Revised April 2005 FIN3385 • FIN3383 • FIN3384 • FIN3386 Low Voltage 28-Bit Flat Panel Display Link Serializers/Deserializers General Description Features The FIN3385 and FIN3383 transform 28 bit wide parallel LVTTL (Low Voltage TTL) data into 4 serial LVDS (Low Voltage Differential Signaling) data streams. A phaselocked transmit clock is transmitted in parallel with the data stream over a separate LVDS link. Every cycle of transmit clock 28 bits of input LVTTL data are sampled and transmitted. ■ Low power consumption The FIN3386 and FIN3384 receive and convert the 4/3 serial LVDS data streams back into 28/21 bits of LVTTL data. Refer to Table 1 for a matrix summary of the Serializers and Deserializers available. For the FIN3385, at a transmit clock frequency of 85MHz, 28 bits of LVTTL data are transmitted at a rate of 595Mbps per LVDS channel. These chipsets are an ideal solution to solve EMI and cable size problems associated with wide and high-speed TTL interfaces. ■ Compatible with TIA/EIA-644 specification ■ 20 MHz to 85 MHz shift clock support ■ r1V common-mode range around 1.2V ■ Narrow bus reduces cable size and cost ■ High throughput (up to 2.38 Gbps throughput) ■ Internal PLL with no external component ■ Devices are offered 56-lead TSSOP packages Ordering Code: Package Number Package Description FIN3383MTD Order Number MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide FIN3384MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide FIN3385MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide FIN3386MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. TABLE 1. Display Panel Link Serializers/Deserializers Chip Matrix Part CLK Frequency LVTTL IN LVDS OUT FIN3385 85 28 4 FIN3383 66 28 4 FIN3386 85 4 28 56 TSSOP FIN3384 66 4 28 56 TSSOP © 2005 Fairchild Semiconductor Corporation DS500864 LVDS IN LVTTL OUT Package 56 TSSOP 56 TSSOP www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 Low Voltage 28-Bit Flat Panel Display Link Serializers/Deserializers October 2003 FIN3385 • FIN3383 • FIN3384 • FIN3386 Block Diagrams Functional Diagram for FIN3385 and FIN3383 Receiver Functional Diagram for FIN3386 and FIN3384 www.fairchildsemi.com 2 FIN3385 • FIN3383 • FIN3384 • FIN3386 TRANSMITTERS Pin Descriptions Pin Names I/O Type Number of Pins TxIn I 28/21 TxCLKIn I 1 Description of Signals LVTTL Level Input LVTTL Level Clock Input The rising edge is for data strobe. TxOut O 4/3 TxOut O 4/3 Negative LVDS Differential Data Output TxCLKOut O 1 Positive LVDS Differential Clock Output TxCLKOut O 1 Negative LVDS Differential Clock Output R_FB I 1 Rising Edge Clock (HIGH), Falling Edge Clock (LOW) PwrDn I 1 LVTTL Level Power-Down Input Assertion (LOW) puts the outputs in High Impedance state. Power Supply Pin for PLL Positive LVDS Differential Data Output PLL VCC I 1 PLL GND I 2 Ground Pins for PLL LVDS VCC I 1 Power Supply Pin for LVDS Output LVDS GND I 3 Ground Pins for LVDS Output VCC I 3 Power Supply Pins for LVTTL Input GND I 5 Ground pins for LVTTL Input NC No Connect Connection Diagram Truth Table Inputs FIN3383 and FIN3385 (28:4 Transmitter) Pin Assignment for TSSOP Outputs TxIn TxCLKIn PwrDn (Note 1) TxOutr Active Active H L/H L/H Active L/H/Z H L/H X (Note 2) F Active H L L/H F F H L X (Note 2) X X L Z Z TxCLKOutr H HIGH Logic Level L LOW Logic Level X Don’t Care Z High Impedance F Floating Note 1: The outputs of the transmitter or receiver will remain in a High Impedance state until VCC reaches 2V. Note 2: TxCLKOutr will settle at a free running frequency when the part is powered up, PwrDn is HIGH and the TxCLKIn is a steady logic level (L/H/Z). 