ROHM BD7003NUX

CMOS LDO Regulator for Portable Equipments
Dual, Low-Dropout
Linear Regulator
BD7003NUX, BD7004NUX
No.12020ECT09
●Descriptions
The BD7003NUX, BD7004NUX are dual channels, 300mA low-dropout voltage regulator output at each channel. The output
voltage range is from 1.2V to 3.3V by operating range from 2.5V to 5.5V. The output voltages, VOUT1 and VOUT2, are
determined at power up by the state of P1 and P2(see the table of “Output-Voltage Programming”). The BD7003NUX,
BD7004NUX offer 1.8% accuracy and low-dropout. The shutdown current is near the zero current which is suitable for
battery powered device. The BD7003NUX, BD7004NUX are mounted on VSON008X2020(2.0mmX2.0mmX0.6mm), which
contributes to the space-saving design of set.
●Features
1) 2-channel 300mA, CMOS-type LDOs.
2) Pin-Programmable Output Voltage.
(9 steps adjustable VO；See the Table of “Output-Voltage Programming”.)
3) LDOs Power ON/OFF Enable Control.
4) 2.0mm×2.0mm Package.
5) Small Ceramic Output Capacitors(1μF).
6) Equipped with Over Current Limiter and Thermal Shutdown Circuit(TSD) .
●Applications
Battery-powered portable equipment, etc.
●Absolute Maximum Ratings (Ta = 25℃)
Parameter
Symbol
Ratings
Unit
VIN
-0.3 ～ 7
V
Maximum Input Voltage 1 (P1,P2,EN1,EN2)
VINMAX1
-0.3 ～ 7
V
Maximum Input Voltage 2 (Vout1,Vout2)
VINMAX2
-0.3～Vin+0.3
V
Pd
1360*1
mW
Operating Temperature Range
Topr
-40 ～ +85
℃
Storage Temperature Range
Tstg
-55 ～ +150
℃
Maximum Supply Voltage (VIN)
Power Dissipation
*
*
1
This is the allowable loss of when it is mounted on a ROHM specification board 40mm×40mm×1.5mmt
To use at temperature higher than 25C , derate 10.9mW per 1℃
This product is not especially designed to be protected from radioactivity.
●Recommended Operating Range (Ta=-40～+85℃)
Parameter
Input Power Supply Voltage Range
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© 2012 ROHM Co., Ltd. All rights reserved.
Symbol
Ratings
Unit
VIN
2.5～5.5
V
1/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Power Dissipation
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC
are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.)
(VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1 (Double-side Board)
Layout of Board for
Measurement
(Unit: mm)
Top Layer (Top View)
IC
Implementation
Position
Bottom Layer (Top View)
1.36W
Power Dissipation
θja=91.9℃/W
Thermal Resistance
1. 6
Evaluation Bord1
1. 4
1.36W
Power Dissipation : Pd (W)
1. 2
1. 0
0. 8
0. 6
0. 4
0. 2
0. 0
0
25
50
75
100
125
150
175
200
Ambient Temperature :Ta (℃ )
Fig.1. VSON008X2020 Power dissipation heat reduction characteristics (Reference)
* Please design the margin so that PMAX becomes is than Pd (PMAXPd)
within the usage temperature range.
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© 2012 ROHM Co., Ltd. All rights reserved.
2/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Electrical Characteristics (Vin=3.7V, EN1=EN2=Vin,Ta =+25℃, unless otherwise noted.)
