ONSEMI NL17SZ06

NL17SZ06
Single Inverter with Open
Drain Outputs
The NL17SZ06 is a high performance single inverter with open
drain outputs operating from a 1.65 to 5.5 V supply.
The Output stage is open drain with Over Voltage Tolerance. This
allows the NL17SZ06 to be used to interface 5.0 V circuits to circuits
of any voltage between 0 and +7.0 V.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
•
Tiny SOT−353 and SOT−553 Packages
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation, CMOS Compatible
Over Voltage Tolerant Inputs VIN may be Between 0 and 7.0 V for
VCC Between 0.5 and 5.4 V
TTL Compatible − Interface Capability with 5.0 V TTL Logic with
VCC = 2.7 V to 3.6 V
LVCMOS Compatible
24 mA Output Sink Capability, Pullup may be between 0 and 7.0 V
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 20
Pb−Free Packages are Available
5
5
LFd
1
SOT−353/SC70−5/SC−88A
DF SUFFIX
CASE 419A
1
d = Date Code
5
5
LF D
1
SOT−553
XV5 SUFFIX
CASE 463B
LF
D
1
= Device Marking
= One Digit Date Code
PIN ASSIGNMENT
NC
1
5
VCC
OVT
IN A
2
GND
3
4
1
Function
1
NC
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
OUT Y
Figure 1. Pinout (Top View)
IN A
Pin
A Input
Y Output
L
Z
H
L
ORDERING INFORMATION
OUT Y
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
 Semiconductor Components Industries, LLC, 2005
January, 2005 − Rev. 3
1
Publication Order Number:
NL17SZ06/D
NL17SZ06
MAXIMUM RATINGS
Symbol
VCC
Characteristics
Value
Unit
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
V
−0.5 ≤ VO ≤ 7.0
V
VI < GND
−50
mA
VO < GND
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
−50
mA
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SOT−353
SOT−553
186
135
mW
JA
Thermal Resistance
SOT−353
SOT−553
350
496
°C/W
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
±500
mA
ILatch−Up
Output in Z or LOW State (Note 1)
Latchup Performance
MSL
Moisture Sensitivity
FR
Flammability Rating
ESD
ESD Classification
Above VCC and Below GND at 85°C (Note 5)
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
Class IC
Class A
N/A
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
t/V
Input Transition Rise or Fall Rate
Operating
Data Retention Only
(Z or LOW State)
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
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2
Min
Max
Unit
1.65
1.5
5.5
5.5
V
0
5.5
V
0
5.5
V
−40
+85
°C
0
0
0
20
10
5
ns/V
NL17SZ06
DC ELECTRICAL CHARACTERISTICS
Min
0.75 VCC
0.7 VCC
Typ
Max
Min
Max
Symbol
Parameter
VIH
High−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
VIL
Low−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.25 VCC
0.3 VCC
0.25 VCC
0.3 VCC
V
ILKG
Z−State Output
Leakage Current
VIN = VIL
VOUT = VCC or GND
2.3 to 5.5
5.0
10.0
A
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 A
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 4 mA
1.65
0.08
0.24
0.24
IIN
IOFF
Condition
−40°C ≤ TA ≤ 85°C
TA = 25°C
VCC
(V)
Input Leakage Current
0.75 VCC
0.7 VCC
Unit
V
IOL = 8 mA
2.3
0.22
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
VIN or VOUT = VCC or GND
0 to 5.5
0.1
1.0
A
VOUT = 5.5 V
0
1.0
10
A
Power Off−Output
Leakage Current
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ICC
Quiescent Supply Current
VIN = VCC or GND
5.5
1.0
10
A
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 −40°C ≤ TA ≤ 85°C
TA = 25°C
Symbol
tPZL
tPLZ
Parameter
Propagation Delay
(Fi
(Figure
3 and
d 4)
Propagation Delay
(Fi
(Figure
3 and
d 4)
Condition
RL = R1= 500 CL = 50 pF
RL = R1= 500 CL = 50 pF
VCC (V)
Min
Typ
Max
Min
Max
Unit
ns
1.65
0.8
5.3
11.6
0.8
12.0
2.5 0.2
0.8
3.0
3.6
0.8
4.1
3.3 0.3
0.8
2.4
3.2
0.8
3.7
5.0 0.5
0.5
2.4
3.0
0.5
3.5
1.65
0.8
5.3
11.6
0.8
12.0
2.5 0.2
0.8
2.5
3.6
0.8
4.1
3.3 0.3
0.8
2.1
3.2
0.8
3.7
5.0 0.5
0.5
1.2
3.0
0.5
3.5
ns
CAPACITIVE CHARACTERISTICS
Symbol
Condition
Typical
Unit
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
CPD
Power Dissipation Capacitance (Note 6)
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
CIN
Parameter
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL17SZ06
VCC
A
50%
GND
tPZL
tPLZ
HIGH
IMPEDANCE
50% VCC
Y
VOL +0.3 V
Figure 3. Switching Waveforms
VCC
R1
PULSE
GENERATOR
VCC x 2
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 )
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Logic
Circuit
Indicator
No. of
Gates
per
Package
Temp
Range
Identifier
NL17SZ06DFT2
NL
1
NL17SZ06DFT2G
NL
NL17SZ06XV5T2
NL
Device
Order Number
Technology
Device
Function
Package
Suffix
Tape &
Reel
Suffix
7
SZ
06
DF
1
7
SZ
06
1
7
SZ
06
Package
Type
Tape and
Reel Size†
T2
SOT−353/
SC70−5/
SC−88A
178 mm (7”)
3000 Unit
DF
T2
SOT−353/
SC70−5/
SC−88A
(Pb−Free)
178 mm (7”)
3000 Unit
XV5
T2
SOT−553*
178 mm (7”)
4000 Unit
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*All Devices in Package SOT553 are Inherently Pb−Free.
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4
NL17SZ06
PACKAGE DIMENSIONS
SOT−353
DF SUFFIX
5−LEAD PACKAGE
CASE 419A−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZ06
PACKAGE DIMENSIONS
SOT−553
XV5 SUFFIX
5−LEAD PACKAGE
CASE 463B−01
ISSUE A
A
−X−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
C
K
4
1
2
B
−Y−
3
D
G
S
DIM
A
B
C
D
G
J
K
S
J
5 PL
0.08 (0.003)
M
X Y
MILLIMETERS
MIN
MAX
1.50
1.70
1.10
1.30
0.50
0.60
0.17
0.27
0.50 BSC
0.08
0.18
0.10
0.30
1.50
1.70
STYLE 1:
PIN 1.
2.
3.
4.
5.
INCHES
MIN
MAX
0.059
0.067
0.043
0.051
0.020
0.024
0.007
0.011
0.020 BSC
0.003
0.007
0.004
0.012
0.059
0.067
BASE 1
EMITTER 1/2
BASE 2
COLLECTOR 2
COLLECTOR 1
STYLE 2:
PIN 1.
2.
3.
4.
5.
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
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Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
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Phone: 81−3−5773−3850
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For additional information, please contact your
local Sales Representative.
NL17SZ06/D