SMF05C, SMF12C, SMF15C, SMF24C 5−Line Transient Voltage Suppressor Array This 5−line voltage transient suppressor array is designed for application requiring transient voltage protection capability. It is intended for use in over−transient voltage and ESD sensitive equipment such as computers, printers, automotive electronics, networking communication and other applications. This device features a monolithic common anode design which protects five independent lines in a single SC−88 package. http://onsemi.com SC−88 FIVE TRANSIENT VOLTAGE SUPPRESSOR 100 W PEAK POWER MARKING DIAGRAM Features • Protects up to 5−Line in a Single SC−88 Package • Peak Power Dissipation − 100 W (8 x 20 s Waveform) • ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model • • • SC−88 CASE 419B STYLE 24 1 and Class C (Exceeding 400 V) per Machine Model. Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8 kV (Contact) Flammability Rating of UL 94 V−0 Pb−Free Package is Available 6J 6K 6L 6M M Applications • • • • • Hand−Held Portable Applications Networking and Telecom Automotive Electronics Serial and Parallel Ports Notebooks, Desktops, Servers = SMF05C = SMF12C = SMF15C = SMF24C = Date Code PIN ASSIGNMENT 1 6 2 5 3 4 PIN 1. CATHODE 2. ANODE 3 CATHODE 4. CATHODE 5. CATHODE 6. CATHODE MAXIMUM RATINGS (TJ=25°C unless otherwise specified) Symbol PPK 1 TJ Rating Value Unit Peak Power Dissipation 8 x 20 s Double Exponential Waveform (Note 1) 100 W Operating Junction Temperature Range −40 to 125 °C Storage Temperature Range ORDERING INFORMATION Package Shipping† SMF05CT1 SC−88 3000/Tape & Reel SC−88 3000/Tape & Reel SC−88 (Pb−Free) 3000/Tape & Reel SMF12CT1 SC−88 3000/Tape & Reel SMF15CT1 SC−88 3000/Tape & Reel SMF24CT1 SC−88 3000/Tape & Reel Device −55 to 150 °C SMF05CT2* TL Lead Solder Temperature (10 s) 260 °C SMF05CT2G* ESD Human Body Model (HBM) Machine Model (MM) IEC 61000−4−2 Air (ESD) IEC 61000−4−2 Contact (ESD) 16000 400 15000 15000 V TSTG Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Nonrepetitive current pulse per Figure 3. Semiconductor Components Industries, LLC, 2004 June, 2004 − Rev. 1 DEVM 1 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *The “T2” suffix refers to an alternate tape & reel orientation. Publication Order Number: SMF05C/D SMF05C, SMF12C, SMF15C, SMF24C SMF05C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol VRWM VBR Conditions Min Typ (Note 2) IT = 1 mA, (Note 3) 6.2 0.07 Max Unit 5.0 V 7.2 V 5.0 A Reverse Leakage Current IR VRWM = 5 V Clamping Voltage VC IPP = 5 A (8 x 20 s Waveform) 9.8 V Clamping Voltage VC IPP = 8 A (8 x 20 s Waveform) 12.5 V Maximum Peak Pulse Current IPP 8 x 20 s Waveform 8.0 A Capacitance CJ VR = 0 V, f = 1 MHz (Line to GND) 80 130 pF Typ Max Unit 12 V SMF12C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol VRWM VBR Conditions Min (Note 2) IT = 1 mA, (Note 3) 15 V 1.0 A IPP = 3 A (8 x 20 s Waveform) 21 V VC IPP = 6 A (8 x 20 s Waveform) 23 V Maximum Peak Pulse Current IPP 8 x 20 s Waveform 6.0 A Capacitance CJ VR = 0 V, f = 1 MHz (Line to GND) 40 60 pF Typ Max Unit 15 V 19 V 1.0 A Reverse Leakage Current IR VRWM = 12 V Clamping Voltage VC Clamping Voltage 13.3 0.01 SMF15C ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol VRWM VBR Conditions Min (Note 2) IT = 1 mA, (Note 3) 17 Reverse Leakage Current IR VRWM = 15 V 0.01 Clamping Voltage VC IPP = 1 A (8 x 20 s Waveform) 23 V Clamping Voltage VC IPP = 5 A (8 x 20 s Waveform) 29 V Maximum Peak Pulse Current IPP 8 x 20 s Waveform Capacitance CJ VR = 0 V, f = 1 MHz (Line to GND) 5.0 A 33 45 pF Typ Max Unit 24 V 32 V SMF24C ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol VRWM VBR Conditions Min (Note 2) IT = 1 mA, (Note 3) 26.7 Reverse Leakage Current IR VRWM = 24 V 1.0 A Clamping Voltage VC IPP = 1 A (8 x 20 s Waveform) 40 V Clamping Voltage VC IPP = 2.5 A (8 x 20 s Waveform) 44 V Maximum Peak Pulse Current IPP 8 x 20 s Waveform 2.5 A Capacitance CJ VR = 0 V, f = 1 MHz (Line to GND) 25 pF 0.01 21 2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage level. 3. VBR is measured at pulse test current IT. http://onsemi.com 2 SMF05C, SMF12C, SMF15C, SMF24C TYPICAL PERFORMANCE CURVES 100 100 90 90 % OF PEAK PULSE CURRENT PEAK POWER DISSIPATION (%) (TJ = 25°C unless otherwise specified) 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 s 80 70 60 HALF VALUE IRSM/2 @ 20 s 50 40 30 tP 20 10 0 200 PEAK VALUE IRSM @ 8 s tr 0 20 TA, AMBIENT TEMPERATURE (°C) 100 100 SMF24C JUNCTION CAPACITANCE (pF) VCLAMP, CLAMPING VOLTAGE (V) 80 60 Figure 2. 8 × 20 s Pulse Waveform Figure 1. Pulse Derating Curve SMF15C SMF12C SMF05C 10 1 40 t, TIME (s) 0 5 10 SMF05C SMF12C SMF15C 1 15 SMF24C 10 0 IPP, PEAK PULSE CURRENT (A) 5 10 15 20 25 VBR, REVERSE VOLTAGE (V) Figure 3. Clamping Voltage vs Peak Pulse Current Figure 4. Junction Capacitance vs Reverse Voltage http://onsemi.com 3 SMF05C, SMF12C, SMF15C, SMF24C PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE 02U A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. G 6 5 4 1 2 3 DIM A B C D G H J K N S −B− S D 6 PL 0.2 (0.008) M B INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 STYLE 24: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE M N J C H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. SMF05C/D