INTEGRATED CIRCUITS DATA SHEET TEA0676T Dual pre-amplifier and equalizer for reverse tape decks Product specification Supersedes data of 1996 Jun 20 File under Integrated Circuits, IC01 1997 Oct 07 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T FEATURES GENERAL DESCRIPTION • Dual head pre-amplifiers The TEA0676T is a monolithic bipolar integrated circuit intended for applications in car radios. It includes head and equalization amplifiers with electronically switchable time constants. Furthermore it includes electronically switchable inputs for tape drivers with reverse heads. • Reverse head switching • Equalization with electronically switched time constants • Output level like Dolby level of 387.5 mV = 0 dB • Improved EMC behaviour. The device will operate with power supplies in a range of 7.6 to 12.0 V. The output overload level increases with the increase in supply voltage, so it is advisable to use a regulated power supply or a supply with a long time constant. QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage ICC supply current S+N -------------N Vo (rms) CONDITIONS MIN. TYP. MAX. UNIT 7.6 10 12 V VCC = 10 V − 10 13 mA signal plus noise-to-noise ratio unweighted RMS value 67 73 − dB output voltage (0 dB) (RMS value) gain internal = 40 dB; linear − 387.5 − mV ORDERING INFORMATION TYPE NUMBER TEA0676T 1997 Oct 07 PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 7.5 mm 2 VERSION SOT162-1 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T BLOCK DIAGRAM 10 µF 180 Ω handbook, full pagewidth 330 kΩ equalizer switch 70 µs 1 kΩ 470 pF 120 µs IN1 head switch IN2 10 nF 8.2 kΩ 18 kΩ 470 pF 10 µF 27 kΩ 10 µF OUTB 16 EQSW 15 EQINB 13 EQOUTB 14 GND 12 INB1 11 EQ AMPLIFIER HSW INB2 10 9 PREAMPLIFIER POWER SUPPLY LOGIC TEA0676T EQ AMPLIFIER 1 OUTA 10 µF 2 n.c. PREAMPLIFIER 3 4 5 6 7 8 EQOUTA EQINA VCC INA1 Vref INA2 10 nF 8.2 kΩ 100 µF 10 V 330 kΩ 470 pF 1 kΩ 470 pF 10 µF 180 Ω MGE862 Fig.1 Block and application diagram. 1997 Oct 07 3 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T PINNING SYMBOL PIN DESCRIPTION OUTA 1 output channel A n.c. 2 not connected EQOUTA 3 output equalizer channel A EQINA 4 input equalizer channel A VCC 5 supply voltage INA1 6 input channel A1 (forward or reverse) Vref 7 reference voltage INA2 8 input channel A2 (reverse or forward) INB2 9 input channel B2 (reverse or forward) HSW 10 input head switch INB1 11 input channel B1 (forward or reverse) GND 12 ground EQINB 13 input equalizer channel B EQOUTB 14 output equalizer channel B EQSW 15 input equalizer switch OUTB 16 output channel B handbook, halfpage 1 16 OUTB n.c. 2 15 EQSW EQOUTA 3 14 EQOUTB EQINA 4 13 EQINB TEA0676T VCC 5 12 GND INA1 6 11 INB1 Vref 7 10 HSW INA2 8 9 INB2 MGE861 Fig.2 Pin configuration. INB2 are active) or connected to HIGH level (0.8VCC) (inputs INA1, INB1 are active). FUNCTIONAL DESCRIPTION Gain of pre-amplifier = 30 dB; minimum gain of EQ-amplifier = 24.5 dB at f = 1 kHz with 70 µs cut-off frequency. Equalization time constant switching (70 µs/120 µs) is achieved when pin 15 (EQSW) is connected to ground via an 18 kΩ resistor (120 µs) or left open-circuit (70 µs). Head switching is achieved when pin 10 (HSW) is connected to ground via a 27 kΩ resistor (inputs INA2, 1997 Oct 07 OUTA 4 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage 0 14 V ∆V(12-x) voltage at pins 1 to 11, 13 to 16 with respect to pin 12 0 VCC V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature Ves electrostatic handling voltage −40 +85 °C