3 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 RECEIVERS Pin Descriptions Pin Names I/O Type Number of Pins Description of Signals RxIn I 4/3 RxIn I 4/3 Negative LVDS Differential Data Input RxCLKIn I 1 Negative LVDS Differential Clock Input Positive LVDS Differential Clock Input Positive LVDS Differential Data Input RxCLKIn I 1 RxOut O 28/21 RxCLKOut O 1 LVTTL Clock Output PwrDn I 1 LVTTL Level Input Refer to Transmitter and Receiver Power-Up and Power-Down Operation Truth Table Power Supply Pin for PLL LVTTL Level Data Output Goes HIGH for PwrDn LOW PLL VCC I 1 PLL GND I 2 Ground Pins for PLL LVDS VCC I 1 Power Supply Pin for LVDS Input LVDS GND I 3 Ground Pins for LVDS Input VCC I 4 Power Supply for LVTTL Output GND I 5 Ground Pin for LVTTL Output NC No Connect Connection Diagram FIN3386 and FIN3384 (4:28 Receiver) Pin Assignment for TSSOP www.fairchildsemi.com 4 The outputs of the transmitter remain in the High-Impedance state until the power supply reaches 2V. The following table shows the operation of the transmitter during power-up and power-down and operation of the PwrDn pin. Transmitter PwrDn Normal VCC 2V !2V !2V !2V TxIn X X Active Active !2V !2V TxOut Z Z Active X TxCLKIn X X Active H/L/Z TxCLKOutr Z Z Active (Note 3) PwrDn L L H H H H (Note 4) Receiver PwrDn RxInr X X Active Active (Note 4) RxOut Z L L/H P H P RxCLKInr X X Active (Note 4) Active (Note 4) RxCLKOut Z (Note 5) Active (Note 5) (Note 5) (Note 5) PwrDn L L H H H H VCC 2V 2V 2V 2V 2V 2V H HIGH Logic Level L LOW Logic Level P Last Valid State X Don’t Care Z High-Impedance Note 3: If the transmitter is powered up and PwrDn is inactive HIGH and the clock input goes to any state LOW, HIGH, or Z then the internal PLL will go to a known low frequency and stay until the clock starts normal operation again. Note 4: If the input is terminated and un-driven (Z) or shorted or open. (fail safe condition) Note 5: For PwrDn or fail safe condition the RxCLKOut pin will go LOW for Panel Link devices and HIGH for Channel Link devices. Note 6: Shorted here means (r inputs are shorted to each other, or r inputs are shorted to each other and Ground or VCC, or either r inputs are shorted to Ground or VCC) with no other Current/Voltage sources (noise) applied. If the VID is still in the valid range (greater than 100mV) and VCM is in the valid range (0V to 2.4V) then the input signal is still recognized and the part will respond normally. 5 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 Transmitter and Receiver Power-Up/Power-Down Operation Truth Table FIN3385 • FIN3383 • FIN3384 • FIN3386 Absolute Maximum Ratings(Note 7) Recommended Operating Conditions Power Supply Voltage (VCC) -0.3V to +4.6V TTL/CMOS Input/Output Voltage 0.5V to 4.6V Supply Voltage (VCC) LVDS Input/Output Voltage -0.3V to +4.6V Operating Temperature (TA)(Note 7) LVDS Output Short Circuit Current (IOSD) Storage Temperature Range (TSTG) Maximum Junction Temperature (TJ) Continuous Maximum Supply Noise Voltage 65qC to 150qC 150qC (VCCNPP) Lead Temperature (TL) ESD Rating (HBM, 1.5 k:, 100 pF) !10.0 kV !6.5 kV !400V I/O to GND All Pins ESD Rating (MM, 0:, 200 pF) 100 mVP-P (Note 8) Note 7: Absolute maximum ratings are DC values beyond which the device may be damaged or have its useful life impaired. The datasheet specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation outside datasheet specifications. 