QTP 112108:24 QFN (4X4X0.6MM), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN

Document No.001-70532 Rev. *C
ECN # 4450632
Cypress Semiconductor
Package Qualification Report
QTP# 112108 VERSION *C
July 2014
24 QFN (4x4x0.6mm)
NiPdAu, MSL3, 260°°C Reflow
ASEK-Taiwan (G)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-70532 Rev. *C
ECN # 4450632
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
112108
Qualification of 24QFN 4x4x0.6mm (LQ24A) package dimensions
at ASEKH (G) using G631 mold compound and EN-4900 epoxy
Jun 2011
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Document No.001-70532 Rev. *C
ECN # 4450632
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
LQ24A
Package Outline, Type, or Name:
24 Quad Flat No-Lead (4X4X0.6mm)
Mold Compound Name/Manufacturer:
G631 / Sumitomo
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index: >28%
54 (typical) / 28 (Min. value)
Lead Frame Designation:
Full Metal Pad
Lead Frame Material:
Copper /PPF
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
SAW Process
Die Attach Supplier:
Hitachi
Die Attach Material:
EN-4900
Bond Diagram Designation
001-69159
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.8mil / Au
Thermal Resistance Theta JA °C/W:
35°C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
49-41999
Name/Location of Assembly (prime) facility:
G-ASEK Taiwan
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R, KYEC, ASE-G
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-70532 Rev. *C
ECN # 4450632
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Accelerated Saturation Test
(HAST)
Pressure Cooker Test
Temperature Cycle
High Temp Storage
Electrostatic Discharge
Human Body Model (ESD-HBM)
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Acoustic Microscopy
Test Condition (Temp/Bias)
JEDEC STD 22-A110, 130 C, 85%RH, 5.5V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-A103, 150 C, no bias
Result
P/F
P
P
P
P
P
Ball Shear
(2200V)
JEDEC EIA/JESD22-A114-B
(500V)
JESD22-C101
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-B116A, Cpk : 1.33, Ppk : 1.66
Bond Pull
MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66
P
Constructional Analysis
Die Shear
Dye Penetrant Test
Criteria: Meet external and internal characteristics of
Cypress package
MIL-STD-883, Method 2019
Per die size:
• <3000 sq. mils = 1.2 kgf
• 30001-5000 sq. mils = 1.2 kgf
• >5001 sq. mils = 1.2 kgf
P
P
P
P
P
P
Internal Visual
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
MIL-STD-883-2014
Final Visual Inspection
JESD22-B101B
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Thermal Shock
MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and
JESD22-A106B, Condition C, -55 C to 125C
Solderability, Steam Aged
J-STD-002, JESD22-B102
P
P
P
95% solder coverage minimum
X-Ray
MIL-STD-883 – 2012
Company Confidential
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Page 4 of 7
P
Document No.001-70532 Rev. *C
ECN # 4450632
Reliability Test Data
QTP #: 112108
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
10
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
10
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
COMP
10
0
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
10
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
10
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
COMP
10
0
611119485
G-TAIWAN
COMP
5
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CY7C68003 (7C68330B)
4036298
STRESS: DYE PENETRATION TEST
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
COMP
15
0
G-TAIWAN
COMP
9
0
COMP
8
0
STRESS: DIE SHEAR
STRESS: ESD-CHARGE DEVICE MODEL, (500V)
CY7C68003 (7C68330B)
4036298
611119484
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8CTMA340 (8C20322D)
4103513
611119447
G-TAIWAN
128
79
0
Company Confidential
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Page 5 of 7
Document No.001-70532 Rev. *C
ECN # 4450632
Reliability Test Data
QTP #: 112108
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: HIGH TEMP STORAGE, 150C
CY7C60323 (8C214340A)
4008254
611114333
G-TAIWAN
500
80
0
CY7C60323 (8C214340A)
4008254
611114333
G-TAIWAN
1000
80
0
4036298
611119485
G-TAIWAN
COMP
5
0
STRESS: INTERNAL VISUAL
CY7C68003 (7C68330B)
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
168
80
0
STRESS: PHYSICAL DIMENSION
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
30
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
30
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
COMP
30
0
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
3
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
3
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
COMP
3
0
STRESS: SOLDERABILITY
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
500
80
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
500
80
0
CY7C68003 (7C68330B)
4036298
611119483
G-TAIWAN
500
80
0
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
200
80
0
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
1000
80
0
CY7C68003 (7C68330B)
4036298
611119485
G-TAIWAN
COMP
15
0
CY7C68003 (7C68330B)
4036298
611119484
G-TAIWAN
COMP
15
0
STRESS: THERMAL SHOCK
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-70532 Rev. *C
ECN # 4450632
Document History Page
Document Title:
Document Number:
Rev. ECN
No.
**
3283659
*A
3657926
QTP 112108: 24 QFN (4X4X0.6MM), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
001-70532
Orig. of
Change
NSR
NSR
*B
4056777 HSTO
*C
4450632 HSTO
Description of Change
Initial spec release
Sunset Review.
Remove the reference Cypress specs on the reliability test conditions
and replace with the industry standards.
Remove version 1.0 in the QTP# in title page.
Sunset Review
Updated test location facility based on current qualified test site.
Align qualification report based on the new template in the front page
Distribution: WEB
Posting:
None
Company Confidential
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Page 7 of 7
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