Parameter
Symbol
Output Voltage range
Typ
Max
Unit
Condition
VOUT
1.2
-
3.3
V
VIN
2.5
-
5.5
V
Δvouta
-1.8
-
1.8
%
Iout=1mA, VOUT≧1.5V
Δvoutb
-30
-
+30
mV
Iout=1mA, VOUT=1.2V
Imax
300
-
-
mA
Isc
-
150
-
mA
-
55
95
-
35
65
Input Voltage range
Output Voltage Accuracy
Limits
Min
Maximum Output Current
Short Circuit Current
Ground Pin Current
Iq
Dropout Voltage
Vdrop
μA
Iout=0mA
One LDO shutdown, Iout=0mA
-
120
170
VIN=2.5V, VOUT=2.6V, Iout=100mA
-
90
140
VIN=2.7V, VOUT=2.8V, Iout=100mA
80
130
VIN=2.9V, VOUT=3.0V, Iout=100mA
-
70
120
-
360
510
-
270
420
VIN=2.7V, VOUT=2.8V, Iout=300mA
240
390
VIN=2.9V, VOUT=3.0V, Iout=300mA
mV
-
210
360
Line Regulation
ΔVLNR
-
0.02
0.2
%/V
Load Regulation
ΔVLDR
-
0.2
0.6
%
Ripple Rejection
PSRR
-
66
-
dB
en
-
150
-
μVrms
ViH
1.2
-
-
ViL
-
-
0.5
Output Noise
VOUT = 0V
VIN=3.2V, VOUT=3.3V,Iout=100mA
VIN=2.5V, VOUT=2.6V, Iout=300mA
VIN=3.2V, VOUT=3.3V, Iout=300mA
VIN=VOUT+1V to VIN=5.5V, Iout=10mA
Iout=1mA to 300mA
f=100Hz,Iout=10mA@VOUT=1.5V
fBW=10Hz to 100kHz;Iout=10mA
●EN1, EN2
Enable Input Threshold
Regulator enabled
Regulator shutdown
Ien
-
0.1
1
μA
Ven=VIN , Ta=+25℃
IQSHDN
-
0.1
1
μA
Vout=0V , Ta=+25℃
Enable Input Leakage Current
Shutdown Supply Current
V
*This product is not especially designed to be protected from radioactivity.
Output-Voltage Programming
BD7003NUX
PIN Name
Set up
BD7004NUX
P1
P2
VOUT1
VOUT2
VOUT1
VOUT2
OPEN
OPEN
1.50
2.80
1.20
1.50
OPEN
GND
1.80
2.60
1.20
1.80
OPEN
VIN
1.80
2.70
1.80
1.50
GND
OPEN
1.80
2.80
1.80
1.80
GND
GND
1.80
2.90
1.80
3.00
GND
VIN
2.60
2.80
1.80
3.30
VIN
OPEN
2.80
2.80
2.80
3.00
VIN
GND
2.90
2.90
3.00
3.00
VIN
VIN
2.80
3.30
3.30
3.30
Output Voltage Programming Input (P1、P2)
Output voltages, VOUT1 and VOUT2, are determined at power up by the state of P1 and P2 (see the table of
“Output-Voltage Programming”). Subsequent charges to P1 and P2 do not change the output voltages unless the supply
power is cycled, or all EN inputs are simultaneously driven low to shutdown the device.
Shutdown (EN1, EN2)
The BD7003NUX, BD7004NUX have independent shutdown control inputs, EN1 and EN2. Driving both EN1 and EN2
low will shut down the entire device, reducing supply current to 1μA max. Connecting EN1 and EN2 to a logic-high or
VIN will enable the corresponding output(s).
It is prohibited to open EN1, EN2 switches.
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© 2012 ROHM Co., Ltd. All rights reserved.
3/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Typical Application Circuit
BD7003NUX, BD7004NUX
VIN
VIN
CIN
1μF
VOUT1
COUT1
1μF
P1
P2
VIN
EN1
VIN
EN2
VOUT2
COUT2
1μF
GND
Figure2. Application Circuit
*It is prohibited to open EN1, EN2 switches.
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© 2012 ROHM Co., Ltd. All rights reserved.
4/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Package Dimensions (VSON008X2020)
Device
name
Lot No.
[Unit: mm]
Device name
Marking
BD7003NUX
BD7003
BD7004NUX
BD7004
●Pin Descriptions
PIN description (Top View)
Note : Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
PIN No.
