 9000Å SiO2 /5400 Å Si3N4 Generic Process Technology/Design Rule (-drawn): S8P-5P/ 0.13u Gate Oxide Material/Thickness (MOS): Thermal oxide / 32Å (1.8V) or 120Å (5.0V)) Name/Location of Die Fab (prime) Facility: Cypress Semiconductor – Bloomington, MN Die Fab Line ID/Wafer Process ID: Fab4/ S8P12-10P PACKAGE AVAILABILITY ASSEMBLY FACILITY SITE PACKAGE 100-Lead TQFP 68 – QFN JT-China, CML-RA CML-RA, ASE-K Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: AZ100 100L TQFP 14x14mm / Thin Quad Flatpack package KE-G6000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Sawing Die Attach Supplier: Dexter Die Attach Material: QMI509 Die Attach Method: Die Attach Epoxy Bond Diagram Designation: 001-75839, 001-75838 Wire Bond Method: Thermosonic Wire Material/Size: Au. 0.8 mil Thermal Resistance Theta JA °C/W: 44.66°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-73775 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) High Temperature Operating Life Dynamic Operating Condition, 150°C, 2.07V/2.1V, 48 Hours Early Failure Rate (EFR) JESD22-A108 High Temperature Operating Life Dynamic Operating Condition, 150°C, 2.07V/2.1V, 500 Hours Latent Failure Rate (LFR) JESD22-A108 High Temperature Steady State life Low Temperature Operating Life 150°C, 2.1V, Vcc Max JESD22-A108 -30°C, 2.1V JESD22-A108 Result P/F P P P P Endurance Per datasheet, JESD22-A117 P Data Retention JESD22-A117 and JESD22-A103, 150°C, No Bias P Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C, 500 Cycles Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C P P (HAST) JEDEC STD 22-A110:130°C, 85%RH, 5.5V/5.25, 128 Hours Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C High Temp Storage JESD22-A103: 150 C, no bias P Pressure Cooker JESD22-A102: 121°C /100%RH, 168 Hours Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C P Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30°C /60%RH+ Reflow, 260°C +0, -5°C P Aged Bond Strength 200C, 4hrs, MIL-STD-883, Method 883-2011 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 Current Density Meets the Technology Device Level Reliability Specifications P Dynamic Latch-up 125°C, 8.5V JESD78 P Electrostatic Discharge Human Body Model (ESD-HBM) 2200V, JESD22-A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V, JESD22-C101 P High Accelerated Saturation Test ± 140mA, 85°C Static Latch-up P JESD78 2 Neutron Single Latch-up (SEL) 6.26E+09 n/cm , Vccmax, 85°C, JESD89 SEM Cross Section MIL-STD-883, Method 2018 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 18 <10 FITs/Device P Document No. 001-85637 Rev. *F ECN #: 4343084 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life 1 Early Failure Rate 1, 2 High Temperature Operating Life Long Term Failure Rate Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate 1538 Devices 0 N/A N/A 0 PPM 1,203,080 DHRs 0 0.7 170 4 FIT 1 2 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation (1) 2 3 E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 1 2 EFR PPM Failure Rate was computed based from QTP 120501 data only. LFR FIT Rate was computed based from QTP 083401, 080902, 101101, 110905, 114110 and 120501 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R COMP 3 0 CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP (85C, 8.25V) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 410.23.02 Promex 6 0 CY8C20666 (8C20666AC) 4837410 COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 STRESS: Read NV Latch (1) HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 (1) Destroyed during analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 080902 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C3866AXI-040ES2 4931690 610940091 CML-R COMP 15 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R COMP 15 0 CY8C3866AXI-040ES2 4937255 611000644 CML-R COMP 15 0 STRESS: AGED BOND STRENGTH CY8C3866AXI-040ES2 4931690 610940091 CML-R DATA 10 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R DATA 10 0 STRESS: DATA RETENTION, 150C CY8C3866AXI-040ES2 4931690 610940091 CML-R 1000 77 