32L – TQFP (7x7x1.0mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 AZ and AE B1: 134.0000 mg B2: 134.5110 mg B: 138.0963 mg Body Size (mil/mm) Package Weight – Site 2 7X7X1.0 mm B: 133.4077 mg SUMMARY The 32L- TQFP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Seoul Korea Package Qualification Report #034602 and 101703 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ32-Amkor Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 1 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using C151 Leadframe Copper Alloy Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu Cr Sn Zn Ag 7440-50-8 7440-47-3 7440-31-5 7440-66-6 7440-22-4 42.6495 0.1313 0.1094 0.0788 0.8010 97.4400% 0.3000% 0.2500% 0.1800% 1.8300% 318,280 980 817 588 5,978 31.8280% 0.0980% 0.0817% 0.0588% 0.5978% Pure Sn 7440-31-5 2.5300 100.0000% 18,881 1.8881% Ag Epoxy Resin Anhydride Si Au Multi-aromatic Resin SiO2 Carbon Black 7440-22-4 Trade Secret Trade Secret 7440-21-3 7440-57-5 0.1900 0.6700 0.0900 3.4600 1.1100 20.0000% 70.5300% 9.4700% 100.0000% 100.0000% 1,418 5,000 671 25,821 8,284 0.1418% 0.5000% 0.0671% 2.5821% 0.8284% Trade Secret 9.4507 11.5000% 70,527 7.0527% 72.3102 0.4191 87.9900% 0.5100% 539,628 3,127 53.9628% 0.3127% % Total: 100.0000 60676-86-0 1333-86-4 Package Weight (mg): 134.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 2 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using C194 Leadframe Copper Alloy Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 42.0900 97.4400% 312,911 31.2911% Fe 7439-89-6 1.0140 0.3000% 7,538 0.7538% P Zn Ag 7723-14-0 7440-66-6 7440-22-4 0.0130 0.0520 0.8000 0.2500% 0.1800% 1.8300% 97 387 5,948 0.0097% 0.0387% 0.5948% Pure Sn 7440-31-5 2.5470 100.0000% 18,935 1.8935% Epoxy Resin Ag Anhydride Si Au Multi-aromatic Resin SiO2 Carbon Black Trade Secret 7440-22-4 Trade Secret 7440-21-3 7440-57-5 0.1920 0.6710 0.0960 3.4600 1.1150 20.0209% 69.9687% 10.0104% 100.0000% 100.0000% 1,427 4,988 714 25,723 8,289 0.1427% 0.4988% 0.0714% 2.5723% 0.8289% Trade Secret 9.4830 11.5000% 70,500 7.0500% 72.5660 0.4120 88.0004% 0.4996% 539,480 3,063 53.9480% 0.3063% % Total: 100.0000 60676-86-0 1333-86-4 Package Weight (mg): 134.5110 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 3 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 4 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 120201 (Note 1) II. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ32- ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 5 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 41.2751 94.3000% 309,391 30.9391% Ni Si 7440-02-0 7440-21-3 1.0943 0.2189 2.5000% 0.5000% 8,202 1,640 0.8202% 0.1640% Mg Ag Sn 7439-95-4 7440-22-4 7440-31-5 0.0438 1.1380 2.5300 0.1000% 2.6000% 100.0000% 328 8,530 18,964 0.0328% 0.8530% 1.8964% 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 0.7420 0.0380 0.0380 0.0380 0.0380 0.0475 78.1000% 4.0000% 4.0000% 4.0000% 4.0000% 5.0000% 5,562 285 285 285 285 356 0.5562% 0.0285% 0.0285% 0.0285% 0.0285% 0.0356% 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 29690-82-2 0.0029 0.0057 3.4600 0.5176 4.1090 4.1090 0.3000% 0.6000% 100.0000% 100.0000% 5.0000% 5.0000% 21 43 25,936 3,880 30,800 30,800 0.0021% 0.0043% 2.5936% 0.3880% 3.0800% 3.0800% Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 4.1090 4.1090 0.2465 57.0329 8.2180 0.2465 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 30,800 30,800 1,848 427,510 61,601 1,848 3.0800% 3.0800% 0.1848% 42.7510% 6.1601% 0.1848% Ag Epoxy resin A Epoxy resin B Diluent A Diluent A Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline Package Weight (mg): 133.4077 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 6 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 7 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package ASSEMBLY Site 3: Amkor Technology Philippines (ATP1) Package Qualification Report # 150201 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ32/AE32- ATP As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 8 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Cu 7440-50-8 42.1158 95.6787% 304,974 30.4974% Fe Zn 7439-89-6 7440-66-6 1.0372 0.0519 2.3563% 0.1178% 7,511 376 0.7511% 0.0376% P Ag 7723-14-0 7440-22-4 0.0130 0.8001 0.0295% 1.8177% 94 5,794 0.0094% 0.5794% Sn 7440-31-5 3.5694 100.0000% 25,847 2.5847% Polymer 1,4Butanedioldiglycid yl Ether Phenolic Resin Ethylene glycol monobutyl ether acetate Silver Si Cu Pd Epoxy Resin A Epoxy Resin B Silica Fused Carbon Black Phenol Resin 9003-36-5 0.2115 0.0385 11.0000% 2.0000% 1,532 279 0.1532% 0.0279% 0.0385 0.0962 2.0000% 5.0000% 279 697 0.0279% 0.0697% 1.5384 3.5964 0.5090 0.0109 1.6894 6.7576 70.9544 0.4223 4.6458 80.0000% 100.0000% 97.8970% 2.1030 8.0000% 2.0000% 84.0000% 0.5000% 5.5000% 11,140 26,043 3,686 79 12,233 48,934 513,804 3,058 33,640 1.1140% 2.6043% 0.3686% 0.0079% 1.2233% 4.8934% 51.3804% 0.3058% 3.3640% 2425-79-8 9003-35-4 112-07-2 7440-22-4 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret 60676-86-0 1333-86-4 Trade Secret Package Weight (mg): 138.0963 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 9 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 10 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. 32L-TQFP (7x7x1.0mm) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04357 ** *A ECN No. Orig. of Change 391439 GFJ 2247086 MAHA *B 2808317 MLA *C *D 3242150 3600532 HLR HLR *E 3662880 COPI *F 3784788 JARG *G 4033441 YUM *H 4632520 ZJL Description of Change New document 1. Updated Cypress logo. 2. Changed “CoA-32AZ-M” to “CoA-AZ32-M”. 3. Added “% weight of substance per Homogeneous Material” and “% Weight of Substance per Package” on the Material Composition table. 4. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. 5. Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Add AE package code (same site, same material set as AZ). Add second QTP# as reference. Removed Tube based on Indirect Packaging Materials. Updated Assembly Site 1 to reflect 4 decimal places on values of material composition table. Added PMDD for Assembly Site 2 – ASE Taiwan Copper Qualification under QTP # 120201. Changed Site from M to L on Assembly Site 1. Changed Document Title from 32L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET to 32L-TQFP (7x7x1.0mm) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Added assembly site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. Added item B2 Material Composition for Amkor Korea using C194 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 11 of 12 32L – TQFP (7x7x1.0mm) Pb-Free Package Rev. ECN No. Orig. of Change *I 4677869 VFR *J 5277649 HLR DCON Description of Change leadframe. Added PMDD for Assembly Site 3 – Amkor Technology Philippines under QTP # 150201 Changed Cypress Logo. Changed the substances with “------------- “ and Proprietary to “Trade Secret". Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04357 Rev. *J Page 12 of 12