260qC (Soldering, 4 seconds) 3.0V to 3.6V 10°C to 70°C Note 8: 100mV VCC noise should be tested for frequency at least up to 2 MHz. All the specification below should be met under such a noise. Transmitter DC Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. (Note 9) Symbol Parameter Test Conditions Min Typ Max Units V Transmitter LVTTL Input Characteristics VIH Input High Voltage 2.0 VCC VIL Input Low Voltage GND 0.8 V VIK Input Clamp Voltage 0.79 1.5 V IIN Input Current 1.8 10.0 IIK 18 mA VIN 0.4V to 4.6V VIN GND 10.0 0 250 TBD PA Transmitter LVDS Output Characteristics (Note 10) VOD Output Differential Voltage 'VOD VOD Magnitude Change from Differential LOW-to-HIGH VOS Offset Voltage 'VOS Offset Magnitude Change from Differential LOW-to-HIGH IOS Short Circuit Output Current VOUT IOZ Disabled Output Leakage Current DO RL 100 :, See Figure 1 1.125 1.25 450 mV 35.0 mV 1.375 V mV 3.5 5.0 mA 0V r1.0 r10.0 PA 32.5 MHz 31.0 49.5 40.0 MHz 32.0 55.0 66.0 MHz 37.0 60.5 85.0 MHz 42.0 66.0 10.0 55.0 32.5 MHz 29.0 41.8 0V 0V to 4.6V, PwrDn Transmitter Supply Current ICCWT 28:4 Transmitter Power Supply Current 100 :, for Worst Case Pattern (With Load) RL (Note 11) See Figure 3 ICCPDT Powered Down Supply Current ICCGT 28:4 Transmitter Supply Current PwrDn for 16 Grayscale (Note 11) Note 9: All Typical values are at TA 25qC and with VCC 0.8V See Figure 21 40.0 MHz 30.0 44.0 (Note 12) 65.0 MHz 35.0 49.5 85.0 MHz 39.0 55.0 mA PA mA 3.3V. Note 10: Positive current values refer to the current flowing into device and negative values means current flowing out of pins. Voltage are referenced to ground unless otherwise specified (except 'VOD and VOD). Note 11: The power supply current for both transmitter and receiver can be different with the number of active I/O channels. Note 12: The 16-grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed to produce groups of 16 vertical strips across the display. www.fairchildsemi.com 6 Over supply voltage and operating temperature ranges, unless otherwise specified. Symbol Parameter tTCP Transmit Clock Period tTCH Transmit Clock (TxCLKIn) HIGH Time tTCL Transmit Clock Low Time tCLKT TxCLKIn Transition Time (Rising and Failing) tJIT TxCLKIn Cycle-to-Cycle Jitter tXIT TxIn Transition Time Test Conditions See Figure 5 (10% to 90%) See Figure 6 Min Typ Max Units 11.76 T 50.0 ns 0.35 0.5 0.65 T 0.35 0.5 0.65 T 6.0 ns 1.0 1.5 3.0 ns 6.0 ns LVDS Transmitter Timing Characteristics tTLH Differential Output Rise Time (20% to 80%) tTHL Differential Output Fall Time (80% to 20%) See Figure 4 0.75 1.5 ns 0.75 1.5 ns tSTC TxIn Setup to TxCLNIn tHTC TxIn Holds to TCLKIn tTPDD Transmitter Power-Down Delay See Figure 12, (Note 13) tTCCD Transmitter Clock Input to Clock Output Delay (TA Transmitter Clock Input to Clock Output Delay See Figure 9 2.8 0.25 0 0.25 ns See Figure 16 a0.25 a a0.25 ns 1 2a0.25 2a 2a0.25 ns fx7 3a0.25 3a 3a0.25 ns Transmitter Output Data Jitter (f See Figure 5 (f 2.5 