ONSEMI BUH150G

BUH150G
SWITCHMODEt NPN
Silicon Planar Power
Transistor
The BUH150G has an application specific state−of−art die designed
for use in 150 Watts Halogen electronic transformers.
This power transistor is specifically designed to sustain the large
inrush current during either the startup conditions or under a short
circuit across the load.
Features
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POWER TRANSISTOR
15 AMPERES
700 VOLTS, 150 WATTS
• Improved Efficiency Due to the Low Base Drive Requirements:
•
•
•
High and Flat DC Current Gain hFE
Fast Switching
Robustness Thanks to the Technology Developed to Manufacture
this Device
ON Semiconductor Six Sigma Philosophy Provides Tight and
Reproducible Parametric Distributions
These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Sustaining Voltage
VCEO
400
Vdc
Collector−Base Breakdown Voltage
VCBO
700
Vdc
Collector−Emitter Breakdown Voltage
VCES
700
Vdc
Emitter−Base Voltage
VEBO
10
Vdc
TO−220AB
CASE 221A−09
STYLE 1
1
2
3
Collector Current
− Continuous
− Peak (Note 1)
IC
ICM
15
25
Adc
Base Current
− Continuous
− Peak (Note 1)
IB
IBM
6
12
Adc
PD
150
1.2
W
W/_C
BUH150G
TJ, Tstg
−65 to 150
_C
AY WW
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
RqJC
0.85
_C/W
Thermal Resistance, Junction−to−Ambient
RqJA
62.5
_C/W
Maximum Lead Temperature for Soldering
Purposes 1/8″ from Case for 5 Seconds
TL
260
_C
Total Device Dissipation @ TC = 25_C
Derate above 25°C
Operating and Storage Temperature
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Characteristics
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 5
1
BUH150
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
BUH150G
TO−220
(Pb−Free)
50 Units / Rail
Publication Order Number:
BUH150/D
BUH150G
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector−Emitter Sustaining Voltage
(IC = 100 mA, L = 25 mH)
VCEO(sus)
400
460
Vdc
Collector−Base Breakdown Voltage
(ICBO = 1 mA)
VCBO
700
860
Vdc
Emitter−Base Breakdown Voltage
(IEBO = 1 mA)
VEBO
10
12.3
Vdc
Collector Cutoff Current
(VCE = Rated VCEO, IB = 0)
ICEO
100
mAdc
OFF CHARACTERISTICS
Collector Cutoff Current
(VCE = Rated VCES, VEB = 0)
@ TC = 25°C
@ TC = 125°C
ICES
100
1000
mAdc
Collector Base Current
(VCB = Rated VCBO, VEB = 0)
@ TC = 25°C
@ TC = 125°C
ICBO
100
1000
mAdc
IEBO
100
mAdc
Emitter−Cutoff Current
(VEB = 9 Vdc, IC = 0)
ON CHARACTERISTICS
Base−Emitter Saturation Voltage
(IC = 10 Adc, IB = 2 Adc)
Collector−Emitter Saturation Voltage
(IC = 2 Adc, IB = 0.4 Adc)
@ TC = 25°C
@ TC = 125°C
VBE(sat)
1
1.25
Vdc
VCE(sat)
0.16
0.15
0.4
0.4
Vdc
(IC = 10 Adc, IB = 2 Adc)
@ TC = 25°C
0.45
1
Vdc
(IC = 20 Adc, IB = 4 Adc)
@ TC = 25°C
2
5
Vdc
DC Current Gain (IC = 20 Adc, VCE = 5 Vdc)
@ TC = 25°C
@ TC = 125°C
hFE
4
2.5
7
4.5
−
(IC = 10 Adc, VCE = 5 Vdc)
@ TC = 25°C
@ TC = 125°C
8
6
12
10
−
(IC = 2 Adc, VCE = 1 Vdc)
@ TC = 25°C
@ TC = 125°C
12
14
20
22
−
(IC = 100 mAdc, VCE = 5 Vdc)
@ TC = 25°C
10
20
−
DYNAMIC SATURATION VOLTAGE
VCE(dsat)
IC = 5 Adc, IB1 = 1 Adc
VCC = 300 V
@ TC = 25°C
1.5
V
@ TC = 125°C
2.8
V
IC = 10 Adc, IB1 = 2 Adc
VCC = 300 V
@ TC = 25°C
2.4
V
@ TC = 125°C
5
V
fT
23
MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1 MHz)
Cob
100
150
pF
Input Capacitance
(VEB = 8 Vdc, f = 1 MHz)
Cib
1300
1750
pF
Dynamic Saturation
Voltage:
Determined 3 ms after
rising IB1 reaches 90% of
final IB1 (see Figure 19)
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth
(IC = 1 Adc, VCE = 10 Vdc, f = 1 MHz)
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2
BUH150G
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
SWITCHING CHARACTERISTICS: Resistive Load (D.C. ≤ 10%, Pulse Width = 40 ms)
Turn−on Time
Storage Time
Fall Time
IC = 2 Adc, IB1 = 0.2 Adc
IB2 = 0.2 Adc
VCC = 300 Vdc
@ TC = 25°C
ton
200
300
ns
@ TC = 25°C
ts
5.3
6.5
ms
@ TC = 25°C
tf
240
350
ns
Turn−off Time
@ TC = 25°C
toff
5.6
7
ms
Turn−on Time
@ TC = 25°C
ton
100
200
ns
@ TC = 25°C
ts
6.1
7.5
ms
@ TC = 25°C
tf
320
500
ns
@ TC = 25°C
toff
6.5
8
ms
@ TC = 25°C
@ TC = 125°C
ton
450
800
650
ns
@ TC = 25°C
@ TC = 125°C
toff
2.5
3.9
3
ms
@ TC = 25°C
@ TC = 125°C
ton
500
900
700
ns
@ TC = 25°C
@ TC = 125°C
toff
2.25
2.75
2.75
ms
Storage Time
Fall Time
IC = 2 Adc, IB1 = 0.4 Adc
IB2 = 0.4 Adc
VCC = 300 Vdc
Turn−off Time
Turn−on Time
Turn−off Time
Turn−on Time
Turn−off Time
IC = 5 Adc, IB1 = 0.5 Adc
IB2 = 0.5 Adc
VCC = 300 Vdc
IC = 10 Adc, IB1 = 2 Adc
IB2 = 2 Adc
VCC = 300 Vdc
SWITCHING CHARACTERISTICS: Inductive Load (Vclamp = 300 V, VCC = 15 V, L = 200 mH)
Fall Time
@ TC = 25°C
@ TC = 125°C
tfi
110
160
250
ns
@ TC = 25°C
@ TC = 125°C
tsi
6.5
8
8
ms
Crossover Time
@ TC = 25°C
@ TC = 125°C
tc
235
240
350
ns
Fall Time
@ TC = 25°C
@ TC = 125°C
tfi
110
170
250
ns
@ TC = 25°C
@ TC = 125°C
tsi
6
7.8
7.5
ms
Crossover Time
@ TC = 25°C
@ TC = 125°C
tc
250
270
350
ns
Fall Time
@ TC = 25°C
@ TC = 125°C
tfi
110
140
150
ns
@ TC = 25°C
@ TC = 125°C
tsi
3.25
4.6
3.75
ms
Crossover Time
@ TC = 25°C
@ TC = 125°C
tc
275
450
350
ns
Fall Time
@ TC = 25°C
@ TC = 125°C
tfi
110
160
175
ns
@ TC = 25°C
@ TC = 125°C
tsi
2.3
2.8
2.75
ms
@ TC = 25°C
@ TC = 125°C
tc
250
475
350
ns
Storage Time
Storage Time
Storage Time
Storage Time
Crossover Time
IC = 2 Adc
IB1 = 0.2 Adc
IB2 = 0.2 Adc
IC = 2 Adc
IB1 = 0.4 Adc
IB2 = 0.4 Adc
IC = 5 Adc
IB1 = 0.5 Adc
IB2 = 0.5 Adc
IC = 10 Adc
IB1 = 2 Adc
IB2 = 2 Adc
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3
BUH150G
TYPICAL STATIC CHARACTERISTICS
100
100
VCE = 3 V
TJ = 125°C
TJ = -20°C
10
1
0.001
0.01
hFE, DC CURRENT GAIN
hFE, DC CURRENT GAIN
VCE = 1 V
TJ = 25°C
TJ = -20°C
10
1
0.001
100
0.1
1
10
IC, COLLECTOR CURRENT (AMPS)
TJ = 125°C
Figure 1. DC Current Gain @ 1 Volt
100
10
VCE = 5 V
IC/IB = 5
TJ = 125°C
TJ = 125°C
TJ = -20°C
10
1
0.01
VCE , VOLTAGE (VOLTS)
hFE, DC CURRENT GAIN
0.1
1
10
0.01
IC, COLLECTOR CURRENT (AMPS)
Figure 2. DC Current Gain @ 3 Volt
100
TJ = 25°C
10
0.1
1
IC, COLLECTOR CURRENT (AMPS)
1
TJ = 25°C
TJ = -20°C
0.1
0.01
0.001
100
Figure 3. DC Current Gain @ 5 Volt
0.01
0.1
1
10
IC, COLLECTOR CURRENT (AMPS)
100
Figure 4. Collector−Emitter Saturation Voltage
10
1.5
IC/IB = 5
VBE , VOLTAGE (VOLTS)
IC/IB = 10
VCE , VOLTAGE (VOLTS)
TJ = 25°C
1
TJ = 125°C
0.1
1
TJ = -20°C
0.5
TJ = 25°C
TJ = 125°C
TJ = 25°C
0.01
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (AMPS)