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 1000 80 0 CY8C3866AXI-040ES2 4937255 611000644 CML-R 1000 77 0 CY8C3866AXI-040ES2 4931690 610940091 CML-R 168 77 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 168 78 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 500 78 0 CY8C3866AXI-040ES2 4937255 611000644 CML-R 168 79 0 STRESS : ENDURANCE STRESS : ESD-CHARGE DEVICE MODEL, (500V) CY8C3866AXI-040ES2 4931690 610940091 CML-R COMP 9 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (500V) CY8C3866AXI-040ES2 4931690 610940091 CML-R COMP 8 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R COMP 8 0 STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-100mA) CY8C3866AXI-040ES2 4931690 610940091 CML-R COMP 6 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R COMP 6 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY8C3866AXI-040ES2 4931690 610942165 CML-R 48 1000 1 SCAN, non-visual CY8C3866AXI-040ES2 4936339 610945758 CML-R 48 1028 2 SCAN, non-visual CY8C3866AXI-040ES2 4937255 611000644 CML-R 48 1006 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 080902 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max) CY8C3866AXI-040ES2 4931690 610942165 CML-R 48 51 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 48 47 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C3866AXI-040ES2 4931690 610942165 CML-R 500 116 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 500 125 0 CY8C3866AXI-040ES2 4937255 611000644 CML-R 500 125 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C3866AXI-040ES2 4931690 610940091 CML-R 128 77 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 128 75 0 CML-R 1000 125 0 STRESS: LONG LIFE VERIFICATION (150C, 2.07V, Vcc Max) CY8C3866AXI-040ES2 4937255 611000644 STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY8C3866AXI-040ES2 4931690 610940091 CML-R 168 77 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 168 78 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HRS 30C/60%RH (MSL3) CY8C3866AXI-040ES2 4931690 610940091 CML-R 500 77 0 CY8C3866AXI-040ES2 4936339 610945758 CML-R 500 77 0 CY8C3866AXI-040ES2 4937255 611000644 CML-R 500 77 0 CY8C3866AXI-040ES2 4937255 611000644 CML-R 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 101101 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C3866AXI-040ES3 4014971 611030680 CML-RA COMP 15 0 STRESS: DATA RETENTION, 150C CY8C3866AXI-040ES3 4014971 611041229 CML-R 500 80 0 CY8C3866AXI-040ES3 4014971 611041229 CML-R 1000 80 0 CY8C3866AXI-040ES3 4014971 611041229 CML-R 168 78 0 CY8C3866AXI-040ES3 4036951 611057357 CML-R 168 79 0 COMP 9 0 COMP 8 0 COMP 6 0 STRESS : ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C3866AXI-040ES3 4016039-21 OFFLINE BUILD CML-R STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (750V) CY8C3866AXI-040ES3 4016039 611046656 CML-R STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-140mA) CY8C3866AXI-040ES3 4016039-21 OFFLINE BUILD CML-R STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY8C3866AXI-040ES3 4045350 611104218 CML-R 48 1549 0 CY8C3866AXI-040ES3 4045268 611104217 CML-R 48 1550 1 high via resistance STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max) CY8C3866AXI-040ES3 4033237 611048454 CML-R 48 56 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY8C3866AXI-040ES3 4045350 611104218 CML-R 168 80 0 CY8C3866AXI-040ES3 4045268 611104217 CML-R 168 80 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CY8C3866AXI-040ES3 4045350 611104218 CML-R 500 80 0 CY8C3866AXI-040ES3 4045268 611104217 CML-R 500 78 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C3866AXI-040ES3 4045350 611104218 CML-R 500 120 0 CY8C3866AXI-040ES3 4045268 611104217 CML-R 500 120 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 110905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C5588 (8C55881AC) 4052988 611120567 JT-CHINA COMP 15 0 CY8C5588 (8C55881AC) 4102901 611121602 CML-R COMP 15 0 CY8C5568 (8C55881AC) 4112653 611122980 CML-R COMP 15 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C5588 (8C55881AC) 4052988 611120441 CML-R 500 77 0 