Name
I/O
1
VIN
2
EN1
3
4
5
ESD Diode
Function
IN
GND
I
-
O
Voltage Supply
I
-
O
Enable Input1
P2
I
O
O
Control Output-Voltage PIN2
P1
I
O
O
Control Output-Voltage PIN1
EN2
I
-
O
Enable Input2
6
GND
-
O
-
GND PIN
7
VOUT2
O
-
O
LDO1 Output1
8
VOUT1
O
-
O
LDO2 Output2
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© 2012 ROHM Co., Ltd. All rights reserved.
5/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Equivalent Circuit
2pin, 5pin (EN)
3pin, 4pin (P)
3kΩ
3kΩ
3-State
Decoder
H
OPEN
L
8pin, 7pin (VOUT)
●Block Diagram
VIN
1
EN1 2
EN2 5
P1 4
P2 3
P
SHUTDOWN
AND POWER
- ON
CONTROL
ERROR
AMP
OUTPUT
VOLTAGE
CONTROL
EN1
OVER CURRENT
PROTECTION
DISCHARGE
CIRCUIT
8 VOUT1
LDO1
VIN
VREF
&
TSD
LDO2
GND 6
7 VOUT2
Fig.3. Block Diagram
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© 2012 ROHM Co., Ltd. All rights reserved.
6/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Typical Operating Characteristics
※The test conditions for the Typical Operating Characteristics are VIN=3.7V, CIN=1.0uF, COUT=1.0uF, Ta=25℃, Unless otherwise noted.
1.6
1.4
VOUT1=1.2V
Io=300mA
Io=10mA
0.6
Io=1mA
0.4
Ｉo=0mA
Io=300mA
1
0.8
Io=10mA
0.6
Io=1mA
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
1
0
0
5.5
Io=1mA
Ｉo=0mA
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
Input Voltage(V)
Input Voltage(V)
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage(V)
Fig.6. Output Voltage
(VOUT1=3.3V)
Fig.5. Output Voltage
(VOUT2=1.5V)
Fig.4. Output Voltage
(VOUT1=1.2V)
1.6
1.4
3.5
1.4
VOUT1= 1.2V
Out put Volt age(V)
Io=1mA
0.8
Io=10mA
Io=300mA
0.6
0.4
3
Ｉo=0mA
1.2
Ｉo=0mA
1
Io=1mA
1
VOUT2=1.5V
Io=10mA
0.8
Io=300mA
0.6
0.2
0
0
2 .5
3
3.5
4
4 .5
Input Volt age(V)
5
Io=0mA
2
Io=1mA
Io=10mA
1.5
Io=300mA
1
0.4
0.2
VOUT1=3.3V
2.5
Output Voltage(V)
1.2
0.5
0
3.7
5.5
2 .5
Fig.7. Line Regulation
(VOUT1=1.2V)
3
3.5
4
Input Volt age(V)
4 .5
5
100
100
P1=P2=GND
P1=P2=GND
G n d C u rre n t (u A )
7
6
5
Ta=85℃
Ta=25℃
Ta=-40℃
4
3
P1=P2=GND
P1=P2=GND
P1=P2=GND
8
2
5.2
Fig.9. Line Regulation
(VOUT1=3.3V)
P1=P2=GND
9
4.7
Input Voltage(V)
Fig.8. Line Regulation
(VOUT2=1.5V)
10
4.2
5 .5
80
60
G n d C u rre n t ( u A )
Out put Volt age(V)
Io=10mA
1.5
0
0
Io=300mA
2
0.5
0.2
0
G n d C u rre n t (u A )
2.5
Ｉo=0mA
0.4
0.2
O u tp u t V o l tag e(V)
1
0.8
VOUT1=3.3V
3
1.2
O u tp u t Vo l tag e(V)
O u tp u t V o l tag e(V )
3.5
VOUT2=1.5V
1.4
1.2
Ta=85℃
Ta=25℃
Ta=-40℃
40
20
80
Ta=85℃
Ta=25℃
Ta=-40℃
60
40
20
1
