ONSEMI MBRF20L60CTG

MBR20L60CT
MBRF20L60CT
SWITCHMODE]
Power Rectifier
60 V, 20 A
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Features and Benefits
•
•
•
•
•
SCHOTTKY BARRIER
RECTIFIER
20 AMPERES
60 VOLTS
Low Power Loss/High Efficiency
High Surge Capacity
20 A Total (10 A Per Diode Leg)
Guard−Ring for Stress Protection
These are Pb−Free Devices
1
Applications
2, 4
• Power Supply − Output Rectification
• Power Management
• Instrumentation
3
MARKING
DIAGRAM
4
Mechanical Characteristics:
•
•
•
•
•
•
Case: Epoxy, Molded
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 1.9 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped 50 Units Per Plastic Tube
TO−220AB
CASE 221A
PLASTIC
1
2
AYWW
B20L60G
AKA
3
MAXIMUM RATINGS
TO−220 FULLPAK]
CASE 221D
STYLE 3
Please See the Table on the Following Page
1
2
AYWW
B20L60G
AKA
3
A
Y
WW
B20L60
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
= Polarity Designator
ORDERING INFORMATION
Device
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
December, 2008 − Rev. 0
1
Package
Shipping
MBR20L60CTG
TO−220AB
(Pb−Free)
50 Units / Rail
MBRF20L60CTG
TO−220FP
(Pb−Free)
50 Units / Rail
Publication Order Number:
MBR20L60CT/D
MBR20L60CT MBRF20L60CT
MAXIMUM RATINGS (Per Diode Leg)
Symbol
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Value
VRRM
VRWM
VR
Average Rectified Forward Current
MBR20L60CT (Rated VR) TC = 138°C
MBRF20L60CT (Rated VR) TC = 123°C
Per Diode
Per Device
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
60
IF(AV)
Unit
V
A
10
20
IFSM
240
A
Operating Junction Temperature (Note 1)
TJ
−55 to +150
°C
Storage Temperature
Tstg
*65 to +175
°C
> 400
> 8000
V
ESD Ratings:
Machine Model = C
Human Body Model = 3B
THERMAL CHARACTERISTICS
Maximum Thermal Resistance
MBR20L60CT
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Case
− Junction−to−Ambient
MBRF20L60CT
°C/W
2.3
70
5.2
75
RqJC
RqJA
RqJC
RqJA
ELECTRICAL CHARACTERISTICS (Per Diode Leg)
Rating
Symbol
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 10 A, TC = 25°C)
(IF = 10 A, TC = 125°C)
(IF = 20 A, TC = 25°C)
(IF = 20 A, TC = 125°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TC = 25°C)
(Rated DC Voltage, TC = 125°C)
iR
Typ
Max
0.53
0.49
0.68
0.64
0.57
0.54
0.73
0.69
118
52
380
96
Unit
V
mA
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
MBR20L60CT MBRF20L60CT
IF, AVERAGE FORWARD CURRENT
(A)
100
10
125°C
150°C
85°C
1
TJ = 25°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
85°C
150°C
1
TJ = 25°C
0.1
0
0.8
1
1.2
1.4
1.6
1.8
1.0E+00
150°C
150°C
1.0E−01
125°C
125°C
1.0E−02
1.0E−03
85°C
1.0E−03
1.0E−04
1.0E−04
TJ = 25°C
1.0E−05
TJ = 25°C
1.0E−05
0
10
20
30
40
VR, REVERSE VOLTAGE (V)
50
60
1.0E−06
0
Figure 3. Typical Reverse Current
10
20
30
40
50
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
60
Figure 4. Maximum Reverse Current
6
dc
IF, AVERAGE FORWARD CURRENT
(A)
20
IF, AVERAGE FORWARD CURRENT
(A)
0.6
Figure 2. Maximum Forward Voltage
85°C
RqJC = 2.3°C/W
14
12
10
0.4
Figure 1. Typical Forward Voltage
1.0E−02
16
0.2
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.0E−01
18
125°C
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.0E+00
1.0E−06
10
IR, INSTANTANEOUS REVERSE CURRENT (A)
0.1
IR, INSTANTANEOUS REVERSE CURRENT (A)
IF, AVERAGE FORWARD CURRENT
(A)
100
