ONSEMI MBRA210LT3_05

MBRA210LT3
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes. Typical applications are
AC−DC and DC−DC converters, reverse battery protection, and
“Oring” of multiple supply voltages and any other application where
performance and size are critical.
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SCHOTTKY BARRIER
RECTIFIER
2 AMPERES
10 VOLTS
Features
•
•
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•
•
•
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Ultra Low VF
1st in the Market Place with a 10 VR Schottky Rectifier
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Over−Voltage Protection
Optimized for Low Forward Voltage
Pb−Free Package is Available
SMA
CASE 403D
PLASTIC
Mechanical Characteristics:
•
•
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Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 70 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Ratings: Machine Model = C
Human Body Model = 3A
MARKING DIAGRAM
B2L1
AYWW
G
B2L1
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
MBRA210LT3
MBRA210LT3G
Package
Shipping †
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
September, 2005 − Rev. 4
1
Publication Order Number:
MBRA210LT3/D
MBRA210LT3
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
10
V
Average Rectified Forward Current
(At Rated VR, TL = 110°C)
IO
2.0
A
IFSM
160
A
Tstg, TC
TJ
−55 to +125
°C
dv/dt
10,000
V/ms
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
Thermal Resistance, Junction−to−Ambient
Symbol
Min Pad
1 Inch Pad
Unit
RqJL
RqJA
22
150
15
81
°C/W
VF
TJ = 25°C
TJ = 100°C
V
0.260
0.325
0.350
0.15
0.23
0.26
TJ = 25°C
TJ = 100°C
0.25
0.70
40
60
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 0.1 A)
(IF = 1.0 A)
(IF = 2.0 A)
Maximum Instantaneous Reverse Current
IR
(VR = 5.0 V)
(VR = 10 V)
mA
1. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
100
VF @ 125°C
25°C
10
100°C
75°C
1
IF, MAXIMUM INSTANTANEOUS
FORWARD CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
100
0.1
VF @ 125°C
25°C
10
100°C
75°C
1
0.1
0.05 0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.05
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.15
0.25
0.35
0.45
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
0.55
MBRA210LT3
IR, REVERSE CURRENT (AMPS)
1.0E−01
IR @ 125°C
100°C
1.0E−02
75°C
1.0E−03
1.0E−04
25°C
1.0E−05
0
2
4
6
8
10
VR, REVERSE VOLTAGE (VOLTS)
3.5
RATED VOLTAGE
APPLIED
RqJL = 22 °C/W
TJ = 125°C
3
2.5
SQUARE WAVE
2
1.5
1
0.5
0
90
95
100
105
110
115
120
125
130
TL, LEAD TEMPERATURE (°C)
0.9
0.8
TJ = 125°C
dc
0.7
0.6
SQUARE WAVE
0.5
0.4
0.3
0.2
0.1
0
0
0.5
1
1.5
25°C
f = 1 MHz
1000
100
1
2
3
4
2.5
3
Figure 5. Forward Power Dissipation
10,000
0
2
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Current Derating − Junction to Lead
C, CAPACITANCE (pF)
IF, AVERAGE FORWARD
CURRENT (AMPS)
dc
PFO, AVERAGE POWER DISSIPATION (WATTS)
Figure 3. Typical Reverse Current
5
6
7
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Capacitance
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3
9
10
3.5
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
MBRA210LT3
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
100
1000
t, TIME (S)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 7. Thermal Response, Junction to Ambient (min pad)
100
D = 0.5
0.2
10
0.1
0.05
1
0.1
0.02
0.01
SINGLE PULSE
0.00001
0.0001
0.001
0.01
0.1
1
10
t, TIME (S)
Figure 8. Thermal Response, Junction to Ambient (1 inch pad)
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4
MBRA210LT3
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
HE
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.91
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.16
2.41
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.075
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.085
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.095
0.006
0.064
0.016
0.115
0.180
0.220
0.060
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
L
c
A1
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MBRA210LT3/D