Document No.001-70192 Rev. *C ECN # 4450632 Cypress Semiconductor Package Qualification Report QTP# 111816 VERSION *C July 2014 56 /68 QFN (8X8X1.0 mm) NiPdAu, MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-70192 Rev. *C ECN # 4450632 PACKAGE QUALIFICATION HISTORY QTP Number 111816 Description of Qualification Purpose Qualification of 56L QFN 8X8X1 (LT56) with 6.1X6.1 Epad size, 56L QFN 8X8X1(LT56B) with 4.5X5.2 Epad size, and 68 QFN 8X8X1 (LT68) with 5.7X5.7 Epad size packages at ASEKH (G) using G631 mold compound and EN-4900 epoxy Date Jun 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-70192 Rev. *C ECN # 4450632 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT56 / LT56B / LT68 Package Outline, Type, or Name: 56 Quad Flat No-Lead / 68 Quad Flat No-Lead Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-68162 / 001-68182 / 001-68165 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 22°C/W, 13.05°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R , KYEC, ASE-ASEK (Taiwan) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-70192 Rev. *C ECN # 4450632 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Test Condition (Temp/Bias) JEDEC STD 22-A110, 130 C, 85%RH, 3.5V/5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias Result P/F P P P P P Ball Shear (2200V) JEDEC EIA/JESD22-A114-B (500V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-B116A, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf P P P P P P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22-A106B, Condition C, -55 C to 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P P P 95% solder coverage minimum X-Ray MIL-STD-883 – 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P Document No.001-70192 Rev. *C ECN # 4450632 Reliability Test Data QTP #: 111816 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN COMP 15 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN COMP 15 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN COMP 15 0 4101309 611117196 G-TAIWAN COMP 10 0 4101309 611117196 G-TAIWAN COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY7C65640A (7C65642E) STRESS: BOND PULL CY7C65640A (7C65642E) STRESS: CONSTRUCTIONAL ANALYIS CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN COMP 5 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN COMP 5 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN COMP 15 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN COMP 15 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN COMP 15 0 4101309 611117196 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: DIE SHEAR CY7C65640A (7C65642E) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY7C65640A (7C65642E) 4101309 611117196 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN STRESS: HI-ACCEL SATURATION TEST, 130C, 3.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN 128 80 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN 128 79 0 STRESS: HIGH TEMP STORAGE, 150C CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN 500 80 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-70192 Rev. *C ECN # 4450632 Reliability Test Data QTP #: 111816 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN COMP 5 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN COMP 5 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN 168 80 0 CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN 288 78 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN 168 79 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN 288 79 0 4101309 611117196 G-TAIWAN COMP 15 0 CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN COMP 3 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN COMP 3 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN COMP 3 0 STRESS: PHYSICAL DIMENSION CY7C65640A (7C65642E) STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN 500 80 0 CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN 1000 80 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN 500 79 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN 1000 79 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN 500 80 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN 1000 80 0 CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN 200 80 0 CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN 1000 80 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN 200 80 0 CP6241DMT (7C66113H) 2619577 611117175 G-TAIWAN 1000 80 0 STRESS: THERMAL SHOCK Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-70192 Rev. *C ECN # 4450632 Reliability Test Data QTP #: 111816 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C65640A (7C65642E) 4101309 611117196 G-TAIWAN COMP 15 0 CY8CLED04 (8C249925A) 5031047 611114129 G-TAIWAN COMP 15 0 Failure Mechanism STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-70192 Rev. *C ECN # 4450632 Document History Page Document Title: QTP 111816: 56 QFN (8X8X0.9 MILS), 56/68 QFN (8X8X1.0 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN Document Number: 001-70192 Rev. ECN No. ** 3283659 *A 3657926 *B *C Orig. of Change NSR NSR 4056579 HSTO 4450632 HSTO Description of Change Initial spec release Sunset Review. Remove the reference Cypress specs on the reliability test conditions and replace with the industry standards. Remove version 1.0 in the QTP# in title page. Updated test location facility based on current qualified test site. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8