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Fig.10. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=GND
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0 0.5
Input Voltage (V)
Fig.11. Circuit Current
(VOUT1=1.8V,VOUT2=2.9
V) EN1=VIN, EN2=GND
100
0.9
P1=P2=GND
0.8
60
40
Ta=85℃
Ta=25℃
Ta=-40℃
20
0
0 0.5 1 1.5
2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage (V)
Fig.13. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=VIN
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E N C u rre n t (u A )
80
1 1.5
2
2.5
3
3.5
4 4.5
5 5.5
Inpuｔ Voltage (V)
Fig.12. Circuit Current
(VOUT1=1.8V,VOUT2=2.9V)
EN1=GND, EN2=VIN
1.0
1.0
P1=P2=GND
G n d C u rre n t (u A )
0
0
5.5
Input Voltage (V)
0.9
P1=P2=GND
0.7
0.6
0.5
0.4
0.3
Ta=85℃
Ta=25℃
Ta=-40℃
0.2
E N C u rre n t (u A )
0
P1=P2=GND
0.8
0.7
0.6
0.5
0.4
0.3
Ta=85℃
0.2
0.1
0.1
0.0
0.0
Ta=25℃
Ta=-40℃
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage (V)
Input Voltage(V)
Fig.14. EN1 Input Current
7/13
Fig.15. EN2 Input Current
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
2.0
3.0
P1=P
2 GN
4
3.5
2.5
3
Ta=85℃
Ta=25℃
Ta=-40℃
1.0
2.0
1.5
Ta=85℃
Ta=25℃
Ta=-40℃
1.0
2.5
Vout1 [V]
O u tp u t V o lta g e (V )
O u tp u t V o lta g e (V )
1.5
2
1.5
1
0.5
0.5
0.0
0.5
1
1.5
0
0.5
EN Voltage (V)
1
1.5
-40
4
10
9
P1=P2=GND
80
Gnd Current (uA)
G n d C u rre n t (u A )
7
Io=0mA
2
1.5
85
P1=P2=GND
3
Io=0.1mA
60
100
P1=P2=GND
8
Vou t2 [V]
10
35
Tem p [°C]
Fig.18. VOUT - Temp
(VOUT1=1.8V)
Fig.17. EN2 Threshold
(VOUT2=2.9V)
3.5
2.5
-15
EN Voltage (V)
Fig.16. EN1 Threshold
(VOUT1=1.8V)
Io=0.1mA
0
0.0
0
Io=0mA
0.5
6
5
4
3
60
40
20
1
2
1
0.5
0
-40
0
0
-40
-40
-15
10
35
60
-15
10
85
35
60
10
Fig.20. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=GND
35
60
85
Temp (°C)
Temp (°C)
Tem p [°C]
Fig.19. VOUT – Temp
(VOUT2=3.0V)
-15
85
Fig.21.Icc- Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=VIN, EN2=GND
1.00
100
100
P1=P2=GND
P1=P2=GND
P1=P
2 GN
P1=P2=GND
80
60
40
VIN=2.7V
0.80
0.70
DropoutVoltage(V)
80
G n d C u rre n t (u A
Gnd Current (uA)
0.90
P1=P2=GND
60
40
20
20
0
0
Temp=85℃
0.60
Temp=25℃
0.50
Temp=-40℃
0.40
0.30
0.20
-40
-15
10
35
60
0.10
-40
85
-15
10
35
60
85
0.00
Temp (°C)
Temp (°C)
Fig.22. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=GND, EN2=VIN
0
Fig.23. Icc - Temp
(VOUT1=1.8V,VOUT2=2.9V)
EN1=EN2=VIN
VIN=2.7V
0.1
0.15
IOUT(A)
0.2
0.25
0.3
Fig.24. Drop Out Voltage
(VOUT1=2.8V)
1.00
0.90
0.05
4
4
3.5
3.5
0.80
3
3
2.5
