Motion-SPM FSB50250UTD TM Smart Power Module (SPM®) Features General Description • 500V RDS(on)=4.2W(max) 3-phase FRFET inverter including high voltage integrated circuit (HVIC) FSB50250UTD is a tiny smart power module (SPM®) based on FRFET technology as a compact inverter solution for small power motor drive applications such as fan motors and water suppliers. It is composed of 6 fast-recovery MOSFET (FRFET), and 3 half-bridge HVICs for FRFET gate driving. FSB50250UTD provides low electromagnetic interference (EMI) characteristics with optimized switching speed. Moreover, since it employs FRFET as a power switch, it has much better ruggedness and larger safe operation area (SOA) than that of an IGBT-based power module or one-chip solution. The package is optimized for the thermal performance and compactness for the use in the built-in motor application and any other application where the assembly space is concerned. FSB50250UTD is the most solution for the compact inverter providing the energy efficiency, compactness, and low electromagnetic interference. • 3 divided negative dc-link terminals for inverter current sensing applications • HVIC for gate driving and undervoltage protection • 3/5V CMOS/TTL compatible, active-high interface • Optimized for low electromagnetic interference • Isolation voltage rating of 1500Vrms for 1min. • Embedded bootstrap diode in the package Absolute Maximum Ratings Symbol Parameter Conditions Rating Units 500 V VPN DC Link Input Voltage, Drain-source Voltage of each FRFET ID25 Each FRFET Drain Current, Continuous TC = 25°C 1.1 A ID80 Each FRFET Drain Current, Continuous TC = 80°C 0.8 A IDP Each FRFET Drain Current, Peak TC = 25°C, PW < 100ms 2.8 A PD Maximum Power Dissipation TC = 25°C, Each FRFET 13 W V CC Control Supply Voltage Applied between V CC and COM 20 V VBS High-side Bias Voltage Applied between V B(U)-U, VB(V)-V, VB(W)-W V IN Input Signal Voltage Applied between IN and COM TJ Operating Junction Temperature TSTG Storage Temperature R qJC Junction to Case Thermal Resistance Each FRFET under inverter operating condition (Note 1) VISO Isolation Voltage 60Hz, Sinusoidal, 1 minute, Connection pins to heatsink ©2010 Fairchild Semiconductor Corporation FSB50250UTD Rev. A 1 20 V -0.3 ~ VCC+0.3 V -40 ~ 150 °C -40 ~ 125 °C 9.3 °C/W 1500 Vrms www.fairchildsemi.com FSB50250UTD Smart Power Module (SPM®) April 2010 FSB50250UTD Smart Power Module (SPM®) Pin Descriptions Pin Number Pin Name 1 COM Pin Description IC Common Supply Ground 2 VB(U) 3 V CC(U) Bias Voltage for U Phase High Side FRFET Driving 4 IN(UH) Signal Input for U Phase High-side 5 IN(UL) Signal Input for U Phase Low-side Bias Voltage for U Phase IC and Low Side FRFET Driving 6 NC 7 V B(V) 8 VCC(V) Bias Voltage for V Phase IC and Low Side FRFET Driving 9 IN (VH) Signal Input for V Phase High-side 10 IN (VL) 11 NC 12 VB(W) 13 V CC(W) No Connection Bias Voltage for V Phase High Side FRFET Driving Signal Input for V Phase Low-side No Connection Bias Voltage for W Phase High Side FRFET Driving Bias Voltage for W Phase IC and Low Side FRFET Driving 14 IN(WH) Signal Input for W Phase High-side 15 IN(WL) Signal Input for W Phase Low-side 16 NC 17 P 18 U, VS(U) 19 NU 20 NV 21 V, VS(V) 22 NW 23 W, VS(W) No Connection Positive DC–Link Input Output for U Phase & Bias Voltage Ground for High Side FRFET Driving Negative DC–Link Input for U Phase Negative DC–Link Input for V Phase Output for V Phase & Bias Voltage Ground for High Side FRFET Driving Negative DC–Link Input for W Phase Output for W Phase & Bias Voltage Ground for High Side FRFET Driving (1) COM (2) VB(U) (17) P (3) VCC(U) VCC VB (4) IN(UH) HIN HO (5) IN(UL) LIN VS COM LO (18) U,Vs(u) (6) NC (19) NU (7) VB(V) (8) VCC(V) VCC VB (9) IN(VH) HIN HO LIN VS COM LO (10) IN(VL) (20) NV (21) V,Vs(v) (11) NC (12) VB(W) (13) VCC(W) VCC VB (14) IN(WH) HIN HO (15) IN(WL) LIN VS COM LO (22) NW (23) W,Vs(w) (16) NC Note: Source terminal of