VISHAY SI4562DY

Si4562DY
Vishay Siliconix
N- and P-Channel 2.5-V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
rDS(on) (Ω)
ID (A)
0.025 at VGS = 4.5 V
7.1
0.035 at VGS = 2.5 V
6.0
0.033 at VGS = - 4.5 V
- 6.2
0.050 at VGS = - 2.5 V
- 5.0
• TrenchFet® Power MOSFET: 2.5 Rated
Pb-free
N-Channel
20
P-Channel
- 20
Available
RoHS*
COMPLIANT
SO-8
D1
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
S2
G2
G1
Top View
Ordering Information: Si4562DY-T1
Si4562DY-T1-E3 (Lead (Pb)-free)
S1
D2
N-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)a
Symbol
VDS
VGS
TA = 25 °C
TA = 70 °C
ID
Pulsed Drain Current
IDM
IS
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
Operating Junction and Storage Temperature Range
TA = 25 °C
TA = 70 °C
N-Channel
20
P-Channel
- 20
± 12
7.1
5.7
40
1.7
- 6.2
- 4.9
- 40
- 1.7
Unit
V
A
TJ, Tstg
2.0
1.3
- 55 to 150
°C
Symbol
N- or P-Channel
Unit
RthJA
62.5
°C/W
PD
W
THERMAL RESISTANCE RATINGS
Parameter
Maximum
Junction-to-Ambienta
Notes:
a. Surface Mounted on FR4 Board, t ≤10 sec.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 70717
S-51109-Rev. B, 04-Apr-06
Work-in-Progress
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Si4562DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
Drain-Source On-State Resistanceb
Forward Transconductanceb
Diode Forward Voltageb
VGS(th)
N-Ch
0.6
1.6
P-Ch
- 0.6
- 1.6
VDS = 0 V, VGS = ± 12 V
IGSS
IDSS
VDS = VGS, ID = 250 µA
VDS = VGS, ID = - 250 µA
N-Ch
± 100
P-Ch
± 100
VDS = 20 V, VGS = 0 V
N-Ch
1
VDS = - 20 V, VGS = 0 V
P-Ch
-1
VDS = 20 V, VGS = 0 V, TJ = 55 °C
N-Ch
5
VDS = - 20 V, VGS = 0 V, TJ = 55 °C
P-Ch
VDS ≥ 5 V, VGS = 4.5 V
N-Ch
20
VDS ≤ - 5 V, VGS = - 4.5 V
P-Ch
- 20
VGS = 4.5 V, ID = 7.1 A
N-Ch
0.019
VGS = - 4.5 V, ID = - 6.2 A
P-Ch
0.027
0.033
VGS = 2.5 V, ID = 6.0 A
N-Ch
0.025
0.035
VGS = - 2.5 V, ID = - 5.0 A
P-Ch
0.040
0.050
VDS = 10 V, ID = 7.1 A
N-Ch
27
VDS = - 10 V, ID = - 6.2 A
P-Ch
20
IS = 1.7 A, VGS = 0 V
N-Ch
1.2
IS = - 1.7 A, VGS = 0 V
P-Ch
- 1.2
ID(on)
rDS(on)
gfs
VSD
V
nA
µA
-5
A
0.025
Ω
S
V
Dynamicb
Total Gate Charge
Gate-Source Charge
Qg
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
Fall Time
Sorce-Drain Reverse Recovery Tme
N-Channel
VDS = 10 V, VGS = 4.5 V, ID = 7.1 A
tr
td(off)
tf
P-Channel
VDS = - 10 V, VGS = - 4.5 V, ID = - 6.2 A
N-Channel
VDD = 10 V, RL = 10 Ω
ID ≅ 1 A, VGEN = 4.5 V, RG = 6 Ω
25
50
P-Ch
22
35
N-Ch
6.5
P-Ch
7
nC
N-Ch
4
P-Ch
3.5
N-Ch
40
P-Ch
27
50
N-Ch
40
60
60
P-Ch
32
50
N-Ch
90
150
P-Ch
95
150
N-Ch
40
60
P-Ch
45
70
IF = 1.7 A, di/dt = 100 A/µs
N-Ch
40
80
IF = - 1.7 A, di/dt = 100 A/µs
P-Ch
40
80
P-Channel
VDD = - 10 V, RL = 10 Ω
ID ≅ - 1 A, VGEN = - 4.5 V, RG = 6 Ω
trr
N-Ch
ns
Notes:
a. For design aid only; not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 70717
S-51109-Rev. B, 04-Apr-06
Si4562DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless noted
40
40
VGS = 5 thru 3 V
2.5 V
30
I D − Drain Current (A)
I D − Drain Current (A)
30
20
2V
10
20
TC = 125 °C
10
25 °C
1, 1.5 V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
- 55 °C
0
0.0
4.0
0.5
VDS − Drain-to-Source Voltage (V)
1.5
2.0
2.5
3.0
VGS − Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.10
4000
0.08
3200
C − Capacitance (pF)
r DS(on)− On-Resistance (Ω)
1.0
0.06
0.04
VGS = 2.5 V
0.02
Ciss
2400
1600
Coss
800
VGS = 4.5 V
Crss
0.00
0
0
10
20
30
40
0
4
ID − Drain Current (A)
8
On-Resistance vs. Drain Current
