ONSEMI SS12T3

SS12, SS14
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
These devices employ the Schottky Barrier principle in a large area
metal−to−silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity diodes in surface mount applications
where compact size and weight are critical to the system.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
20, 40 VOLTS
Features
•
•
•
•
•
Small Compact Surface Mountable Package with J−Bent Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Stress Protection
Pb−Free Packages are Available
Mechanical Characteristics
•
•
•
•
•
•
•
•
•
SMA
CASE 403D
PLASTIC
Case: Epoxy, Molded
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 70 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped in 12 mm tape, 5000 units per 13 inch reel
Polarity: Cathode Lead Indicated by Polarity Band
Device Meets MSL 1 Requirements
ESD Ratings: Human Body Model, 3B (> 8000 V)
Machine Model, B (> 200 V)
MARKING DIAGRAM
SS1x
AYWWG
SS1x
x
A
Y
WW
G
= Specific Device Code
= 2 or 4
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
SS12T3
SS12T3G
SS14T3
SS14T3G
Package
Shipping †
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 3
1
Publication Order Number:
SS12/D
SS12, SS14
MAXIMUM RATINGS
Rating
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Value
VRRM
VRWM
VR
SS12
SS14
Average Rectified Forward Current
(At Rated VR, TC = 120°C)
Unit
V
20
40
IO
1.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 120°C)
IFRM
2.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
60
A
Tstg, TC
−55 to +150
°C
TJ
−55 to +150
°C
dv/dt
10,000
V/ms
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
°C/W
Thermal Resistance,
Junction−to−Lead (Note 1)
Thermal Resistance,
Junction−to−Ambient (Note 1)
RqJL
35
RqJA
86
VF
TJ = 25°C
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
see Figure 2for other Values
(IF = 1.0 A)
IR
Maximum Instantaneous Reverse Current
see Figure 4 for other Values
V
0.47
TJ = 25°C
TJ = 100°C
0.045
0.1
2.0
5.0
(VR = 20 V)
(VR = 40 V)
mA
1. Mounted on 2 in Square PC Board with 1 in Square Total Pad Size, PC Board FR4.
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
10
IF, INSTANTANEOUS FORWARD
CURRENT (A)
IF, INSTANTANEOUS FORWARD
CURRENT (A)
10
TJ = 100°C
1
TJ = 25°C
TJ = 150°C
TJ = −55°C
0.1
0.10
0.30
0.50
0.70
0.90
TJ = 100°C
1
TJ = 25°C
TJ = 150°C
TJ = −55°C
0.1
0.10
0.30
0.50
0.70
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, MAXIMUM FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
http://onsemi.com
2
0.90
SS12, SS14
IR, MAXIMUM REVERSE CURRENT (A)
100E−3
IR, REVERSE CURRENT (A)
100E−3
10E−3
TJ = 150°C
1E−3
TJ = 100°C
TJ = 150°C
10E−3
TJ = 100°C
1E−3
100E−6
100E−6
10E−6
TJ = 25°C
1E−6
0
10
20
30
VR, INSTANTANEOUS FORWARD VOLTAGE (V)
40
TJ = 25°C
10E−6
1E−6
0
Figure 3. Typical Reverse Current
40
Figure 4. Maximum Reverse Current
1.8
0.25
freq = 20 kHz
dc
1.6
PFO, AVERAGE POWER DISSIPATION (W)
IO, AVERAGE FORWARD CURRENT
(A)
10
20
30
VR, REVERSE VOLTAGE (V)
1.4
1.2
Square Wave
1
Ipk/IO = 5
0.6
Ipk/IO = 10
0.4
Ipk/IO = 20
0.2
Ipk/IO = 5
Ipk/IO = p
Ipk/IO = 20
0.15
Ipk/IO = p
0.8
Ipk/IO = 10
0.1
Square Wave
dc
0.05
0.2
0
0
25
45
65
85
105
125
145
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
1000
1.8
1000
C, CAPACITANCE (pF)
r(t), TRANSIENT THERMAL
RESISTANCE
TJ = 100°C
D = 0.10
D = 0.50
D = 0.20
100
100
P(pk)
10
D = 0.05
1
Single Pulse
10
0
5
10
15
20
25
30
35
40
0.1
0.00001 0.0001 0.001 0.01
45
t1
D = 0.01
Test Type > Min Pad
Theta JC = min pad 1 oz C/W
0.1
1.0
10
VR, REVERSE VOLTAGE (V)
t, TIME (sec)
Figure 7. Capacitance
Figure 8. Thermal Response
http://onsemi.com
3
t2
Duty Cycle, D = t1/t2
100
1000
SS12, SS14
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE C
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.91
0.05
1.27
0.15
2.29
4.06
4.83
0.76
c
MIN
0.075
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.085
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.095
0.006
0.064
0.016
0.115
0.180
0.220
0.060
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
L
MILLIMETERS
NOM
MAX
2.16
2.41
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
A1
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
http://onsemi.com
4
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
SS12/D