each low-side MOSFET is not connected to supply ground or bias voltage ground inside SPM®. External connections should be made as indicated in Figure 2 and 5. Figure 1. Pin Configuration and Internal Block Diagram (Bottom View) FSB50250UTD Rev. A 2 www.fairchildsemi.com Inverter Part (Each FRFET Unless Otherwise Specified) Symbol Min Typ 500 - - V Breakdown Voltage TemID = 250mA, Referenced to 25°C perature Coefficient - 0.53 - V IDSS Zero Gate Voltage Drain Current V IN= 0V, VDS = 500V - - 250 mA RDS(on) Static Drain-Source On-Resistance V CC = VBS = 15V, V IN = 5V, ID = 0.5A - 3.5 4.2 W VSD Drain-Source Diode Forward Voltage V CC = VBS = 15V, V IN = 0V, ID = -0.5A - - 1.2 V V PN = 300V, VCC = VBS = 15V, ID = 0.5A V IN = 0V « 5V Inductive load L=3mH High- and low-side FRFET switching - 1050 - ns BV DSS DBVDSS/ DTJ Parameter Drain-Source Breakdown V IN= 0V, ID = 250mA (Note 2) Voltage tON tOFF trr Conditions Switching Times EON (Note 3) EOFF RBSOA Max Units - 850 - ns - 170 - ns - 40 - mJ - 10 - mJ V = 400V, VCC = VBS = 15V, ID = IDP, V DS=BVDSS, Reverse-bias Safe Oper- PN TJ = 150°C ating Area High- and low-side FRFET switching (Note 4) Full Square Control Part (Each HVIC Unless Otherwise Specified) Symbol IQCC Parameter Quiescent VCC Current Conditions Min Typ Max Units V CC=15V, V IN=0V Applied between VCC and COM - - 160 mA Applied between VB(U)-U, V B(V)-V, VB(W)-W - - 100 mA IQBS Quiescent VBS Current V BS=15V, V IN=0V UVCCD Low-side Undervoltage Protection (Figure 7) V CC Undervoltage Protection Detection Level 7.4 8.0 9.4 V UVCCR V CC Undervoltage Protection Reset Level 8.0 8.9 9.8 V High-side Undervoltage Protection (Figure 8) V BS Undervoltage Protection Detection Level 7.4 8.0 9.4 V V BS Undervoltage Protection Reset Level 8.0 8.9 9.8 V V IH ON Threshold Voltage Logic High Level 2.9 - - V V IL OFF Threshold Voltage Logic Low Level - - 0.8 V - 10 20 mA - - 2 mA UVBSD UVBSR IIH IIL Input Bias Current V IN = 5V V IN = 0V Applied between IN and COM Applied between IN and COM Bootstrap Diode Part Symbol VRRM Parameter Conditions Maixmum Repetitive Reverse Voltage IF Forward Current TC = 25°C IFP Forward Current (Peak) TC = 25°C, Under 1ms Pulse Width TJ Operating Junction Temperature Rating Units 500 V 0.5 A 2 A -40 ~ 150 °C Note: 1. For the measurement point of case temperature T C, please refer to Figure 4 in page 5. 2. BVDSS is the absolute maximum voltage rating between drain and source terminal of each FRFET inside SPM®. VPN should be sufficiently less than this value considering the effect of the stray inductance so that VDS should not exceed BVDSS in any case. 3. tON and tOFF include the propagation delay time of the internal drive IC. Listed values are measured at the laboratory test condition, and they can be different according to the field applcations due to the effect of different printed circuit boards and wirings. Please see Figure 5 for the switching time definition with the switching test circuit of Figure 6. 4. The peak current and voltage of each FRFET during the switching operation should be included in the safe operating area (SOA). Please see Figure 6 for the RBSOA test circuit that is same as the switching test circuit. FSB50250UTD Rev. A 3 www.fairchildsemi.com FSB50250UTD Smart Power Module (SPM®) Electrical Characteristics (TJ = 25°C, VCC=VBS=15V Unless Otherwise Specified) Symbol Parameter Conditions Min. Typ. Max. Units VF Forward Voltage IF = 0.1A, TC = 25°C - 2.0 - V trr Reverse Recovery Time IF = 0.1A, TC = 25°C - 80 - ns Built in Bootstrap Diode VF-IF Characteristic 1.0 0.9 0.8 0.7 IF [A] 0.6 0.5 0.4 0.3 0.2 0.1 0.0 TC=25℃ 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VF [V] Note: Built in bootstrap diode includes around 15 Ω resistance characteristic. Figure 2. Built in Bootstrap Diode Characteristics Package Marking & Ordering Information Device Marking FSB50250UTD FSB50250UTD Rev. A Device FSB50250UTD Package Reel Size