16
20
Capacitance
1.6
5
VGS = 4.5 V
ID = 7.1 A
VDS = 10 V
ID = 7.1 A
1.4
4
rDS(on) − On-Resistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
12
VDS − Drain-to-Source Voltage (V)
3
2
1.2
1.0
0.8
1
0
0
5
10
15
Qg − Total Gate Charge (nC)
Gate Charge
Document Number: 70717
S-51109-Rev. B, 04-Apr-06
20
25
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ − Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si4562DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
0.10
40
ID = 7.1 A
r DS(on) − On-Resistance (Ω)
I S − Source Current (A)
0.08
TJ = 150 °C
10
TJ = 25 °C
1
0.0
0.06
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
VSD − Source-to-Drain Voltage (V)
2
GS
3
4
5
− Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.4
30
0.2
24
ID = 250 µA
0.0
Power (W)
V GS(th) Variance (V)
1
- 0.2
- 0.4
18
12
6
- 0.6
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.10
TJ − Temperature (°C)
1.00
10.00
Time (sec)
Threshold Voltage
Single Pulse Power
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 62.5 °C/W
3. TJM − TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
30
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 70717
S-51109-Rev. B, 04-Apr-06
Si4562DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless noted
40
40
VGS = 5, 4.5, 4, 3.5 V
TC = - 55 °C
32
3V
24
25 °C
I D − Drain Current (A)
I D − Drain Current (A)
32
2.5 V
16
2V
8
125 °C
24
16
8
1.5 V
0
0
0
1
2
3
4
5
0
1
VDS − Drain-to-Source Voltage (V)
0.08
3600
C − Capacitance (pF)
r DS(on)− On-Resistance (Ω)
4500
VGS = 2.5 V
VGS = 4.5 V
0.02
Ciss
2700
1800
Crss
Coss
900
0.00
0
0
8
16
24
32
40
0
4
ID − Drain Current (A)
8
12
16
20
VDS − Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
1.6
5
VDS = 10 V
ID = 6.2 A
4
1.4
rDS(on) − On-Resistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
4
Transfer Characteristics
0.10
0.04
3
VGS − Gate-to-Source Voltage (V)
Output Characteristics
0.06
2
3
2
VGS = 4.5 V
ID = 6.2 A
1.2
1.0
0.8
1
0
0
5
10
15
Qg − Total Gate Charge (nC)
Gate Charge
Document Number: 70717
S-51109-Rev. B, 04-Apr-06
20
25
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ − Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si4562DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
0.10
40
r DS(on)− On-Resistance (Ω)
I S − Source Current (A)
0.08
TJ = 150 °C
10
TJ = 25 °C
ID = 6.2 A
0.06
0.04
0.02
0.00
1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
1.6
1
VSD − Source-to-Drain Voltage (V)
2
GS
3
4
5
− Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.6
30
0.3
Power (W)
V GS(th) Variance (V)
24
ID = 250 µA
18
12
0.0
6
- 0.3
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.10
TJ − Temperature (°C)
1.00
10.00
Time (sec)
Threshold Voltage
Single Pulse Power vs. Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 62.5 °C/W
3. TJM − TA = PDMZthJA(t)
0.02
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
30
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?70717.
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Document Number: 70717
S-51109-Rev. B, 04-Apr-06
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
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or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
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Document Number: 91000
Revision: 08-Apr-05
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