SSM3K02T TOSHIBA Field Effect Transistor Silicon N Channel MOS Type SSM3K02T High Speed Switching Applications Unit: mm • Small package • Low on resistance: Ron = 200 mΩ (max) (VGS = 4 V) : Ron = 250 mΩ (max) (VGS = 2.5 V) • Low gate threshold voltage: Vth = 0.6~1.1 V (VDS = 3 V, ID = 0.1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain-source voltage VDS 30 V Gate-source voltage VGSS ±10 V DC ID 2.5 Pulse IDP 5.0 Drain current Drain power dissipation (Ta = 25°C) PD (Note 1) A 1250 mW Channel temperature Tch 150 °C JEDEC ― Storage temperature range Tstg −55~150 °C JEITA ― Note: Using continuously under heavy loads (e.g. the application of TOSHIBA 2-3S1A high temperature/current/voltage and the significant change in Weight: 0.01 g (typ.) temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Mounted on FR4 board 2 (25.4 mm × 25.4 mm × 1.6 t, Cu pad: 645 mm , t = 10 s) Note 2: The pulse width limited by max channel temperature. Marking Equivalent Circuit 3 3 KU 1 2 1 2 Handling Precaution When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects that come into direct contact with devices should be made of anti-static materials. 1 2007-11-01 SSM3K02T Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Drain-source breakdown voltage Drain cut-off current Symbol IGSS V (BR) DSS IDSS Test Condition Min Typ. Max Unit VGS = ±10 V, VDS = 0 ⎯ ⎯ ±5 μA ID = 1 mA, VGS = 0 30 ⎯ ⎯ V VDS = 30 V, VGS = 0 ⎯ ⎯ 1 μA Vth VDS = 3 V, ID = 0.1 mA 0.6 ⎯ 1.1 V Forward transfer admittance ⎪Yfs⎪ VDS = 3 V, ID = 1.25 A (Note) 2.2 ⎯ ⎯ S Drain-source ON resistance RDS (ON) ID = 1.25 A, VGS = 4 V (Note) ⎯ 140 200 ID = 1.25 A, VGS = 2.5 V (Note) ⎯ 180 250 Gate threshold voltage mΩ Input capacitance Ciss VDS = 10 V, VGS = 0, f = 1 MHz ⎯ 115 ⎯ pF Reverse transfer capacitance Crss VDS = 10 V, VGS = 0, f = 1 MHz ⎯ 24 ⎯ pF Output capacitance Coss VDS = 10 V, VGS = 0, f = 1 MHz ⎯ 60 ⎯ pF VDD = 15 V, ID = 0.5 A, VGS = 0~2.5 V, RG = 4.7 Ω ⎯ 52 ⎯ ⎯ 80 ⎯ Switching time Turn-on time ton Turn-off time toff ns Note: Pulse test Switching Time Test Circuit Precaution Vth can be expressed as voltage between gate and source when low operating current value is ID = 100 μA for this product. For normal switching operation, VGS (ON) requires higher voltage than Vth and VGS (off) requires lower voltage than Vth. (Relationship can be established as follows: VGS (off) < Vth < VGS (ON)) Please take this into consideration for using the device. 2 2007-11-01 SSM3K02T ID – VDS 2.5 10000 2.5 Common Source VDS = 3 V Ta = 25°C 2.1 10 1000 1.9 Drain current ID (mA) Drain current ID (A) 2 4 1.5 1.7 1 VGS = 1.5 V 0.5 ID – VGS Common Source 100 25°C 10 Ta = 100°C 1 −25°C 0.1 0 0 0.5 1 1.5 Drain-Source voltage 0.01 0 2 0.5 1 Gate-Source voltage VDS (V) RDS (ON) – ID 2 VGS (V) RDS (ON) – Ta 280 400 Common Source Common Source 200 Drain-Source on resistance RDS (ON) (mΩ) Ta = 25°C 240 Drain-Source on resistance RDS (ON) (mΩ) 1.5 VGS = 2.5 V 160 120 4V 80 ID=1.25A 300 VGS = 2.5 V 200 4V 100 40 0 0.5 1.0 1.5 2.0 0 −25 2.5 0 Drain current ID (A) 75 100 125 150 C – VDS 1000 (pF) 10 |Yfs| – ID Common Source VDS = 3 V Ta = 25°C Capacitance C Forward transfer admittance |Yfs| (S) 30 50 25 Ambient temperature Ta (°C) 3 1 300 Coss 30 Common Source 10 0.3 Ciss 100 Crss VGS = 0 f = 1 MHz 0.1 0.01 0.03 0.1 0.3 1 3 3 0.1 10 Drain current ID (A) Ta = 25°C 0.3 1 3 Drain-Source voltage 3 10 30 100 VDS (V) 2007-11-01 SSM3K02T . t – ID PD – Ta 1.5 500 Common Source Drain power dissipation PD (W) VDD = 15 V VGS = 0~2.5 V RG = 4.7 Ω Switching time t (ns) toff Ta = 25°C 100 tf 50 ton 30 1.25 Mounted on FR4 board t = 10 s (25.4 mm × 25.4 mm × 1.6 t, 2 Cu Pad: 645 mm ) 1 0.75 DC 0.5 0.25 tr 10 0.01 0.03 0.1 0 0 1 0.3 25 50 75 100 125 150 Ambient temperature Ta (°C) Drain current ID (A) Safe operating area 10 ID max (pulsed) 1 ms* ID max (continuous) Drain current ID (A) 10 ms* 1 DC operation Ta = 25°C 0.1 10 s* Mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 t, 2 Cu Pad: 645 mm ) *: Single nonrepetitive Pulse Ta = 25°C Curves must be derated linearly with increase in temperature. 0.01 0.1 VDSS max 1 Drain-source voltage 10 100 VDS (V) rth – tw Transient thermal impedance rth (°C /W) 1000 100 10 Single pulse Mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 t, 2 Cu Pad: 645 mm ) 1 0.001 0.01 0.1 1 Pulse width 10 100 1000 tw (s) 4 2007-11-01 SSM3K02T RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2007-11-01