1MBI1200U4C-170 IGBT Modules IGBT MODULE (U series) 1700V / 1200A / 1 in one package Features High speed switching Voltage drive Low Inductance module structure Applications Inverter for Motor Drive AC and DC Servo Drive Amplifier Uninterruptible Power Supply Industrial machines, such as Welding machines Maximum Ratings and Characteristics Absolute Maximum Ratings (at Tc=25°C unless otherwise specified) Items Collector-Emitter voltage Gate-Emitter voltage Collector current Symbols VCES VGES Conditions Ic Continuous Ic pulse 1ms Tc=25°C Tc=80°C Tc=25°C Tc=80°C -Ic -Ic pulse 1ms Collector power dissipation Pc 1 device Junction temperature Tj Storage temperature Tstg Isolation voltage Between terminal and copper base (*1) Viso AC : 1min. Mounting (*2) Screw torque Main Terminals (*2) Sense Terminals (*2) Maximum ratings 1700 ±20 1600 1200 3200 2400 1200 2400 7350 150 -40 to +125 3400 5.75 10 2.5 Units V V A W °C °C VAC N·m Note *1: All terminals should be connected together when isolation test will be done. Note *2: Recommendable value : Mounting : 4.25-5.75 N·m (M6), Main Terminal : 8-10 N·m (M8), Sense Terminal : 1.7-2.5 N·m (M4) Electrical characteristics (at Tj= 25°C unless otherwise specified) Items Symbols Conditions Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage ICES IGES VGE (th) VCE (sat) (main terminal) VCE (sat) (chip) Cies ton tr toff tf VF (main terminal) VF (chip) trr R lead VGE = 0V, VCE = 1700V VCE = 0V, VGE = ±20V VCE = 20V, IC = 1200mA Collector-Emitter saturation voltage Input capacitance Turn-on time Turn-off time Forward on voltage Reverse recovery time Lead resistance, terminal-chip (*3) Tj=25°C Tj=125°C Tj=25°C Tj=125°C = 0V, VCE = 10V, f = 1MHz VGE = 15V IC = 1200A VGE VCC = 900V, IC = 1200A VGE = ±15V, Tj = 125°C Rgon = 3.9Ω, Rgoff = 1.5Ω VGE = 0V IF = 1200A IF = 1200A Tj=25°C Tj=125°C Tj=25°C Tj=125°C Characteristics min. typ. max. 1.0 2400 5.5 6.5 7.5 2.43 2.61 2.83 2.25 2.40 2.65 112 1.80 0.85 1.30 0.35 1.98 2.36 2.18 1.80 2.15 2.00 0.35 0.146 - Units mA nA V V nF µs V µs mΩ Note *3: Biggest internal terminal resistance among arm. Thermal resistance characteristics Items Symbols Thermal resistance (1device) Rth(j-c) Contact thermal resistance (1device) Rth(c-f) Conditions IGBT FWD with Thermal Compound (*4) Note *4: This is the value which is defined mounting on the additional cooling fin with thermal compound. 1 Characteristics min. typ. max. 0.017 0.030 0.006 - Units °C/W 1MBI1200U4C-170 IGBT Modules Characteristics (Representative) Collector current vs. Collector-Emitter voltage (typ.) Tj= 125°C, chip Collector current vs. Collector-Emitter voltage (typ.) Tj=25°C ,chip 2800 2800 2000 10V 1200 800 400 2.0 3.0 4.0 1600 10V 1200 800 8V 400 8V 1.0 2000 0 0.0 5.0 Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) VGE=+15V,chip 2000 1600 1200 800 400 0 0 1 2 3 4 4 Ic=2400A Ic=1200A Ic=600A 2 0 5 Collector-Emitter voltage : VCE [V] Capacitance : Cies, Coes, Cres [ nF ] Cres Coes 1 20 15 20 Dynamic Gate charge (typ.) Tj= 25°C 1000 Cies 10 10 25 Gate - Emitter voltage : VGE [ V ] 1000 0 5.0 6 5 Capacitance vs. Collector-Emitter voltage (typ.) VGE=0V, f= 1MHz, Tj= 25°C 10 4.0 8 Collector-Emitter voltage : VCE [V] 100 3.0 10 Tj=125°C Collector - Emitter voltage : VCE [ V ] Collector current : Ic [A] 2400 2.0 Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) Tj=25°C ,chip 2800 Tj=25°C 1.0 Collector-Emitter voltage : VCE [V] Collector-Emitter voltage : VCE [V] VCE Collector-Emitter voltage : VCE [V] VGE 800 15 400 10 200 5 0 1000 2000 3000 Gate charge : Qg [ nC ] 2 20 600 0 30 25 4000 0 5000 Gate-Emitter voltage : VGE [V] 1600 0 0.0 12V 2400 Collector current : Ic [A] 2400 Collector current : Ic [A] VGE=20V15V VGE=20V 15V 12V 