85 MHz) 25qC and with VCC ns 0 ns 100 3.3V) 5.5 6.8 ns ns 40 MHz) (Note 14) tTPPB0 Transmitter Output Pulse Position of Bit 0 tTPPB1 Transmitter Output Pulse Position of Bit 1 tTPPB2 Transmitter Output Pulse Position of Bit 2 tTPPB3 Transmitter Output Pulse Position of Bit 3 tTPPB4 Transmitter Output Pulse Position of Bit 4 4a0.25 4a 4a0.25 ns tTPPB5 Transmitter Output Pulse Position of Bit 5 5a0.25 5a 5a0.25 ns tTPPB6 Transmitter Output Pulse Position of Bit 6 6a0.25 6a 6a0.25 ns ns Transmitter Output Data Jitter (f a 65 MHz) (Note 14) 0.2 0 0.2 a0.2 a a0.2 ns 1 2a0.2 2a 2a0.2 ns fx7 3a0.2 3a 3a0.2 ns 4a0.2 4a 4a0.2 ns Transmitter Output Pulse Position of Bit 5 5a0.2 5a 5a0.2 ns Transmitter Output Pulse Position of Bit 6 6a0.2 6a 6a0.2 ns ns tTPPB0 Transmitter Output Pulse Position of Bit 0 tTPPB1 Transmitter Output Pulse Position of Bit 1 tTPPB2 Transmitter Output Pulse Position of Bit 2 tTPPB3 Transmitter Output Pulse Position of Bit 3 tTPPB4 Transmitter Output Pulse Position of Bit 4 tTPPB5 tTPPB6 Transmitter Output Data Jitter (f See Figure 16 a 85 MHz) (Note 14) 0.2 0 0.2 a0.2 a a0.2 ns 1 2a0.2 2a 2a0.2 ns fx7 3a0.2 3a 3a0.2 ns 4a0.2 4a 4a0.2 ns Transmitter Output Pulse Position of Bit 5 5a0.2 5a 5a0.2 ns tTPPB6 Transmitter Output Pulse Position of Bit 6 6a0.2 6a 6a0.2 ns tJCC FIN3385 Transmitter Clock Out Jitter 40 MHz 350 370 tTPPB0 Transmitter Output Pulse Position of Bit 0 tTPPB1 Transmitter Output Pulse Position of Bit 1 tTPPB2 Transmitter Output Pulse Position of Bit 2 tTPPB3 Transmitter Output Pulse Position of Bit 3 tTPPB4 Transmitter Output Pulse Position of Bit 4 tTPPB5 tTPLLS See Figure 16 a f (Cycle-to-Cycle) f 65 MHz 210 230 See Figure 20 f 85 MHz 110 150 Transmitter Phase Lock Loop Set Time (Note 15) See Figure 22, (Note 14) 10.0 ps ms Note 13: Outputs of all transmitters stay in 3-STATE until power reaches 2V. Both clock and data output begins to toggle 10ms after VCC reaches 3V and Power-Down pin is above 1.5V. Note 14: This output data pulse position works for TTL inputs except the LVDS output bit mapping difference (see Figure 14). Figure 16 shows the skew between the first data bit and clock output. Also 2-bit cycle delay is guaranteed when the MSB is output from transmitter. Note 15: This jitter specification is based on the assumption that PLL has a ref clock with cycle-to-cycle input jitter less than 2ns. 7 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 Transmitter AC Electrical Characteristics FIN3385 • FIN3383 • FIN3384 • FIN3386 Receiver DC Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. (Note 16) Symbol Parameter Test Conditions Min Typ Max Units V LVTTL/CMOS DC Characteristics VIH Input High Voltage 2.0 VCC VIL Input Low Voltage GND 0.8 VOH Output High Voltage IOH 0.4 mA VOL Output Low Voltage IOL VIK Input Clamp Voltage IIK IIN Input Current VIN IOFF Input/Output Power Off Leakage Current VCC 2.7 2mA 18 mA 3.3 0.06 0.3 0.79 1.5 V 10.0 PA 10.0 0V to 4.6V 0V, All LVTTL Inputs/Outputs 0V to 4.6V IOS Output Short Circuit Current VOUT 60.0 0V V V V r10.0 PA 120 mA Receiver LVDS Input Characteristics VTH Differential Input Threshold HIGH Figure 2, Table 2 VTL Differential Input Threshold LOW Figure 2, Table 2 VICM Input Common Mode Range Figure 2, Table 2 IIN Input Current VIN 2.4V, VCC VIN 0V, VCC 100 100 mV mV 0.05 3.6V or 0V 