Packing Type Quantity SPM23-ED _ _ 15 4 www.fairchildsemi.com FSB50250UTD Smart Power Module (SPM®) Bootstrap Diode Part Symbol Parameter Value Conditions Units Min. Typ. Max. - 300 400 V V PN Supply Voltage Applied between P and N VCC Control Supply Voltage Applied between V CC and COM 13.5 15 16.5 V VBS High-side Bias Voltage Applied between V B and output(U, V, W) 13.5 15 16.5 V 3.0 - V CC V 0 - 0.6 V 1.0 - - ms - 15 - kHz VIN(ON) Input ON Threshold Voltage VIN(OFF) Input OFF Threshold Voltage Applied between IN and COM tdead Blanking Time for Preventing VCC =VBS=13.5 ~ 16.5V, TJ £ 150°C Arm-short fPWM PWM Switching Frequency TJ £ 150°C These values depend on PWM control algorithm C1 15-V Line VDC P R5 Micom C5 VCC VB HIN HO LIN VS COM LO Inverter Output C3 N One-Leg Diagram of SPM C2 10mF R3 HIN LIN Output Note 0 0 Z Both FRFET Off 0 1 0 Low-side FRFET On 1 0 VDC High-side FRFET On 1 1 Forbidden Shoot-through Open Open Z Same as (0, 0) * Example of bootstrap paramters: C1 = C2 = 1mF ceramic capacitor, Note: (1) It is recommended the bootstrap diode D1 to have soft and fast recovery characteristics with 500-V rating (2) Parameters for bootsrap circuit elements are dependent on PWM algorithm. For 15 kHz of switching frequency, typical example of parameters is shown above. (3) RC coupling(R5 and C5) at each input (indicated as dotted lines) may be used to prevent improper input signal due to surge noise. Signal input of SPM®is compatible with standard CMOS or LSTTL outptus. (4) Bold lines should be short and thick in PCB pattern to have small stray inductance of circuit, which results in the reduction of surge voltage. Bypass capacitors such as C1, C2 and C3 should have good high-frequency characteristics to absorb high-frequency ripple current. Figure 3. Recommended CPU Interface and Bootstrap Circuit with Parameters 14.50mm 3.80mm Case Temperature(Tc) Detecting Point MOSFET Note: Attach the thermocouple on top of the heatsink-side of SPM® (between SPM® and heatsink if applied) to get the correct temperature measurement. Figure 4. Case Temperature Measurement FSB50250UTD Rev. A 5 www.fairchildsemi.com FSB50250UTD Smart Power Module (SPM®) Recommended Operating Conditions FSB50250UTD Smart Power Module (SPM®) VIN VIN Irr 120% of ID 100% of ID VDS ID 10% of ID ID VDS tON trr tOFF (b) Turn-off (a) Turn-on Figure 5. Switching Time Definition CBS VCC ID VCC VB HIN HO LIN VS COM LO L VDC + VDS - One-leg Diagram of SPM Figure 6. Switching and RBSOA(Single-pulse) Test Circuit (Low-side) Input Signal UV Protection Status Low-side Supply, VCC RESET DETECTION RESET UVCCR UVCCD MOSFET Current Figure 7. Undervoltage Protection (Low-side) Input Signal UV Protection Status High-side Supply, VBS RESET DETECTION RESET UVBSR UVBSD MOSFET Current Figure 8. Undervoltage Protection (High-side) FSB50250UTD Rev. A 6 www.fairchildsemi.com (1) COM (17) P (2) VB(U) (3) VCC(U) R5 (4) IN (UH) (5) IN (UL) C5 C2 (6) NC VCC VB HIN HO LIN VS COM LO (18) U,Vs(u) C3 (19) N U (7) VB(V) (8) VCC(V) Micom (9) IN (VH) (10) IN(VL) C2 (11) NC VDC VCC VB HIN HO LIN VS COM LO VCC VB HIN HO LIN VS COM LO (20) N V M (21) V,Vs(v) (12) VB(W) (13) VCC(W) (14) IN(WH) (15) IN(WL) C2 (16) NC (22) N W (23) W,Vs(w) For 3-phase current sensing and protection 15-V Supply C4 R4 R3 Figure 9. Example of Application Circuit FSB50250UTD Rev. A 7 www.fairchildsemi.com FSB50250UTD Smart Power Module (SPM®) C1 FSB50250UTD Smart Power Module (SPM®) Detailed Package Outline Drawings Max 1.00 0.60±0.10 (1.80) 15*1.778=26.67±0.30 (1.00) 13.34±0.30 #16 R0 .4 0 14.00 14.58±0.30 19.00 5° 3° #23 12.23±0.30 13.13±0.30 -0.05 #17 0 .4 R0 12.00±0.20 #1 19.58±0.30 13.34±0.30 0.5 0+0.10 (1.165) 3.10±0.20 29.00±0.20 6.20±0.20 2x3.90=7.80±0.30 (2.275) 1.95±0.30 (1.30) (1.80) 4x3.90=15.60±0.30 0.60±0.10 Max 1.00 FSB50250UTD Rev. A 8 www.fairchildsemi.com FSB50250UTD Smart Power Module (SPM®) Rev. I15 9 FSB50250UTD Rev. A www.fairchildsemi.com