SQUARE WAVE
8
6
4
2
0
110 115 120 125 130 135 140 145 150 155 160
RqJA = 70°C/W
5
dc
4
3
SQUARE WAVE
2
1
0
0
20
40
60
80
100
120
140 160
TC, CASE TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Current Derating, Case per Leg
MBR20L60CT
Figure 6. Current Derating, Ambient per Leg
MBR20L60CT
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3
MBR20L60CT MBRF20L60CT
6
18
RqJC = 5.2°C/W
dc
16
IF, AVERAGE FORWARD CURRENT
(A)
IF, AVERAGE FORWARD CURRENT
(A)
20
14
12
10
SQUARE WAVE
8
6
4
2
0
80
90
100 110
120 130 140
TC, CASE TEMPERATURE (°C)
150
RqJA = 75°C/W
5
4
dc
3
2
SQUARE WAVE
1
0
160
0
40
60
80
100 120 140
TA, AMBIENT TEMPERATURE (°C)
160
Figure 8. Current Derating, Ambient per Leg
MBRF20L60CT
10000
18
TJ = 150°C
16
TJ = 25°C
14
C, CAPACITANCE (pF)
PFO, AVERAGE POWER DISSIPATION (W)
Figure 7. Current Derating, Case per Leg
MBRF20L60CT
20
SQUARE WAVE
12
10
8
dc
6
4
1000
100
2
0
0
2
4
6
8
10
12
14
16
18
10
20
0
10
20
30
40
50
IO, AVERAGE FORWARD CURRENT (A)
VR, REVERSE VOLTAGE (V)
Figure 9. Forward Power Dissipation
Figure 10. Capacitance
60
R(t), TRANSIENT THERMAL RESISTANCE
10
1
D=
0.5
0.2
0.1
0.05
0.1
P(pk)
t1
0.01
t2
SINGLE PULSE
0.01
0.000001
0.00001
0.0001
DUTY CYCLE, D = t1/t2
0.001
0.01
0.1
t1, TIME (sec)
1
10
Figure 11. Thermal Response Junction−to−Case, per Leg for MBR20L60CT
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4
100
1000
R(t), TRANSIENT THERMAL RESISTANCE
MBR20L60CT MBRF20L60CT
100
10
0.1
D=
0.5 0.2
0.05
0.02
1
0.01
0.1
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 12. Thermal Response Junction−to−Ambient, per Leg for MBR20L60CT
10
1
D=
0.5
0.2
0.1
0.05
0.02
0.1
0.01
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 13. Thermal Response Junction−to−Case, per Leg for MBRF20L60CT
100
D=
0.5
0.2
0.1
10
1
0.05
0.02
0.01
0.1
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 14. Thermal Response Junction−to−Ambient, per Leg for MBRF20L60CT
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5
100
1000
MBR20L60CT MBRF20L60CT
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AF
−T−
B
F
T
SEATING
PLANE
C
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.161
0.095
0.105
0.110
0.155
0.014
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
STYLE 6:
PIN 1.
2.
3.
4.
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6
ANODE
CATHODE
ANODE
CATHODE
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
4.09
2.42
2.66
2.80
3.93
0.36
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
MBR20L60CT MBRF20L60CT
PACKAGE DIMENSIONS
TO−220 FULLPAK
CASE 221D−03
ISSUE J
−T−
−B−
F
SEATING
PLANE
C
S
Q
U
A
1 2 3
H
−Y−
K
G
N
L
D
J
R
3 PL
0.25 (0.010)
M
B
M
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
INCHES
MIN
MAX
0.617
0.635
0.392
0.419
0.177
0.193
0.024
0.039
0.116
0.129
0.100 BSC
0.118
0.135
0.018
0.025
0.503
0.541
0.048
0.058
0.200 BSC
0.122
0.138
0.099
0.117
0.092
0.113
0.239
0.271
MILLIMETERS
MIN
MAX
15.67
16.12
9.96
10.63
4.50
4.90
0.60
1.00
2.95
3.28
2.54 BSC
3.00
3.43
0.45
0.63
12.78
13.73
1.23
1.47
5.08 BSC
3.10
3.50
2.51
2.96
2.34
2.87
6.06
6.88
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
FULLPAK and SWITCHMODE are trademarks of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
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MBR20L60CT/D