VESD05A8A-HNH www.vishay.com Vishay Semiconductors 8-Line ESD-Protection Diode Array in LLP1713-9L FEATURES 1 • Ultra compact LLP1713-9L package 8 9 2 7 3 6 4 5 • Low package profile < 0.6 mm • 8-line ESD-protection • Low leakage current IR < 1 μA • Low load capacitance CD = 30 pF 20522 20521 • ESD-immunity acc. IEC 61000-4-2 ± 25 kV contact discharge ± 30 kV air discharge MARKING (example only) • Working voltage range VRWM = 5 V YXX • e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn) 20719 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Dot = pin 1 marking Y = type code (see table below) XX = date code ORDERING INFORMATION DEVICE NAME VESD05A8A-HNH ORDERING CODE TAPED UNITS PER REEL (8 mm TAPE ON 7" REEL) MINIMUM ORDER QUANTITY VESD05A8A-HNH-GS08 3000 15 000 PACKAGE DATA DEVICE NAME PACKAGE NAME TYPE CODE WEIGHT MOLDING COMPOUND FLAMMABILITY RATING MOISTURE SENSITIVITY LEVEL SOLDERING CONDITIONS VESD05A8A-HNH LLP1713-9L B 3.7 mg UL 94 V-0 MSL level 1 (according J-STD-020) 260 °C/10 s at terminals ABSOLUTE MAXIMUM RATINGS RATING Peak pulse current Peak pulse power ESD immunity Operating temperature Storage temperature Rev. 1.5, 26-Jun-12 TEST CONDITIONS SYMBOL VALUE UNIT BiAs-mode: each input (pin 1 to pin 8) to ground (pin 9) acc. IEC 61000-4-5; tP = 8/20 μs; single shot IPPM 5 A BiSy-mode: each input (pin 1 to pin 8) to any other input pin. Pin 9 not connected. Acc. IEC 61000-4-5; tP = 8/20 μs/single shot IPPM 2.5 A BiAs-mode: each input (pin 1 to pin 8) to ground (pin 9) acc. IEC 61000-4-5; tP = 8/20 μs; single shot PPP 65 W BiSy-mode: each input (pin 1 to pin 8) to any other input pin Pin 9 not connected. Acc. IEC 61000-4-5; tP = 8/20 μs/single shot PPP 33 W Contact discharge acc. IEC61000-4-2; 10 pulses BiAs-mode: each input (pin 1 to pin 8) to ground (pin 9) VESD ± 25 kV Air discharge acc. IEC61000-4-2; 10 pulses BiAs-mode: each input (pin 1 to pin 8) to ground (pin 9) VESD ± 30 kV Contact discharge acc. IEC61000-4-2; 10 pulses BiSy-mode: each input (pin 1 to pin 8) to any other input pin. Pin 9 not connected. VESD ± 12 kV Air discharge acc. IEC61000-4-2; 10 pulses BiSy-mode: each input (pin 1 to pin 8) to any other input pin. Pin 9 not connected. VESD ± 12 kV TJ - 40 to + 125 °C TSTG - 55 to + 150 °C Junction temperature Document Number: 81629 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VESD05A8A-HNH www.vishay.com Vishay Semiconductors BiAs-MODE (8-line bidirectional asymmetrical protection mode) With the VESD05A8A-HNH up to 8 signal- or data-lines (L1 to L8) can be protected against voltage transients. With pin 9 connected to ground and pin 1 up to pin 8 connected to a signal- or data-line which has to be protected. As long as the voltage level on the data- or signal-line is between 0 V (ground level) and the specified maximum reverse working voltage (VRWM) the protection diode between data line and ground offer a high isolation to the ground line. The protection device behaves like an open switch. As soon as any positive transient voltage signal exceeds the break through voltage level of the protection diode, the diode becomes conductive and shorts the transient current to ground. Now the protection device behaves like a closed switch. The clamping voltage (VC) is defined by the breakthrough voltage (VBR) level plus the voltage drop at the series