3.6V or 0V 2.35 V r10.0 PA r10.0 PA Receiver Supply Current ICCWR 4:28 Receiver Power Supply Current for Worst Case Pattern (With Load) CL 8 pF, (Note 17) See Figure 3 32.5 MHz 70.0 40.0 MHz 75.0 66.0 MHz 114 85.0 MHz ICCWR 3:21 Receiver Power Supply Current mA 135 32.5 MHz 49.0 60.0 for Worst Case Pattern (With Load) CL (Note 17) See Figure 3 ICCPDT Powered Down Supply Current PwrDn tRCOP Receiver Clock Output (RxCLKOut) Period tRCOL RxCLKOut LOW Time See Figure 8 4.0 5.0 6.0 ns tRCOH RxCLKOut HIGH Time (f 4.5 5.0 6.5 ns tRSRC RxOut Valid Prior to RxCLKOut (Rising Edge Strobe) tRHRC RxOut Valid After RxCLKOut tROLH Output Rise Time (20% to 80%) CL tROHL Output Fall Time (80% to 20%) See Figure 4 tRCCD Receiver Clock Input to Clock Output Delay See Figure 20, (Note 18) 8 pF, 40.0 MHz 53.0 65.0 66.0 MHz 78.0 100 85.0 MHz 90.0 115 NA 55.0 T 50.0 0.8V (RxOut stays LOW) 11.76 85MHz) 3.5 TA 25qC and VCC 3.3V PA ns 3.5 8 pF, mA ns 2.0 3.5 ns 1.8 3.5 ns 3.5 5.0 7.5 ns tRPDD Receiver Power-Down Delay 1.0 Ps tRSPB0 Receiver Input Strobe Position of Bit 0 0.49 0.84 1.19 ns tRSPB1 Receiver Input Strobe Position of Bit 1 2.17 2.52 2.87 ns tRSPB2 Receiver Input Strobe Position of Bit 2 3.85 4.20 4.55 ns tRSPB3 Receiver Input Strobe Position of Bit 3 5.53 5.88 6.23 ns tRSPB4 Receiver Input Strobe Position of Bit 4 7.21 7.56 7.91 ns tRSPB5 Receiver Input Strobe Position of Bit 5 8.89 9.24 9.59 ns tRSPB6 Receiver Input Strobe Position of Bit 6 10.57 10.92 11.27 ns tRSKM RxIN Skew Margin See Figure 17, (Note 19) tRPLLS Receiver Phase Lock Loop Set Time See Figure 11 10.0 ms See Figure 13 See Figure 17 (f 85MHz) 290 ps Note 16: All Typical values are at TA 25qC and with V CC 3.3V. Positive current values refer to the current flowing into device and negative values means current flowing out of pins. Voltage are referenced to ground unless otherwise specified (except 'VOD and VOD). Note 17: The power supply current for the receiver can be different with the number of active I/O channels. Note 18: Total channel latency from Sewrializer to deserializer is (T tTCCD). There is the clock period. Note 19: Receiver skew margin is defined as the valid sampling window after considering potential setup/hold time and minimum/maximum bit position. www.fairchildsemi.com 8 Symbol Parameter Min Typ Max Units 15.0 T 50.0 ns 10.0 11.0 ns See Figure 8 10.0 12.2 ns RxOut Valid Prior to RxCLKOut (Rising Edge Strobe) 6.5 11.6 ns RxOut Valid After RxCLKOut (f 6.0 11.6 5.0 6.3 9.0 See Figure 8, (Note 20) 5.0 7.6 9.0 (Rising Edge Strobe) 4.5 7.3 4.0 6.3 tRCOP Receiver Clock Output (RxCLKOut) Period tRCOL RxCLKOut LOW Time tRCOH RxCLKOut HIGH Time tRSRC tRHRC tRCOL RxCLKOut LOW Time tRCOH RxCLKOut HIGH Time tRSRC RxOut Valid Prior to RxCLKOut Test Conditions See Figure 8 40 MHz) tRHRC RxOut Valid After RxCLKOut (f tROLH Output Rise Time (20% to 80%) CL 66 MHz) tROHL Output Fall Time (80% to 20%) See Figure 8 tRCCD Receiver Clock Input to Clock Output Delay 8 pF, (Note 20) See Figure 10, (Note 21) 25qC and VCC TA 3.3V ns ns ns ns ns 2.0 5.0 ns 1.8 5.0 ns 3.5 5.0 7.5 ns 1.0 Ps tRPDD Receiver Power-Down Delay tRSPB0 Receiver Input Strobe Position of Bit 0 1.0 1.4 2.15 ns tRSPB1 Receiver Input Strobe Position of Bit 1 4.5 5.0 5.8 ns tRSPB2 Receiver Input Strobe Position of Bit 2 See Figure 17 8.1 8.5 9.15 ns tRSPB3 