note 1 −2000 +2000 V note 2 −500 +500 V Notes 1. Human body model: C = 100 pF; R = 1.5 kΩ. 2. Machine model: C = 200 pF; R = 0 Ω. THERMAL CHARACTERISTICS SYMBOL Rth j-a 1997 Oct 07 PARAMETER thermal resistance from junction to ambient in free air 5 VALUE UNIT 70 K/W Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T CHARACTERISTICS VCC = 10 V; RL = 10 kΩ; CL = 2.5 nF; Tamb = 25 °C; Vo = 0 dB means 387.5 mV at output; all levels are referenced to 387.5 mV with 0 dB as standard; EQ switch in 70 µs position; unless otherwise specified; see notes 1 and 2. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VCC supply voltage (pin 5) 7.6 10.0 12.0 V ICC supply current − 10 13 mA THD total harmonic distortion − 0.08 0.15 % f = 10 kHz; Vo = 6 dB − 0.15 0.3 % HR headroom at output VCC = 7.6 V; THD = 1%; f = 1 kHz 12 − − dB PSRR power supply ripple rejection VR(rms) < 0.25 V; f = 1 kHz − 50 − dB αcs channel separation selective measurement; f = 1 kHz; Vo = 10 dB 57 63 − dB αm channel matching selective measurement; f = 1 kHz; Vo = 0 dB −0.5 − +0.5 dB αct crosstalk between active and inactive input selective measurement; f = 1 kHz; Vo = 10 dB 70 77 − dB S+N -------------N signal plus noise-to-noise ratio (RMS value) unweighted; f = 20 Hz to 20 kHz; Rs = 0 Ω; internal gain 40 dB; linear; see Fig.13 67 73 − dB Vno(rms) equivalent input noise voltage (RMS value) unweighted; f = 20 Hz to 20 kHz; Rs = 0 Ω − 0.8 − µV Gv voltage gain of pre-amplifier from pin INA1 or INA2 to pin EQINA and from pin INB1 or INB2 to pin EQINB 29 30 31 dB Av open-loop amplification pin INA1 to pin OUTA and pin INB1 to pin OUTB f = 10 kHz 80 86 − dB f = 400 Hz f = 1 kHz; Vo = 0 dB 104 110 − dB REQ equalization resistor 4.7 5.8 6.9 kΩ ZI input impedance pre-amplifier 60 100 − kΩ ZO output impedance EQ-amplifier − 80 100 Ω RL output load resistance 10 − − kΩ CL output load capacitance 0 − 10 nF Voffset(DC) input offset voltage pins INA1, INA2, INB1 and INB2 connected to Vref − 2 − mV IO(GND) DC current capability output to ground −2 − − mA IO(VCC) DC current capability output to VCC 300 − − µA EMC DC offset voltage at pins 1 and 16 f = 900 MHz; Vi = 6 V (RMS); see Figs 12, 14 and 15 − 50 − mV 1997 Oct 07 6 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks SYMBOL PARAMETER TEA0676T CONDITIONS MIN. TYP. MAX. UNIT Switching thresholds EQUALIZATION TIME CONSTANT SWITCHING VEQSW pin voltage load current +100 to −100 µA − 0.8VCC − V IEQSW input current VEQSW = 0 to VCC −180 − +180 µA VEQSW(HIGH) pin voltage time constant 70 µs active 1⁄ VCC V VEQSW(LOW) pin voltage time constant 120 µs active 0 − 1⁄ 2VCC − 0.5 V 2VCC + 0.5 − HEAD SWITCHING VHSW pin voltage load current +90 to −90 µA − 0.8VCC − V IHSW input current VHSW = 0 to VCC −170 − +170 µA VCC V VHSW(HIGH) HIGH-level pin voltage inputs INA1 and INB1 active 1⁄ VHSW(LOW) LOW-level pin voltage inputs INA2 and INB2 active 0 2VCC + 0.5 − − 1⁄ 2VCC − 0.5 V Notes 1. For an application with a fixed equalization time constant of 120 µs the equalizing network may be applied completely external. In this application the 8.2 kΩ resistor has to be changed to 14 kΩ and the internal resistor REQ = 5.8 kΩ must be short-circuited by fixing the equalization switch input at 70 µs (pin 15 left open-circuit). To activate the inputs INA1 and INB1, pin 10 (HSW) might be left open-circuit. In this event the DC level at pin 10 (HSW) is 0.8VCC 2. It is recommended to switch off VCC with a gradient of 400 V/s at maximum to avoid plops on the tape in the event of contact between tape and tape head while switching off. 1997 Oct 07 7 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T INTERNAL PIN CONFIGURATIONS handbook, halfpage 1 + handbook, halfpage 3 + 5V 5V 80 Ω 80 Ω 100 Ω 100 Ω 5.8 kΩ MGE863 MGE864 Fig.3 Pins 1 and 16: output channel. handbook, halfpage Fig.4 Pins 3 and 14: equalizer outputs. 