2.5
Temp=85℃
0.50
Temp=25℃
0.40
Temp=25°C
Temp=-40°C
VOUT2 [V]
0.60
VOUT1 [V]
DropoutVoltage(V)
0.70
Temp=85°C
2
1.5
Temp=-40℃
Temp=-40°C
Temp=25°C
Temp=85°C
2
1.5
0.30
1
1
0.5
0.5
0.20
0.10
0
0
0.00
00
0
0.05
0.1
0.15
IOUT(A)
0.2
0.25
0.3
Fig.25. Drop Out Voltage
(VOUT2=2.8V)
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50
0.05
100
0.10
150
0.15
200
0.20
250
0.25
Iout1[A]
Fig.26. Load Regulation
(VOUT1=1.2V)
8/13
300
0.30
0
50
0.05
100
0.1
150
0.15
200
0.2
250
0.25
300
0.3
Iout2[A]
Fig.27. Load Regulation
(VOUT2=1.5V)
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
4
4
4
3.5
3.5
Temp=-40°C
Temp=25°C
Temp=85°C
3.5
Temp=25°C
3
3
3
2
1.5
1
0.5
2.5
2.5
VOUT2 [V]
V OUT1 [V ]
2.5
VOUT1 [V]
Temp=-40°
Temp=85°C
2
1
1
0.5
0.5
00
0
50
100
150
200
250
100
0.1
200
0.2
250
0.25
300
0.3
0
50
0.05
100
0.1
150
0.15
VOUT1
1V/div
VIN=3.7
1V/div
VIN=3.7
VIN=3.7
Fig.33. Discharge Time
(VOUT1=1.8V)
IOUT=0mA
Fig.32. Start Up Time
(VOUT2=2.9V)
IOUT=0mA
Fig.31. Start Up Time
(VOUT1=1.8V)
IOUT=0mA
300
0.3
1msec/div
1V/div
EN1
VOUT2
1V/div
250
0.25
Fig.30. Load Regulation
(VOUT2=3.3V)
10μsec/div
1V/div
EN2
200
0.2
Iout2[mA]
Fig.29. Load Regulation
(VOUT2=3.0V)
10μsec/div
1V/div
VOUT1
150
0.15
Iout1[A]
Fig.28. Load Regulation
(VOUT1=2.8V)
Temo=85℃
0
50
0.05
300
Iout1[A]
EN1
Temo=25℃
1.5
1.5
0
0
Temo=-40℃
2
1msec/div
1V/div
EN2
ch1
VOUT2
VIN
4.7V
4.7V
3.7V
3.7V
ch1
VIN
ch2
VOUT1
1V/div
ch2
VOUT1
1.2V
1.5V
VIN=3.7
Fig.35. VIN Response
(VOUT1=1.2V)
IOUT=50mA
Fig.34. Discharge Time
(VOUT2=2.9V)
IOUT=0mA
ch1
VIN
ch1
Fig.36. VIN Response
(VOUT1=1.5V)
IOUT=50mA
VIN
4.7V
4.7V
4.7V
3.7V
3.7V
3.7V
ch2
ch2
VOUT1
1.8V
VOUT1
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VIN
ch2
VOUT1
3.3V
3.0V
Fig.37. VIN Response
(VOUT1=1.8V)
IOUT=50mA
ch1
Fig.38. VIN Response
(VOUT2=3.0V)
IOUT=50mA
9/13
Fig.39. VIN Response
(VOUT2=3.3V)
IOUT=50mA
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
40μsec/div
Iout＝1mA->150mA
Vout1
40μsec/div
100mA/div
Iout＝1mA->150mA
200mV/div
1.2V
100mA/div
Iout＝150mA->1mA
100mA/div
Vout1
200mV/div
Vout1
3.3V
Fig.40. Load Response
(VOUT1=1.2V)
IOUT=1mA→150mA
40μsec/div
200mV/div
1.2V
Fig.41. Load Response
(VOUT1=3.3V)
IOUT=1mA→150mA
Fig.42. Load Response
(VOUT1=1.2V)
IOUT=150mA→1mA
40μsec/div
Iout＝150mA->1mA
100mA/div
Vout1
200mV/div
3.3V
Fig.43. Load Response
(VOUT1=3.3V)
IOUT=150mA→1mA
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© 2012 ROHM Co., Ltd. All rights reserved.