1MBI1200U4C-170 IGBT Modules Switching time vs. Gate resistance (typ.) 6.0 2.0 5.0 Switching time : ton, tr, toff, tf [ us ] Switching time : ton, tr, toff, tf [ us ] Switching time vs. Collector current (typ.) Vcc=900V, VGE=±15V, Rgon=3.9Ω, Rgoff=1.5Ω, Tj= 125°C 2.4 ton 2.2 1.8 1.6 1.4 toff tr 1.2 1.0 0.8 0.6 0.4 tf 0.2 Vcc=900V, Ic=1200A,VGE=±15V, Tj= 125°C ton 4.0 toff 3.0 tr 2.0 1.0 tf 0.0 0.0 0 400 800 1200 1600 0 2000 2 4 Collector current : Ic [ A ] Switching loss vs. Collector current (typ.) 18 Vcc=900V, Ic=1200A,VGE=±15V, Tj= 125°C 1400 700 Switching loss : Eon, Eoff, Err [ mJ/pulse ] 800 Switching loss : Eon, Eoff, Err [ mJ/pulse ] 16 Switching loss vs. Gate resistance (typ.) Vcc=900V, VGE=±15V, Rgon=3.9Ω, Rgoff=1.5Ω, Tj= 125°C Eoff 600 Eon 500 Err 400 300 200 100 0 Reverse bias safe operating area (max.) ± VGE=15V ,Tj = 125°C / chip 2800 2400 2000 1600 1200 800 400 0 0 400 800 1200 1600 Eon 1200 1000 800 Eoff 600 400 Err 200 0 0 0 400 800 1200 1600 2000 Collector current : Ic [ A ] , Forward current : IF [ A ] Collector current : Ic [ A ] 8 10 12 14 6 Gate resistance : Rg [ Ω ] 2000 Collector - Emitter voltage : VCE [ V ] 3 2 4 8 10 12 14 6 Gate resistance : Rg [ Ω ] 16 18 1MBI1200U4C-170 2000 1600 1200 800 400 0 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Irr FWD IGBT 0.0100 0.0010 0.010 0.100 1.000 Pulse width : Pw [ sec ] 4 1.4 1.2 1000 1.0 800 0.8 600 0.6 trr 400 200 0.4 0.2 400 800 1200 1600 Forward current : IF [ A ] Transient thermal resistance (max.) 1.6 1200 0 0.1000 Thermal resistanse : Rth(j-c) [ °C/W ] 1400 0 0.5 Forward on voltage : VF [ V ] 0.0001 0.001 Vcc=900V, VGE=±15V, Rgon=3.9Ω, Tj=125°C 0.0 2000 Reverse recovery time : trr [us] 1600 Tj=25°C Tj=125°C 2400 Forward current : IF [ A ] Reverse recovery characteristics (typ.) Forward current vs. Forward on voltage (typ.) chip Reverse recovery current : Irr [ A ] 2800 IGBT Modules 1MBI1200U4C-170 IGBT Modules Outline Drawings, mm Equivalent Circuit Schematic main collector sense collector C gate G sense emitter E C C E E main emitter 5 1MBI1200U4C-170 IGBT Modules WARNING 1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of October 2008. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sure to obtain the latest specifications. 2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Device Technology Co., Ltd. is (or shall be deemed) granted. Fuji Electric Device Technology Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3. Although Fuji Electric Device Technology Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. 4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements. • Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment • Machine tools • Audiovisual equipment • Electrical home appliances • Personal equipment • Industrial robots etc. 5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Device Technology Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. • Transportation equipment (mounted on cars and ships) • Trunk communications equipment • Traffic-signal control equipment • Gas leakage detectors with an auto-shut-off feature • Emergency equipment for responding to disasters and anti-burglary devices • Safety devices • Medical equipment 6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation). • Space equipment • Aeronautic equipment • Nuclear control equipment • Submarine repeater equipment 7. Copyright ©1996-2008 by Fuji Electric Device Technology Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Device Technology Co., Ltd. 8. If you have any question about any portion in this Catalog, ask Fuji Electric Device Technology Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Device Technology Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein. 6