4 + handbook, halfpage 5 10 kΩ 1 pF MGE866 MGE865 Fig.5 Pins 4 and 13: equalizer inputs. 1997 Oct 07 Fig.6 Pin 5: supply voltage. 8 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks handbook, halfpage TEA0676T 6 5V + handbook, halfpage + 2.5 kΩ 7 5V 2.5 kΩ 220 Ω 100 kΩ 12 pF MGE868 5V MGE867 Fig.7 Pins 6, 8, 9, 11: input channel. handbook, halfpage Fig.8 Pin 7: reference voltage. 10 handbook, halfpage 8V 8V + + MGE870 MGE869 Fig.9 Pin 10: input head switch. 1997 Oct 07 15 Fig.10 Pin 15: input equalizer switch. 9 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T TEST AND APPLICATION INFORMATION 10 kΩ 10 µF 180 Ω handbook, full pagewidth equalizer switch 70 µs 330 kΩ 1 kΩ 200 Ω 120 µs 10 µF 10 nF 8.2 kΩ 470 pF head switch IN1 IN2 18 kΩ 470 pF 10 µF 10 µF 27 kΩ 200 Ω 10 µF OUTB 16 EQSW 15 EQINB 13 EQOUTB 14 GND 12 INB1 11 EQ AMPLIFIER HSW INB2 10 9 PREAMPLIFIER POWER SUPPLY LOGIC TEA0676T EQ AMPLIFIER 1 OUTA 10 µF 2 n.c. PREAMPLIFIER 3 4 5 6 7 8 EQOUTA EQINA VCC INA1 Vref INA2 200 Ω 10 nF 8.2 kΩ 10 V 200 Ω 10 kΩ 330 kΩ 1 kΩ 180 Ω 100 µF 10 µF 470 pF 10 µF 470 pF 10 µF MGE871 Fig.11 Test circuit. 1997 Oct 07 10 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T handbook, full pagewidth 470 pF 200 Ω 10 kΩ IN1 head switch 200 Ω IN2 10 µF 20 kΩ 470 pF 27 kΩ 10 µF OUTB 16 EQSW 15 EQINB 13 EQOUTB 14 GND 12 INB1 11 EQ AMPLIFIER HSW INB2 10 9 PREAMPLIFIER POWER SUPPLY LOGIC TEA0676T EQ AMPLIFIER 1 OUTA 10 µF 2 n.c. PREAMPLIFIER 3 4 5 6 7 8 EQOUTA EQINA VCC INA1 Vref INA2 20 kΩ 100 µF 10 V 10 kΩ 200 Ω 470 pF 200 Ω 470 pF 10 Ω 40 Ω f = 900 MHz Vi = 6 V (RMS) MGE872 Fig.12 EMC test diagram. 1997 Oct 07 11 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T handbook, full pagewidth equalizer switch 70 µs head switch 10 kΩ 120 µs IN1 IN2 20 kΩ 18 kΩ 10 µF 27 kΩ 10 µF OUTB 16 EQSW 15 EQINB 13 EQOUTB 14 GND 12 INB1 11 EQ AMPLIFIER HSW INB2 10 9 PREAMPLIFIER POWER SUPPLY LOGIC TEA0676T EQ AMPLIFIER 1 OUTA 10 µF 2 n.c. PREAMPLIFIER 3 4 5 6 7 8 EQOUTA EQINA VCC INA1 Vref INA2 20 kΩ 10 V 100 µF 10 kΩ MGE873 Fig.13 Noise test diagram. 1997 Oct 07 12 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T LAYOUT OF PRINTED CIRCUIT BOARD FOR EMC TEST CIRCUIT 54 handbook, full pagewidth 50 200 Ω 470 pF 27 kΩ 200 Ω 470 pF 10 kΩ 20 kΩ 40 Ω 0Ω 100 nF 0Ω 100 nF TEA0676T 10 Ω 0Ω 0Ω 20 kΩ 10 kΩ 470 pF 200 Ω 470 pF 200 Ω MBH457 Fig.14 Top side with components. 1997 Oct 07 13 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T handbook, full pagewidth 54 50 10 µF X2 10 µF S1 MP 100 µF X3 100 µF X4 MP HFDR. MP 10 µF X1 MBH458 Fig.15 Bottom side with components. 1997 Oct 07 14 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1997 Oct 07 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 15 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1997 Oct 07 16 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Oct 07 17 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T NOTES 1997 Oct 07 18 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0676T NOTES 1997 Oct 07 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547027/1200/02/pp20 Date of release: 1997 Oct 07 Document order number: 9397 750 02743