1/4 STRUCTURE Silicon Monolithic Integrated Circuit TYPE Regulator IC for Memory termination PRODUCT SERIES BD3533HFN FEATURES ・Incorporates a push-pull power supply for termination (VTT) ・Incorporates a reference voltage circuit(VREF) ・Compatible with Dual Channel (DDR-Ⅱ) ○ ABSOLUTE MAXIMUM RATINGS (Ta=100℃) Parameter Symbol Input Voltage VCC Enable Input Voltage VEN Termination Input Voltage VTT_IN VDDQ Reference Voltage VDDQ Output Current ITT Power Dissipation1 Pd1 Power Dissipation2 Pd2 Power Dissipation3 Pd3 Operating Temperature Range Topr Storage Temperature Range Tstg Maximum Junction Temperature Tjmax Limit 7 *1*2 7 *1*2 7 *1*2 7 *1*2 1 630 *3 1350 *4 1750 *5 -30～+100 -55～+150 +150 Unit V V V V A mW mW mW ℃ ℃ ℃ *1 Should not exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board (copper foil density 0.2%) θja=198.4℃/Ｗ *4 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board (copper foil density 7%) θja=92.4℃/Ｗ *5 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board (copper foil density 65%) θja=71.4℃/Ｗ ○ RECOMMENDED OPERATING CONDITIONS (Ta=25℃) PARAMETER SYMBOL Input Voltage VCC Termination Input Voltage VTT_IN VDDQ Reference Voltage VDDQ Enable Input Voltage VEN ★ MIN 2.7 1.0 1.0 -0.3 MAX 5.5 5.5 2.75 5.5 UNIT V V V V No radiation-resistant design is adopted for the present product. The Japanese version of this document is the official specification. This translated version is intended only as a reference, to aid in understanding the official version. If there are any differences between the original and translated versions of this document, the official Japanese language version takes priority. REV. E 2/4 ○ ELECTRICAL CHARACTERISTICS (Unless otherwise specified,Ta=25℃ VCC=3.3V VEN=3V VDDQ=1.8V VTT_IN=1.8V) LIMIT PARAMETER SYMBOL UNIT MIN TYP MAX Standby Current IST 0.5 1.0 mA Bias Current ICC 2 4 mA [Enable] High Level Enable Input VENHIGH 2.3 5.5 V Voltage Low Level Enable Input VENLOW -0.3 0.8 V Voltage Enable Pin Input Current IEN 7 10 uA [Termination] Termination Output VTT1 VREF-30m VREF VREF+30m V Voltage 1 Termination Output Voltage 2 Source Current Sink Current Load Regulation Line Regulation Upper Side ON Resistance 1 Lower Side ON Resistance 1 Upper Side ON Resistance 2 Lower Side ON Resistance 2 [Input of Reference Voltage] Input Impedance [Reference voltage] VTT2 VREF-30m VREF VREF+30m V ITT+ ITT⊿VTT Reg.l 1.0 - 20 -1.0 50 40 A A mV mV HRON1 - 0.45 0.9 Ω LRON1 - 0.45 0.9 Ω HRON2 - 0.4 0.8 Ω LRON2 - 0.4 0.8 Ω ZVDDQ 70 100 130 kΩ 1/2×VDDQ 1/2×VDDQ 1/2×VDDQ +18m -18m 1/2×VDDQ 1/2×VDDQ 1/2×VDDQ +40m -40m V Output Voltage 1 VREF1 Output Voltage 2 VREF2 Output Voltage 3 VREF3 1/2×VDDQ 1/2×VDDQ 1/2×VDDQ +25m -25m V Output Voltage 4 VREF4 1/2×VDDQ 1/2×VDDQ 1/2×VDDQ +40m -40m V [UVLO] UVLO OFF Voltage Hysteresis Voltage *6 VUVLO ⊿VUVLO 2.40 100 2.55 160 Design Guarantee REV. E 2.70 220 V V mV CONDITIONS VEN=0V VEN=3V VEN=3V ITT=-1.0A to 1.0A Ta=0℃ to 100℃ *6 VCC=5V, VDDQ=2.5V VTT_IN=2.5V ITT=-1.0A to 1.0A Ta=0℃ to 100℃ *6 ITT=-1.0A to 1.0A Vcc=5V, VDDQ=2.5V VTT_IN=2.5V Vcc=5V, VDDQ=2.5V VTT_IN=2.5V IREF=-5mA to 5mA Ta=0℃ to 100℃ *6 IREF=-10mA to 10mA Ta=0℃ to 100℃ *6 VCC=5V, VDDQ=2.5V VTT_IN=2.5V IREF=-5mA to 5mA Ta=0℃ to 100℃ *6 VCC=5V, VDDQ=2.5V VTT_IN=2.5V IREF=-10mA to 10mA Ta=0℃ to 100℃ *6 VCC : sweep up VCC : sweep down 3/4 ○ PHYSICAL DIMENSIONS B D 3 5 3 3 1PIN MARK Lot No. HSON8 (Unit:mm) ○ ○ Pin number Pin name BLOCK DIAGRAM VCC C2 6 C3 VCC 5 VCC + Reference Block VTT_IN VDDQ VDDQ VCC Thermal TSD EN 2 Enable VTT_IN VCC SOFT UVLO UVLO Protection 7 TSD EN UVLO + - TSD VCC EN UVLO + TSD EN UVLO 8 C4 3 4 EN VTT VTTS VREF C1 1 VTT GND REV. E ½× VDDQ Pin No. 1 2 3 4 5 6 7 8 FIN Pin Name GND EN VTTS VREF VDDQ VCC VTT_IN VTT － 4/4 ○NOTES FOR USE (1) Absolute maximum range Although the quality of this product is rigorously controlled, and circuit operation is guaranteed within the operation ambient temperature range, the device may be destroyed when applied voltage or operating temperature exceeds its absolute maximum rating. Because the failure mode (such as short mode or open mode) cannot be identified in this instance, it is important to take physical safety measures such as fusing if a specific mode in excess of absolute rating limits is considered for implementation. (2) Ground potential Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the operating mode, including transient conditions. (3) Thermal Design Provide sufficient margin in the thermal design to account for the allowable power dissipation (Pd) expected in actual use. (4) Using in the strong electromagnetic field Use in strong electromagnetic fields may cause malfunctions. (5) ASO Be sure