0
0.001
100
Figure 5. Collector−Emitter Saturation Voltage
0.01
0.1
1
10
IC, COLLECTOR CURRENT (AMPS)
Figure 6. Base−Emitter Saturation Region
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100
BUH150G
TYPICAL STATIC CHARACTERISTICS
1.5
2
TJ = 25°C
VCE , VOLTAGE (VOLTS)
VBE , VOLTAGE (VOLTS)
IC/IB = 10
1
TJ = -20°C
TJ = 25°C
0.5
TJ = 125°C
1.5
1
20 A
15 A
VCE(sat)
(IC = 1 A)
0.5
5A
0
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (AMPS)
0
0.01
100
Figure 7. Base−Emitter Saturation Region
1
IB, BASE CURRENT (A)
10
100
Figure 8. Collector Saturation Region
10000
900
Cib (pF)
TJ = 25°C
TJ = 25°C
f(test) = 1 MHz
1000
Cob (pF)
100
BVCER @ 10 mA
800
BVCER (VOLTS)
C, CAPACITANCE (pF)
0.1
8A
10 A
700
BVCER(sus) @ 200 mA
600
500
400
10
1
10
VR, REVERSE VOLTAGE (VOLTS)
100
10
Figure 9. Capacitance
100
RBE (W)
Figure 10. Resistive Breakdown
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5
1000
BUH150G
TYPICAL SWITCHING CHARACTERISTICS
12
2000
1800
IB1 = IB2
VCC = 300 V
PW = 40 ms
1600
IC/IB = 10
10
25°C
8
125°C
1200
1000
t, TIME (s)
μ
t, TIME (ns)
1400
125°C
800
TJ = 25°C
TJ = 125°C
IC/IB = 5
6
4
600
400
2
25°C
200
IC/IB = 10
IC/IB = 5
0
0
0
3
6
9
12
IC, COLLECTOR CURRENT (AMPS)
0
15
Figure 11. Resistive Switching, ton
15
8
6
IB1 = IB2
VCC = 15 V
VZ = 300 V
LC = 200 mH
IC/IB = 10
7
6
t, TIME (s)
μ
IC/IB = 5
7
t, TIME (s)
μ
10
5
IC, COLLECTOR CURRENT (AMPS)
Figure 12. Resistive Switch Time, toff
8
5
4
3
IB1 = IB2
VCC = 15 V
VZ = 300 V
LC = 200 mH
5
4
3
2
2
TJ = 125°C
TJ = 25°C
1
TJ = 125°C
TJ = 25°C
1
0
0
1
3
7
9
11
5
IC, COLLECTOR CURRENT (AMPS)
13
15
7
4
IC, COLLECTOR CURRENT (AMPS)
1
Figure 13. Inductive Storage Time, tsi
10
Figure 13 Bis. Inductive Storage Time, tsi
550
800
IB1 = IB2
VCC = 15 V
VZ = 300 V
LC = 200 mH
450
TJ = 125°C
TJ = 25°C
IB1 = IB2
VCC = 15 V
VZ = 300 V
LC = 200 mH
700
600
tc
350
250
t, TIME (ns)
t, TIME (ns)
IB1 = IB2
VCC = 300 V
PW = 20 ms
tfi
TC = 125°C
TC = 25°C
500
tc
400
300
tfi
200
150
100
50
0
1
3
9
11
7
5
IC, COLLECTOR CURRENT (AMPS)
13
15
0
Figure 14. Inductive Storage Time,
tc & tfi @ IC/IB = 5
2
6
4
8
IC, COLLECTOR CURRENT (AMPS)
Figure 15. Inductive Storage Time,
tc & tfi @ IC/IB = 10
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6
10
BUH150G
TYPICAL SWITCHING CHARACTERISTICS
5
200
IC = 5 A
t fi , FALL TIME (ns)
150
3
2
IB1 = IB2
VCC = 15 V
VZ = 300 V
LC = 200 mH
1
IC = 10 A
TJ = 125°C
TJ = 25°C
0
2
100
IC = 5 A
50
4
6
hFE, FORCED GAIN
8
IBoff = IB2
VCC = 15 V
VZ = 300 V
LC = 200 mH
IC = 10 A
0
10
4
3
Figure 16. Inductive Storage Time
5
6
7
hFE, FORCED GAIN
IB1 = IB2
VCC = 15 V
VZ = 300 V
LC = 200 mH
700
600
TJ = 125°C
TJ = 25°C
IC = 10 A
500
400
IC = 5 A
300
200
100
3
4
8
Figure 17. Inductive Fall Time
800
t c , CROSSOVER TIME (ns)
tsi , STORAGE TIME (μs)
4
TJ = 125°C
TJ = 25°C
5
6
7
hFE, FORCED GAIN
8
9
Figure 18. Inductive Crossover Time
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7
10
9
10
BUH150G
TYPICAL SWITCHING CHARACTERISTICS
10
VCE
IC
9
90% IC
8
dyn 1 ms
7
dyn 3 ms
tfi
tsi
6
0V
Vclamp
5
10% IC
10% Vclamp
tc
4
90% IB
3
1 ms
2
IB
IB
90% IB1
1
2
1
3 ms
0
0
3
TIME
