This product complies with the RoHS Directive (EU 2002/95/EC). DMA20403 Silicon PNP epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For general amplification Features Package Basic Part Number Code Mini6-G4-B Pin Name 1: Emitter (Tr1) 2: Base (Tr1) 3: Collector (Tr2) High forward current transfer ratio hFE with excellent linearity Low collector-emitter saturation voltage VCE(sat) Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package DSA2001 + DSA2002 (Individual) Marking Symbol: B9 Packaging Internal Connection Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) (C1) 6 Absolute Maximum Ratings Ta = 25°C Parameter Tr1 Tr2 Symbol Rating Unit Collector-base voltage (Emitter open) VCBO –60 V Collector-emitter voltage (Base open) VCEO –50 V Emitter-base voltage (Collector open) VEBO –7 V Collector current IC –100 mA Peak collector current ICP –200 A Collector-base voltage (Emitter open) VCBO –60 V Collector-emitter voltage (Base open) VCEO –50 V Emitter-base voltage (Collector open) VEBO –5 V Collector current IC –500 mA Peak collector current ICP –1 A Total power dissipation PT 300 mW Tj 150 °C Tstg –55 to +150 °C Overall Junction temperature Storage temperature Publication date: April 2010 4: Emitter (Tr2) 5: Base (Tr2) 6: Collector (Tr1) ZJJ00794AED (B2) 5 Tr1 1 (E1) (E2) 4 Tr2 2 (B1) 3 (C2) 1 This product complies with the RoHS Directive (EU 2002/95/EC). DMA20403 Electrical Characteristics Ta = 25°C±3°C Tr1 Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = –10 µA, IE = 0 –60 V Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0 –50 V Emitter-base voltage (Collector open) VEBO IE = –10 µA, IC = 0 –7 V Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE = 0 – 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = –10 V, IB = 0 –100 µA Forward current transfer ratio hFE VCE = –10 V, IC = –2 mA 460 – 0.5 V Collector-emitter saturation voltage VCE(sat) Transition frequency fT Collector output capacitance (Common base, input open circuited) Cob 210 IC = –100 mA, IB = –10 mA – 0.2 VCB = –10 V, IE = –2 mA 150 MHz 2 pF VCB = –10 V, IE = 0, f = 1 MHz Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. Tr2 Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = –10 µA, IE = 0 –60 V Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0 –50 V Emitter-base voltage (Collector open) VEBO IE = –10 µA, IC = 0 –5 V Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE = 0 hFE1 VCE = –10 V, IC = –150 mA 120 hFE2 VCE = –10 V, IC = –500 mA 40 Collector-emitter saturation voltage VCE(sat) IC = –300 mA, IB = –30 mA – 0.2 – 0.6 V Base-emitter saturation voltage VBE(sat) IC = –300 mA, IB = –30 mA – 0.9 –1.5 V fT VCE = –10 V, IC = –50 mA 130 VCB = –10 V, IE = 0, f = 1 MHz 7.3 Forward current transfer ratio Transition frequency Collector output capacitance (Common base, input open circuited) Cob – 0.1 340 Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. Common characteristics chart DMA20403_PT-Ta PT Ta Total power dissipation PT (mW) 400 300 200 100 0 0 40 80 120 160 200 Ambient temperature Ta (°C) 2 ZJJ00794AED µA MHz 15 pF This product complies with the RoHS Directive (EU 2002/95/EC). DMA20403 Characteristics charts of Tr1 DMA20403(Tr1)_IC-VCE DMA20403(Tr1)_hFE-IC −120 IB = −600 µA −500 µA −400 µA −300 µA −60 −200 µA −40 −100 µA −20 0 0 −2 −4 −6 −8 −10 500 400 0 − 0.1 −12 Collector current IC (mA) −30°C −60 −40 −20 − 0.8 −1.2 1.0 −400 µA −300 µA −40 −200 µA −100 µA 0 −2 −4 −6 −8 −10 −12 Collector-emitter voltage VCE (V) Forward current transfer ratio hFE Collector current IC (mA) IB = −500 µA −20 100 50 250 25°C 150 −30°C 100 −10 50 Collector current IC (mA) ZJJ00794AED −1 000 IC / IB = 10 −1 − 0.1 −100 −100 VCE(sat) IC Ta = 85°C −10 −10 DMA20403(Tr2)_VCEsat-IC 200 0 −1 −1 Collector current IC (mA) hFE IC VCE = −10 V −60 150 DMA20403(Tr2)_hFE-IC Ta = 25°C VCE = −10 V Ta = 25°C 200 0 − 0.1 −100 300 −80 0 −10 250 Collector-base voltage VCB (V) IC VCE −100 fT IC 2.0 Characteristics charts of Tr2 DMA20403(Tr2)_IC-VCE −10 DMA20403(Tr1)_fT-IC 3.0 0 −1 −1 Collector current IC (mA) IE = 0 f = 1 MHz Ta = 25°C 4.0 Base-emitter voltage VBE (V) −100 − 0.01 − 0.1 Collector current IC (mA) Collector output capacitance (Common base, input open circuited) Cob (pF) 25°C − 0.4 −100 Ta = 85°C 25°C −30°C Cob VCB Ta = 85°C 0 −10 IC / IB = 10 −1 DMA20403(Tr1)_Cob-VCB −120 0 −1 −10 − 0.1 −30°C 100 IC VBE −80 25°C 200 DMA20403(Tr1)_IC-VBE −100 Ta = 85°C 300 Collector-emitter voltage VCE (V) VCE = −10 V VCE = −10 V Transition frequency fT (MHz) −80 VCE(sat) IC Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) −100 Forward current transfer ratio hFE 600 Ta = 25°C DMA20403(Tr1)_VCEsat-IC hFE IC Collector-emitter saturation voltage VCE(sat) (V) IC VCE − 0.01 −1 Ta = 85°C 25°C −30°C −10 −100 −1 000 Collector current IC (mA) 3 This product complies with the RoHS Directive (EU 2002/95/EC). DMA20403 DMA20403(Tr2)_IC-VBE DMA20403(Tr2)_Cob-VCB 25°C Collector current IC (mA) −500 Ta = 85°C −400 −30°C −300 −200 −100 0 0 − 0.4 − 0.8 −1.2 Base-emitter voltage VBE (V) 4 25 fT IC IE = 0 f = 1 MHz Ta = 25°C 20 15 10 5 0 −1 −10 −100 Collector-base voltage VCB (V) ZJJ00794AED 200 Transition frequency fT (MHz) −600 VCE = −10 V DMA20403(Tr2)_fT-IC Cob VCB Collector output capacitance (Common base, input open circuited) Cob (pF) IC VBE VCE = −10 V Ta = 25°C 160 120 80 40 0 − 0.1 −1 −10 Collector current IC (mA) −100 This product complies with the RoHS Directive (EU 2002/95/EC). DMA20403 Mini6-G4-B Unit: mm +0.20 2.90 −0.05 +0.10 0.50 −0.05 +0.05 0.13 −0.02 +0.10 0.30 −0.05 4 6° 2.8 −0.3 +0.2 1.50 −0.05 2 3 (0.95) (0.95) 1.9 ±0.1 (0.65) 1 0.4 ±0.2 5 +0.25 6 +0.3 1.1 −0.1 0 to 0.1 1.1 −0.1 +0.2 8° ZJJ00794AED 5 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. 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Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 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