Document No.001-70532 Rev. *C ECN # 4450632 Cypress Semiconductor Package Qualification Report QTP# 112108 VERSION *C July 2014 24 QFN (4x4x0.6mm) NiPdAu, MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-70532 Rev. *C ECN # 4450632 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 112108 Qualification of 24QFN 4x4x0.6mm (LQ24A) package dimensions at ASEKH (G) using G631 mold compound and EN-4900 epoxy Jun 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.001-70532 Rev. *C ECN # 4450632 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ24A Package Outline, Type, or Name: 24 Quad Flat No-Lead (4X4X0.6mm) Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-69159 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 35°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R, KYEC, ASE-G Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-70532 Rev. *C ECN # 4450632 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Test Condition (Temp/Bias) JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias Result P/F P P P P P Ball Shear (2200V) JEDEC EIA/JESD22-A114-B (500V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-B116A, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf P P P P P P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22-A106B, Condition C, -55 C to 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P P P 95% solder coverage minimum X-Ray MIL-STD-883 – 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P Document No.001-70532 Rev. *C ECN # 4450632 Reliability Test Data QTP #: 112108 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 10 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 10 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN COMP 10 0 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 10 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 10 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN COMP 10 0 611119485 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY7C68003 (7C68330B) 4036298 STRESS: DYE PENETRATION TEST CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: DIE SHEAR STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY7C68003 (7C68330B) 4036298 611119484 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN 128 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-70532 Rev. *C ECN # 4450632 Reliability Test Data QTP #: 112108 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 1000 80 0 4036298 611119485 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL CY7C68003 (7C68330B) STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN 168 80 0 STRESS: PHYSICAL DIMENSION CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 30 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 30 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN COMP 30 0 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 3 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 3 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN 500 80 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN 500 80 0 CY7C68003 (7C68330B) 4036298 611119483 G-TAIWAN 500 80 0 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN 200 80 0 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN 1000 80 0 CY7C68003 (7C68330B) 4036298 611119485 G-TAIWAN COMP 15 0 CY7C68003 (7C68330B) 4036298 611119484 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-70532 Rev. *C ECN # 4450632 Document History Page Document Title: Document Number: Rev. ECN No. ** 3283659 *A 3657926 QTP 112108: 24 QFN (4X4X0.6MM), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN 001-70532 Orig. of Change NSR NSR *B 4056777 HSTO *C 4450632 HSTO Description of Change Initial spec release Sunset Review. Remove the reference Cypress specs on the reliability test conditions and replace with the industry standards. Remove version 1.0 in the QTP# in title page. Sunset Review Updated test location facility based on current qualified test site. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7