that the output transistor for this IC does not exceed the absolute maximum ratings or ASO value. (6) Thermal shutdown circuit The IC is provided with a built-in thermal shutdown (TSD) circuit. When chip temperature reaches the threshold temperature shown below, output goes to a cut-off (open) state. Note that the TSD circuit is designed exclusively to shut down the IC in abnormal thermal conditions. It is not intended to protect the IC per se or guarantee performance when extreme heat occurs. Therefore, the TSD circuit should not be employed with the expectation of continued use or subsequent operation once TSD is operated. TSD ON temperature [℃] (typ.) Hysteresis temperature [℃] (typ.) 175 15 (7) GND pattern When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. (8) Output Capacitor (C1) Mount an output capacitor between VREF and GND for stability purposes. The VREF output capacitor is for the open loop gain phase compensation. If the capacitor value is not large enough, the output voltage may oscillate. A ceramic 1.0 - 10uF capacitor with minimal susceptibility to temperature is recommended. However, this stability depends on the characteristics of temperature and load. Please confirm operation across a variety of temperature and load conditions. (9) Output Capacitor (C4) Mount an output capacitor between VTT and GND for stability purposes. The output capacitor is for the open loop gain phase compensation and reduces the output voltage load regulation. If the capacitor value is not large enough, the output voltage may oscillate. And if the equivalent series resistance (ESR) is too large, the output voltage rise/drop increases during a sudden load change. A 47 - 220uF polymer capacitor is recommended. However, the stability depends on the characteristics of temperature and load conditions. And if a small ESR capacitor such as a ceramic capacitor is utilized, the output voltage may oscillate due to lack of phase margin. In this case, measures can be taken by adding a resistor in series with this capacitor. Please confirm operation across a variety of temperature and load conditions. (10) Input Capacitor (C2, C3) The input capacitor reduces the output impedence of the voltage supply source connected in the VCC and VTT_IN. If the output impedence of this power supply increases, the input voltage (VCC,VTT_IN) may become unstable. This may result in the output voltage oscillation or lowering ripple rejection. A low ESR 1uF capacitor in VCC and 10uF capacitor in VTT_IN with minimal susceptibility to temperature are preferable, but stability depends on power supply characteristics and the substrate wiring pattern (a parasitic capacitance and impedance). Please confirm operation across a variety of temperature and load conditions. (11) Input （VCC, VDDQ, VTT_IN, EN） The VCC, VDDQ, VTT_IN, and EN are isolated. The UVLO function is integrated to protect faulty operation due to low voltage levels of VCC. VTT output voltage starts up when VCC reaches the UVLO threshold level and EN reaches the threshold level respectively regardless of the start up order in those inputs. And also VREF output voltage starts up when VCC reaches the UVLO threshold level. When the VDDQ and VTT_IN has the same voltage and are supposed to connect each other, VDDQ pin voltage may change due to the voltage drop on the VTT_IN and VDDQ common wiring caused by VTT_IN input current change. This may result in the voltage change of the VTT output. Avoid drawing wiring pattern of VDDQ and VTT_IN so that they do not have common wiring. If the common wiring is inevitable due to limited PCB area, it is recommended that CR filter be added between VTT_IN and VDDQ. (Example) (12) VTTS VTTS is to improve load regulation of VTT output. For precise load regulation, OUTPUT PIN VTTS is connected close by VTT to avoid common impedance. (13) Heat sink (FIN) Since the heat sink (FIN) is connected with the Sub, short it to the GND. It is possible to minimize the thermal resistance by soldering it to GND plane of PCB. (14) Short-circuits between pins and and mounting errors Do not short-circuit between output pin (Vo) and supply pin (Vcc) or ground (GND), or between supply pin (Vcc) and ground (GND). Mounting errors, such as incorrect positioning or orientation, may destroy the device. (15) Please add a protection diode when a large inductance component is connected to the output terminal, and reverse-polarity power is possible at startup or in output OFF condition REV. E Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2009 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster @ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix-Rev4.0