Receiver Input Strobe Position of Bit 3 (f 11.6 11.9 12.6 ns tRSPB4 Receiver Input Strobe Position of Bit 4 15.1 15.6 16.3 ns tRSPB5 Receiver Input Strobe Position of Bit 5 18.8 19.2 19.9 ns tRSPB6 Receiver Input Strobe Position of Bit 6 22.5 22.9 23.6 ns tRSPB0 Receiver Input Strobe Position of Bit 0 0.7 1.1 1.4 ns tRSPB1 Receiver Input Strobe Position of Bit 1 tRSPB2 Receiver Input Strobe Position of Bit2 See Figure 17 (f See Figure 13 40 MHz) 3.3 3.6 ns 5.5 5.8 ns tRSPB3 Receiver Input Strobe Position of Bit 3 tRSPB4 Receiver Input Strobe Position of Bit 4 tRSPB5 tRSPB6 tRSKM RxIn Skew Margin f 40 MHz 490 See Figure 17, (Note 22) f 66 MHz 400 Receiver Phase Lock Loop Set Time See Figure 11 tRPLLS 65 MHz) 2.9 5.1 7.3 7.7 8.0 ns 9.5 9.9 10.2 ns Receiver Input Strobe Position of Bit 5 11.7 12.1 12.4 ns Receiver Input Strobe Position of Bit 6 13.9 14.3 14.6 ns ps 10.0 ms Note 20: For the receiver with falling-edge strobe, the definition of setup/hold time will be slightly different from the one with rising-edge strobe. The clock reference point is the time when the clock falling edge passes through 2V. For hold time tRHRC, the clock reference point is the time when falling edge passes through 0.8V. Note 21: Total channel latency from Sewrializer to deserializer is (T tTCCD) (2*T tRCCD). There is the clock period. Note 22: Receiver skew margin is defined as the valid sampling window after considering potential setup/hold time and minimum/maximum bit position. 9 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 Receiver AC Electrical Characteristics (66MHz) FIN3385 • FIN3383 • FIN3384 • FIN3386 FIGURE 1. Differential LVDS Output DC Test Circuit Note A: For all input pulses, tR or tF 1 ns. Note B: CL includes all probe and jig capacitance. FIGURE 2. Differential Receiver Voltage Definitions and Propagation Delay and Transition Time Test Circuit TABLE 2. Receiver Minimum and Maximum Input Threshold Test Voltages Applied Voltages (V) VIA VIB Resulting Differential Input Voltage Resulting Common Mode Input Voltage (mV) (V) VID VIC 1.25 1.15 100 1.2 1.15 1.25 100 1.2 2.4 2.3 100 2.35 2.3 2.4 100 2.35 0.1 0 100 0.05 0 0.1 100 0.05 1.5 0.9 600 1.2 0.9 1.5 600 1.2 2.4 1.8 600 2.1 1.8 2.4 600 2.1 0.6 0 600 0.3 0 0.6 600 0.3 www.fairchildsemi.com 10 Note: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and LVTTL/CMOS I/O. Depending on the valid strobe edge of transmitter, the TxCLKIn can be either rising or falling edge data strobe. FIGURE 3. “Worst Case” Test Pattern FIGURE 4. Transmitter LVDS Output Load and Transition Times FIGURE 5. Transmitter Setup/Hold and HIGH/LOW Times (Rising Edge Strobe) FIGURE 6. Transmitter Input Clock Transition Time 11 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 AC Loading and Waveforms FIN3385 • FIN3383 • FIN3384 • FIN3386 AC Loading and Waveforms (Continued) FIGURE 7. Transmitter Outputs Channel-to-Channel Skew Note: For the receiver with falling-edge strobe, the definition of setup/hold time will be slightly different from the one with rising-edge strobe. The clock reference point is the time when the clock falling edge passes through 2V. For hold time tRHRC, the clock reference point is the time when falling edge passes through 0.8V. FIGURE 8. (Receiver) Setup/Hold and HIGH/LOW Times FIGURE 9. Transmitter Clock In to Clock Out