FAIRCHILD 74LVTH16835MEA

Preliminary
Revised May 2000
74LVTH16835
Low Voltage 18-Bit Universal Bus Driver
with 3-STATE Outputs (Preliminary)
General Description
Features
The LVTH16835 consists of 18-bit universal bus drivers
which combine D-type latches and D-type flip-flops to allow
data flow in transparent, latched, or clocked modes. Data
flow from A to Y is controlled by the output-enable (OE)
input. This device operates in the transparent mode when
the latch-enable (LE) input is HIGH. The A data is latched if
the clock (CLK) input is held at a HIGH or LOW logic level.
If LE is LOW, the A-bus data is stored in the latch/flip-flop
on the LOW-to-HIGH transition of the CLK. When OE is
HIGH, the outputs are in the high-impedance state.
■ Input and output interface capability to systems at
5V VCC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink −32 mA/+64 mA
■ Latch-up performance exceeds 500 mA
The LVTH16835 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
The bus driver is designed for low voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to
a 5V environment. The LVTH16835 is fabricated with an
advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation.
Ordering Code:
Order Number
Package Number
74LVTH16835MEA
MS56A
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Description
74LVTH16835MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
© 2000 Fairchild Semiconductor Corporation
DS500102
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74LVTH16835 Low Voltage 18-Bit Universal Bus Driver
May 2000
74LVTH16835
Preliminary
Connection Diagram
Pin Descriptions
Pin Names
Description
A1–A18
Data Register Inputs
Y1–Y18
3-STATE Outputs
CLK
Clock Pulse Input
OE
Output Enable Input
LE
Latch Enable Input
Truth Table
Inputs
OE
LE
CLK
A
Output
Y
Z
H
X
X
X
L
H
X
L
L
L
H
X
H
H
L
L
↑
L
L
L
L
↑
H
H
L
L
H
X
Y0 (Note 1)
L
L
L
X
Y0 (Note 2)
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
↑ = HIGH-to-LOW Clock Transition
Note 1: Output level before the indicated steady-state input conditions
were established, provided that CLK was HIGH before LE went LOW.
Note 2: Output level before the indicated steady-state input conditions
were established.
Logic Diagram
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2
Preliminary
Symbol
Parameter
Value
Conditions
Units
VCC
Supply Voltage
−0.5 to +4.6
VI
DC Input Voltage
−0.5 to +7.0
VO
DC Output Voltage
−0.5 to +7.0
Output in 3-STATE
V
−0.5 to +7.0
Output in HIGH or LOW State (Note 4)
V
V
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
IO
DC Output Current
64
VO > VCC
Output at HIGH State
128
VO > VCC
Output at LOW State
mA
ICC
DC Supply Current per Supply Pin
±64
mA
IGND
DC Ground Current per Ground Pin
±128
mA
TSTG
Storage Temperature
−65 to +150
°C
Recommended Operating Conditions
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
IOH
HIGH-Level Output Current
IOL
LOW-Level Output Current
TA
Free-Air Operating Temperature
∆t/∆V
Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V
Min
Max
Units
2.7
3.6
V
0
5.5
V
−32
mA
64
mA
−40
85
°C
0
10
ns/V
Note 3: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
Note 4: IO Absolute Maximum Rating must be observed.