CY8C5588 (8C55881AC) 4052988 611120441 CML-R 1000 77 0 CY8C5588 (8C55881AC) 4102901 611121602 CML-R 500 80 0 CY8C5588 (8C55881AC) 4102901 611121602 CML-R 1000 80 0 CY8C5588 (8C55881AC) 4052988 611120442 CML-R 168 78 0 CY8C5568 (8C55881AC) 4112653 611123644 JT-CHINA 168 80 0 CY8C5568 (8C55881AC) 4112653 611123644 JT-CHINA 500 80 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C5588 (8C55881AC) 4052988 611120442 CML-R COMP 9 0 CY8C5588 (8C55881AC) 4052988 611120221 CML-RA COMP 9 0 CML-R COMP 6 0 8 0 STRESS: STATIC LATCH-UP, 100mA, 85°C, 5.5V CY8C5568 (8C551001BC) 4113504 611138640 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (750V) CY8C5588 (8C55881AC) 4052988 611120442 CML-R COMP STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8C5588 (8C55881AC) 4052988 611120441 CML-R 48 CY8C5588 (8C55881AC) 4102901 611121602 CML-R CY8C5568 (8C55881AC) 4112653 611122980 CML-R STRESS: 998 0 48 957 0 48 1024 0 HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125, 6V, Vcc Max) CY8C5588 (8C55881AC) 4052988 611120441 CML-R 96 49 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 110905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C5588 (8C55881AC) 4052988 611120441 CML-R 80 116 0 CY8C5588 (8C55881AC) 4052988 611120441 CML-R 500 116 0 CY8C5588 (8C55881AC) 4102901 611121602 CML-R 80 116 0 CY8C5588 (8C55881AC) 4102901 611121602 CML-R 500 116 0 CML-R COMP 30 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CY8C5588 (8C55881AC) 4052988 611120441 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C5588 (8C55881AC) 4052988 611120221 CML-RA 128 77 0 CY8C5568 (8C550681BC) 4112653 611124413 CML-RA 128 83 0 CY8C5568 (8C550681BC) 4113504 611135561 CML-RA 128 79 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5568 (8C55881AC) 4112653 611123644 JT-CHINA 168 77 0 CY8C5568 (8C55881AC) 4112653 611123644 JT-CHINA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C5588 (8C55881AC) 4052988 611120567 JT-CHINA 500 77 0 CY8C5588 (8C55881AC) 4052988 611120567 JT-CHINA 1000 74 0 CY8C5588 (8C55881AC) 4102901 611121602 CML-R 500 78 0 CY8C5588 (8C55881AC) 4102901 611121602 CML-R 1000 78 0 CY8C5568 (8C55881AC) 4112653 611122980 CML-R 500 77 0 CY8C5568 (8C55881AC) 4112653 611122980 CML-R 1000 76 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 114110 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA COMP 15 0 CY8C5568AXI (8C551001B) 4130915 611150107 JT-CHINA COMP 15 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 15 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 15 0 CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA COMP 10 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 10 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 10 0 CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA COMP 10 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 10 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 10 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA COMP 5 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 5 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA COMP 9 0 CY8C5568AXI (8C551001B) 4130915 611153438 JT-CHINA COMP 9 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 9 0 JT-CHINA COMP 6 0 STRESS: STATIC LATCH-UP, 100mA, 85°C, 5.5V CY8C5568AXI (8C551001B) 4130915 611150107 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (500V) CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA COMP 3 0 CY8C5568AXI (8C551001B) 4130915 611153438 JT-CHINA COMP 8 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 8 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8C5568AXI (8C551001B) 4130915 611150107 JT-CHINA 48 118 0 CY8C5568AXI (8C551001B) 4135316 611154627 JT-CHINA 48 1444 1 Intermittent failure Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 114110 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C5568AXI (8C551001B) 4130915 611150107 JT-CHINA 80 118 0 CY8C5568AXI (8C551001B) 4130915 611150107 JT-CHINA 500 117 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA 128 27 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 