Delay (Rising Edge Strobe) FIGURE 10. Receiver Clock In to Clock Out Delay (Falling Edge Strobe) www.fairchildsemi.com 12 FIN3385 • FIN3383 • FIN3384 • FIN3386 AC Loading and Waveforms (Continued) FIGURE 11. Receiver Phase Lock Loop Set Time FIGURE 12. Transmitter Power-Down Delay FIGURE 13. Receiver Power-Down Delay 13 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 AC Loading and Waveforms (Continued) Note: The information in this diagram shows the relationship between clock out and the first data bit. A 2-bit cycle delay is guaranteed when the MSB is output from the transmitter. FIGURE 14. 28 Parallel LVTTL Inputs Mapped to 4 Serial LVDS Outputs Note: This output data pulse position works for both transmitter with 28 or 21 TTL inputs except the LVDS output bit mapping difference. All the information in this diagram tells that the skew between the first data bit and clock output. Also 2-bit cycle delay is guaranteed when the MSB is output from transmitter. FIGURE 15. 21 Parallel LVTTL Inputs Mapped to 3 Serial LVDS Outputs www.fairchildsemi.com 14 FIN3385 • FIN3383 • FIN3384 • FIN3386 AC Loading and Waveforms (Continued) FIGURE 16. Transmitter Output Pulse Bit Position FIGURE 17. Receiver Input Bit Position 15 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 AC Loading and Waveforms (Continued) Note: tRSKM is the budget for the cable skew and source clock skew plus ISI (Inter-Symbol Interference). Note: The minimum and maximum pulse position values are based on the bit position of each of the 7 bits within the LVDS data stream across PVT (Process, Voltage Supply, and Temperature). FIGURE 18. Receiver LVDS Input Skew Margin Note: Test setup used considers no requirement for separation of RMS and deterministic jitter. Other hardware setup such as Wavecrest boxes can be used if no M1 software is available, but the test methodology in Figure 20 should be followed. FIGURE 19. Transmitter Clock Out Jitter Measurement Setup Note: This jitter pattern is used to test the jitter response (Clock Out) of the device over the power supply range with worst jitter r3ns (cycle-to-cycle) clock input. The specific test methodology is as follows: • Switching input data TxIn0 to TxIn20 at 0.5 MHz, and the input clock is shifted to left 3ns and to the right 3ns when data is HIGH. • The r3 ns cycle-to-cycle input jitter is the static phase error between the two clock sources. Jumping between two clock sources to simulate the worst case of clock edge jump (3 ns) from graphical controllers. Cycle-to-cycle jitter at TxCLK out pin should be measured cross VCC range with 100mV noise (VCC noise frequency 2 MHz). FIGURE 20. Timing Diagram of Transmitter Clock Input with Jitter www.fairchildsemi.com 16 FIN3385 • FIN3383 • FIN3384 • FIN3386 AC Loading and Waveforms (Continued) Note: The 16-grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed to produce groups of 16 vertical strips across the display. FIGURE 21. “16 Grayscale” Test Pattern FIGURE 22. Transmitter Phase Lock Loop Time 17 www.fairchildsemi.com FIN3385 • FIN3383 • FIN3384 • FIN3386 Low Voltage 28-Bit Flat Panel Display Link Serializers/Deserializers Physical Dimensions inches (millimeters) unless otherwise noted 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD56 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 18