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74LVTH16835
Absolute Maximum Ratings(Note 3)
74LVTH16835
Preliminary
DC Electrical Characteristics
Symbol
VIK
Input Clamp Diode Voltage
T A = −40°C to +85°C
VCC
Parameter
(V)
Min
Max
Units
−1.2
2.7
V
VO ≤ 0.1V or
VIH
Input HIGH Voltage
2.7–3.6
VIL
Input LOW Voltage
2.7–3.6
VOH
Output HIGH Voltage
2.7–3.6
VCC − 0.2
V
IOH = −100 µA
2.7
2.4
V
IOH = −8 mA
3.0
2.0
V
IOH = −32 mA
VOL
II(HOLD)
II(OD)
II
Output LOW Voltage
Bushold Input Minimum Drive
2.0
Conditions
II = −18 mA
V
0.8
VO ≥ VCC − 0.1V
2.7
0.2
V
IOL = 100 µA
2.7
0.5
V
IOL = 24 mA
3.0
0.4
V
IOL = 16 mA
3.0
0.5
V
IOL = 32 mA
3.0
0.55
V
IOL = 64 mA
75
µA
VI = 0.8V
−75
µA
VI = 2.0V
500
µA
(Note 5)
−500
µA
(Note 6)
3.0
Bushold Input Over-Drive
Current to Change State
3.0
Input Current
3.6
10
µA
VI = 5.5V
Control Pins
3.6
±1
µA
VI = 0V or VCC
Data Pins
3.6
−5
µA
VI = 0V
1
µA
VI = VCC
±100
µA
IOFF
Power Off Leakage Current
IPU/PD
Power up/down 3-STATE
0
0V ≤ VI or VO ≤ 5.5V
VO = 0.5V to 3.0V
0–1.5V
±100
µA
IOZL
3-STATE Output Leakage Current
3.6
−5
µA
VO = 0.5V
IOZH
3-STATE Output Leakage Current
3.6
5
µA
VO = 3.0V
IOZH+
3-STATE Output Leakage Current
3.6
10
µA
VCC < VO ≤ 5.5V
ICCH
Power Supply Current
3.6
0.19
mA
Outputs HIGH
ICCL
Power Supply Current
3.6
5
mA
Outputs LOW
ICCZ
Power Supply Current
3.6
0.19
mA
Outputs Disabled
ICCZ+
Power Supply Current
3.6
0.19
mA
VCC ≤ VO ≤ 5.5V,
∆ICC
Increase in Power Supply Current
3.6
0.2
mA
One Input at VCC − 0.6V
Output Current
VI = GND or VCC
Outputs Disabled
(Note 7)
Other Inputs at VCC or GND
Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics
Symbol
Parameter
(Note 8)
TA = 25°C
VCC
(V)
Min
Typ
Conditions
Max
Units
CL = 50 pF, RL = 500Ω
VOLP
Quiet Output Maximum Dynamic VOL
3.3
0.8
V
(Note 9)
VOLV
Quiet Output Minimum Dynamic VOL
3.3
−0.8
V
(Note 9)
Note 8: Characterized in SSOP package. Guaranteed parameter, but not tested.
Note 9: Max number of outputs defined as (n). n−1 data inputs are driven 0V to 3V. Output under test held LOW.
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4
Preliminary
TA = −40°C to +85°C, CL = 50 pF, RL = 500 Ω
Symbol
VCC = 3.3 ± 0.3V
Parameter
Min
fMAX
Max
150
VCC = 2.7V
Min
150
MHz
tPLH
Propagation Delay
1.3
3.7
1.3
4.0
tPHL
A to Y
1.3
3.7
1.3
4.0
tPLH
Propagation Delay
1.5
5.1
1.5
5.7
tPHL
LE to Y
1.5
5.1
1.5
5.7
tPLH
Propagation Delay
1.5
5.1
1.5
5.7
tPHL
CLK to Y
1.5
5.1
1.5
5.7
tPZH
Output Enable Time
1.3
4.6
1.3
5.5
1.3
4.6
1.3
5.5
1.7
5.8
1.7
6.3
1.7
5.8
1.7
6.3
tPZL
tPHZ
Output Disable Time
tPLZ
tS
tH
tW
Setup Time
A before CLK
2.1
A before LE, CLK HIGH
2.3
1.5
A before LE, CLK LOW
1.5
0.5
Hold Time
ns
ns
ns
ns
ns
2.4
A after CLK
1.0
0.0
A after LE
0.8
0.8
LE HIGH
3.3
3.3
CLK HIGH or LOW
3.3
3.3
Pulse Duration
Units
Max
ns
ns
ns
tOSLH
Output to Output Skew
1.0
1.0
tOSHL
(Note 10)
1.0
1.0
ns
Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Capacitance (Note 11)
Typical
Units
CIN
Symbol
Input Capacitance
Parameter
VCC = 0V, VI = 0V or VCC
Conditions
4
pF
COUT
Output Capacitance
VCC = 3.0V, VO = 0V or VCC
8
pF
Note 11: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
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74LVTH16835
AC Electrical Characteristics
74LVTH16835
Preliminary
Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Number MS56A
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6
Preliminary
74LVTH16835 Low Voltage 18-Bit Universal Bus Driver
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD56
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
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to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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7
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