128 27 0 STRESS: HIGH TEMPERATURE STORAGE TEST, 150C CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA 500 80 0 CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA 1000 80 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 168 80 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 288 80 0 CY8C5568AXI (8C551001B) 4130915 611153438 JT-CHINA 168 37 0 CY8C5568AXI (8C551001B) 4130915 611153438 JT-CHINA 288 37 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 168 80 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 288 80 0 611148398 CML-RA COMP 2 0 STRESS: SEM X-SECTION CY8C5568LTI (8C550681B) 4130915 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 500 80 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 1000 74 0 CY8C5568AXI (8C551001B) 4130915 611150107 JT-CHINA 500 80 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 500 77 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA 500 84 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 500 5 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 1000 5 0 CY8C5568AXI (8C551001B) 4130915 611150107 JT-CHINA 500 1 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 500 5 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA 500 5 0 STRESS: POST TCT X-SECTION Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Reliability Test Data QTP #: 120501 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C5888AXI (8C561001A) 4221483 611221588 CML-RA COMP 15 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C5888AXI (8C561001A) 4221483 611221588 CML-RA 500 85 0 CY8C5888AXI (8C561001A) 4221483 611221588 CML-RA 1000 85 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C5888AXI (8C561001A) 4221483 611221588 CML-RA COMP 9 0 CY8C5868LTI (8C560681A) 4223514 611224643 CML-RA COMP 9 0 CML-RA COMP 6 0 8 0 STRESS: STATIC LATCH-UP, 140mA, 85°C CY8C5888AXI (8C561001A) 4221483 611221588 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2200V) CY8C5888AXI (8C561001A) 4221483 STRESS: 611221588 CML-RA COMP HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 2.07V, Vcc Max) CY8C5868AXI (8C561001A) 4223514 611224639/4640 CML-RA 48 53 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8C5868AXI (8C561001A) 4223514 611224639/4640 CML-RA 48 1538 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C5868AXI (8C561001A) 4223514 611224639/4640 CML-RA 80 126 0 CY8C5868AXI (8C561001A) 4223514 611224639/4640 CML-RA 500 126 0 611224639/4640 CML-RA COMP 30 0 CY8C5868AXI (8C561001A) 4223514 611224639/4640 CML-RA 168 79 0 CY8C5868AXI (8C561001A) 4223514 611224639/4640 CML-RA 192 79 0 CY8C5868AXI (8C561001A) 4223514 611224639/4640 CML-RA 500 79 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CY8C5868AXI (8C561001A) 4223514 STRESS: ENDURANCE STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5888AXI (8C561001A) 4221483 611221588 CML-RA 168 79 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C5888AXI (8C561001A) 4221483 611221588 CML-RA 500 80 0 CY8C5888AXI (8C561001A) 4221483 611221588 CML-RA 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 17 of 18 Document No. 001-85637 Rev. *F ECN #: 4343084 Document History Page Document Title: Document Number: Rev. ECN No. ** 3864500 *A 3919420 QTP 120501: PSOC5 LP DEVICE FAMILY S8P12-10P TECHNOLOGY, FAB4 CMI 001-85637 Orig. of Change NSR ILZ *B 4002680 ZIJ *C 4024711 NSR *D 4246966 JYF *E 4319808 HSTO *F 4343084 HSTO Description of Change Initial Spec Release Added ASE-K as additional assembly site on Package Availability section on Page 3 Include PRE/POST LFR PARAMETER ASSESSMENT data in the reliability database page 14. Delete redundant devices CY8C5866, CY8C5867, CY8C5868 in front page. Sunset Review: Updated Reliability Tests Performed table to standard template. Align qualification report based on the new template in the front page Added device CY8C5288/7 and CY8C5488 in the cover page and page3 at Marketing Part# in reference to memo UVS-730. Updated Static Latch-Up and ESD-HBM test condition in page 5. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 18 of 18