10/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Example of EN1&EN2 used (P1=GND,P2=OPEN, VOUT1=1.8V, VOUT2=2.8V)
Output overshoot conditions
Whenever the LDO is turned ON, LDO1 output overshoot occurs in certain boot conditions.
In CASE2, the overshoot value is minimum, which boot order is EN1→EN2.
The maximum over shoot occurs in CASE3, which boot order is EN2→EN1.
The overshoot value differs between input voltages(VIN), output voltage setting and EN1, EN2 input timing interval.
CASE1: EN1 & EN2 Pins are shorted
VIN=5.5V,EN2=EN1
VIN=3.7V,EN2=EN1
EN1(5V/div)
EN1(5V/div)
VOUT2(0.5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
VOUT1(0.5V/div)
20ms/div
20ms/div
EN1 & EN2 Pins are independent
CASE2: EN1→EN2 operation(L→H)
VIN=5.5V,EN2=L(OFF)
VIN=3.7V,EN2=L(OFF)
EN1(5V/div)
EN1(5V/div)
VOUT1(0.5V/div)
VOUT1(0.5V/div)
VOUT2(0.5V/div)
VOUT2(0.5V/div)
20ms/div
20ms/div
CASE3: EN2→EN1 operation(L→H)
VIN=3.7V,EN2=H(ON)
EN1(5V/div)
VIN=5.5V,EN2=H(ON)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
20ms/div
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11/13
EN1(5V/div)
VOUT2(0.5V/div)
VOUT1(0.5V/div)
20ms/div
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Notes for use
(1) Absolute maximum ratings
If applied voltage (VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is
a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which
absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics,
it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended
operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the IC by reverse connection of the power supply connector. For protection from reverse
connection, take measures such as externally placing a diode between the power supply and the power supply pin of
the IC.
(4) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance.
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital
power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due
to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
Furthermore, for all power supply pins of the IC, in conjunction with inserting capacitors between power supply and GND
pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss
occurring at low temperatures is not a problem for various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition,
confirm that there are no pins for which the potential becomes less than a GND by actually including transition
phenomena.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the IC. If it is
installed erroneously, there is a risk of IC damage. There also is a risk of damage if it is shorted by a foreign substance
getting between pins , between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the IC in a strong magnetic field, since it may malfunction.
(8) Inspection in set board
When inspecting the IC in the set board, since there is a risk of stress to the IC when capacitors are connected to low
impedance IC pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the
inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after
turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the
assembly process and take appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an IC structure due to potential relationships. Because parasitic elements
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the IC in other ways such that
parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not
being applied to the IC. Furthermore, when the power supply voltage is being applied, make each input pin a voltage
less than the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND
pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND
voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal shutdown circuit (TSD)
When the junction temperature becomes 180℃ (typ) or higher, the thermal shutdown circuit operates and turns the
switch OFF. The thermal shutdown circuit, which is aimed at isolating the IC from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the IC. Therefore, do not continuously use the IC with this circuit
operating or use the IC assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
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© 2012 ROHM Co., Ltd. All rights reserved.
12/13
2012.01 - Rev.C
Technical Note
BD7003NUX,BD7004NUX
●Ordering part number
B
D
7
Part No.
0
0
3
N
Part No.
7003
7004
U
X
Package
NUX: VSON008X2020
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
VSON008X2020
<Tape and Reel information>
2.0±0.05
2.0±0.05
0.6MAX
1.5±0.1
0.5±0.1
1
4
8
5
4000pcs
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
+0.03
0.02 −0.02
0.8±0.1
(0.12)
S
0.3±0.1
C0.25
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.05 S
Tape
+0.05
0.25 −0.04
1.5±0.1
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© 2012 ROHM Co., Ltd. All rights reserved.
1pin
(Unit : mm)
Reel
13/13
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.01 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
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of the Products for the above special purposes. If a Product is intended to be used for any
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More detail product informations and catalogs are available, please contact us.
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R1120A