impedance (resistance and inductance) of the protection device. Any negative transient signal will be clamped accordingly. The negative transient current is flowing in the forward direction of the protection diode. The low forward voltage (VF) clamps the negative transient close to the ground level. Due to the different clamping levels in forward and reverse direction the VESD05A8A-HNH clamping behaviour is bidirectional and ssymmetrical (BiAs). L1 L2 L3 L4 1 8 9 2 7 3 6 4 5 L8 L7 L6 L5 20524 ELECTRICAL CHARACTERISTICS (Between pin 1 to 8 and pin 9) (Tamb = 25 °C, unless otherwise specified) TEST CONDITIONS/REMARKS SYMBOL MIN. TYP. MAX. UNIT Number of lines which can be protected Nchannel - - 8 lines Max. reverse working voltage VRWM - - 5 V Reverse voltage at IR = 1 μA VR 5 - - V Reverse current at VR = VRWM = 5 V IR - < 0.1 1 μA PARAMETER Protection paths Reverse stand-off voltage at IR = 1 mA VBR 6 8 V Reverse clamping voltage at IPP = 5 A acc. IEC 61000-4-5 VC - 13 V Forward clamping voltage at IF = 5 A acc. IEC 61000-4-5 VF - 4.5 V at VR = 0 V; f = 1 MHz CD - 30 35 pF at VR = 2.5 V; f = 1 MHz CD - 18 23 pF Reverse breakdown voltage Capacitance Rev. 1.5, 26-Jun-12 Document Number: 81629 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VESD05A8A-HNH www.vishay.com Vishay Semiconductors If a higher surge current or peak pulse current (IPP) is needed, some protection diodes in the VESD05A8A-HNH can also be used in parallel in order to “multiply” the performance. If two diodes are switched in parallel you get • double surge power = double peak pulse current (2 x IPPM) • half of the line inductance = reduced clamping voltage • half of the line resistance = reduced clamping voltage • double line capacitance (2 x CD) • double reverse leakage current (2 x IR) L1 1 L4 8 9 L2 2 7 3 6 4 5 L3 20525 BiSy-MODE (7-line bidirectional symmetrical protection mode) If a bipolar symmetrical protection device is needed the VESD05A8A-HNH can also be used as a seven-line protection device. Therefore seven pins (example: pin 1, 2, 3, 4, 6, 7 and 8) has to be connected to the signalor data-line (L1 to L7) and pin 5 to ground. Pin 9 must not be connected! Positive and negative voltage transients will be clamped in the same way. The clamping current from one data line through the VESD05A8A-HNH to the ground passes one diode in forward direction and the other one in reverse direction. The clamping voltage (VC) is defined by the breakthrough voltage (VBR) level of one diode plus the forward voltage of the other diode plus the voltage drop at the series impedances (resistances and inductances) of the protection device. Due to the same clamping levels in positive and negative direction the VESD05A8A-HNH voltage clamping behaviour is also bidirectional and symmetrical (BiSy). L1 L2 L3 L4 1 8 9 2 7 3 6 4 5 L7 L6 L5 20526_1 ELECTRICAL CHARACTERISTICS (Between any of the pins 1 to 8; pin 9 not connected) (Tamb = 25 °C, unless otherwise specified) PARAMETER Protection paths Reverse stand-off voltage TEST CONDITIONS/REMARKS SYMBOL MIN. TYP. MAX. UNIT Number of lines which can be protected Nchannel - - 7 lines Max. reverse working voltage VRWM - - 5.5 V Reverse voltage at IR = 1 μA VR 5.5 - - V Reverse current at VR = VRWM = 5.5 V IR - < 0.1 1 μA at IR = 1 mA VBR 6.5 8.7 V at IPP = 2.5 A acc. IEC 61000-4-5 VC - 13 V at VR = 0 V; f = 1 MHz CD - 30 35 pF at VR = 2.5 V; f = 1 MHz CD - 18 23 pF Reverse breakdown voltage Reverse clamping voltage Capacitance Rev. 1.5, 26-Jun-12 Document Number: 81629 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VESD05A8A-HNH www.vishay.com Vishay Semiconductors TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 100 Pin 9 to Pin 1, 2, 3, 4, 5, 6, 7 or 8 8 µs to 100 % 100 % 10 IF (mA) 80 % IPPM 60 % 20 µs to 50 % 40 % 20 % 1 0.1 0.01 0% 0 10 20 30 Time (µs) 20548 0.001 0.5 40 0.8 0.9 1 VF (V) Fig. 4 - Typical Forward Current IF vs. Forward Voltage VF 8 120 % Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9 Rise time = 0.7 ns to 1 ns 7 100 % 6 80 % 5 VR (V) Discharge Current IESD 0.7 20559 Fig. 1 - ESD Discharge Current Wave Form acc. IEC 61000-4-2 (330 /150 pF) 60 % 53 % 4 3 40 % 2 27 % 20 % 1 0 0.01 0% - 10 0 10 20 30 40 50 60 70 80 90 100 Fig. 2 - 8/20 µs Peak Pulse Current Wave Form acc. IEC 61000-4-5 1 14 f = 1 MHz 12 30 1000 10000 positive surge 8 VC (V) Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9 15 100 Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9 10 BiAs-mode 20 10 IR (µA) Fig. 5 - Typical Reverse Voltage VR vs. Reverse Current IR 35 25 0.1 20560 Time (ns) 20557 CD (pF) 0.6 6 Measured acc. IEC 61000-4-5 (8/20 µs - wave form) 4 VC 2 0 10 BiSy-mode between 2 Pins (1 - 8) Pin 9 not connetced 5 -2 negative surge -4 0 -6 0 20558 1 2 3 4 5 6 VR (V) Fig. 3 - Typical Capacitance CD vs. Reverse Voltage VR Rev. 1.5, 26-Jun-12 0 20561 1 2 3 4 5 6 IPP (A) Fig. 6 - Typical Peak Clamping Voltage VC vs. Peak Pulse Current IPP Document Number: 81629 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VESD05A8A-HNH www.vishay.com Vishay Semiconductors 80 acc. IEC 61000-4-2 + 8 kV contact discharge 60 VC-ESD (V) 40 20 0 - 20 - 40 - 10 0 10 20 30 40 50 60 70 80 90 20562 t (ns) Fig. 7 - Typical Clamping Performance at + 8 kV Contact Discharge (acc. IEC 61000-4-2) 40 acc. IEC 61000-4-2 - 8 kV contact discharge VC-ESD (V) 20 0 - 20 - 40 - 60 - 80 - 10 0 10 20 30 40 50 60 70 80 90 20563 t (ns) Fig. 8 - Typical Clamping Performance at - 8 kV Contact Discharge (acc. IEC 61000-4-2) 250 acc. IEC 61000-4-2 contact discharge 200 Pin 1, 2, 3, 4, 5, 6, 7 or 8 to Pin 9 150 positive discharge VC-ESD (V) 100 50 VC-ESD 0 - 50 - 100 negative discharge - 150 - 200 0 20564 5 10 15 20 25 30 VESD (kV) Fig. 9 - Typical Peak Clamping Voltage at ± ESD Contact Discharge (acc. IEC 61000-4-2) Rev. 1.5, 26-Jun-12 Document Number: 81629 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VESD05A8A-HNH www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters (Inches): LLP1713-9L 1.05 (0.041) 0.3 (0.012) exp. DAP 0.35 (0.014) 0.45 (0.018) 0.2 (0.008) x 45° 0.24 (0.009) 0.23 (0.009) 0.17 (0.007) 0.4 (0.016) bsc 1.2 (0.047) ref. 1.4 (0.055) 0.6 (0.024) 0.5 (0.020) 1.75 (0.069) 1.65 (0.065) 0.152 (0.006) ref. 0 (0.000) 0.05 (0.002) 1.3 (0.051) Pin 1 marking Foot print recommendation: 3 x 0.4 = 1.2 (0.047) 20386 Rev. 1.5, 26-Jun-12 0.4 (0.016) 1 (0.039) 0.2 (0.008) Solder resist mask 0.42 (0.017) Document no.:S8-V-3906.04-001 (4) Created - Date: 28. August 2006 Rev. 1 - Date: 27. May 2008 0.4 (0.016) 0.15 (0.006) 0.4 (0.016) Solder pad Document Number: 81629 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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