Figure 19. Dynamic Saturation Voltage
Measurements
4
TIME
5
6
7
8
Figure 20. Inductive Switching Measurements
Table 1. Inductive Load Switching Drive Circuit
+15 V
IC PEAK
1 mF
150 W
3W
100 W
3W
100 mF
MTP8P10
VCE PEAK
VCE
MTP8P10
RB1
MPF930
IB1
MUR105
MPF930
+10 V
IB
Iout
A
COMMON
IB2
50
W
RB2
MJE210
500 mF
150 W
3W
MTP12N10
1 mF
-Voff
V(BR)CEO(sus)
L = 10 mH
RB2 = ∞
VCC = 20 Volts
IC(pk) = 100 mA
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Inductive Switching
L = 200 mH
RB2 = 0
VCC = 15 Volts
RB1 selected for
desired IB1
RBSOA
L = 500 mH
RB2 = 0
VCC = 15 Volts
RB1 selected for
desired IB1
BUH150G
TYPICAL THERMAL RESPONSE
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC −VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate. The data of Figure 22 is
based on TC = 25°C; TJ(pk) is variable depending on power
level. Second breakdown pulse limits are valid for duty cycles
to 10% but must be derated when TC > 25°C. Second
breakdown limitations do not derate the same as thermal
limitations. Allowable current at the voltages shown on
Figure 22 may be found at any case temperature by using the
appropriate curve on Figure 21.
TJ(pk) may be calculated from the data in Figure 24. At any
case temperatures, thermal limitations will reduce the power
that can be handled to values less than the limitations imposed
by second breakdown. For inductive loads, high voltage and
current must be sustained simultaneously during turn−off
with the base to emitter junction reverse biased. The safe level
is specified as a reverse biased safe operating area
(Figure 23). This rating is verified under clamped conditions
so that the device is never subjected to an avalanche mode.
POWER DERATING FACTOR
1
SECOND BREAKDOWN
DERATING
0.8
0.6
THERMAL DERATING
0.4
0.2
0
40
20
60
80
120
100
TC, CASE TEMPERATURE (°C)
140
160
Figure 21. Forward Bias Power Derating
16
10
5 ms
IC, COLLECTOR CURRENT (AMPS)
1 ms
10 ms
1 ms
EXTENDED SOA
IC, COLLECTOR CURRENT (AMPS)
100
DC
1
0.1
0.01
1
10
100
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
10
8
6
-5 V
4
0V
2
0
300
1000
TC ≤ 125°C
LC = 4 mH
12
Figure 22. Forward Bias Safe Operating Area
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
GAIN ≥ 5
14
-1.5 V
400
500
600
700
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
800
Figure 23. Reverse Bias Safe Operating Area
1
0.5
0.2
0.1
P(pk)
0.1
0.05
t1
0.02
t2
DUTY CYCLE, D = t1/t2
SINGLE PULSE
0.01
0.01
0.1
1
RqJC(t) = r(t) RqJC
RqJC = 0.83°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) RqJC(t)
10
t, TIME (ms)
Figure 24. Typical Thermal Response (ZqJC(t)) for BUH150
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9
100
1000
BUH150G
PACKAGE DIMENSIONS
TO−220AB
CASE 221A−09
ISSUE AF
−T−
B
F
T
SEATING
PLANE
C
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.161
0.095
0.105
0.110
0.155
0.014
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
4.09
2.42
2.66
2.80
3.93
0.36
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
BASE
COLLECTOR
EMITTER
COLLECTOR
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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BUH150/D