NL27WZ06 Dual Inverter with Open Drain Outputs The NL27WZ06 is a high performance dual inverter with open drain outputs operating from a 1.65 V to 5.5 V supply. The internal circuit is composed of multiple stages, including an open drain output which provides the capability to set output switching level. This allows the NL27WZ06 to be used to interface 5.0 V circuits to circuits of any voltage between VCC and 7.0 V using an external resistor and power supply. • • • • • • • • • Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Output Sink Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72; Equivalent Gate = 18 Pb−Free Package is Available http://onsemi.com MARKING DIAGRAMS MFd 1 SC−88 DF SUFFIX CASE 419B Pin 1 d = Date Code MFd 1 TSOP−6 DT SUFFIX CASE 318G IN A1 1 6 Pin 1 d = Date Code OUT Y1 PIN ASSIGNMENT GND IN A2 2 5 4 3 VCC 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 OUT Y2 FUNCTION TABLE Figure 1. Pinout (Top View) A Input L H IN A1 1 OUT Y1 IN A2 1 OUT Y2 Y Output Z L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Figure 2. Logic Symbol Semiconductor Components Industries, LLC, 2004 May, 2004 − Rev. 4 1 Publication Order Number: NL27WZ06/D NL27WZ06 MAXIMUM RATINGS Symbol Characteristics Value Unit −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V −0.5 ≤ VO ≤ 7.0 V VI < GND −50 mA VO < GND VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air SC−88, TSOP−6 200 mW JA Thermal resistance SC−88, TSOP−6 333 °C/W TL Lead temperature, 1 mm from case for 10 s 260 °C TJ Junction temperature under bias +150 °C VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) ±500 mA Output in Z or LOW State (Note 1) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A 3. Tested to EIA/JESD22−A115−A 4. Tested to JESD22−C101−A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature t/V Input Transition Rise or Fall Rate Operating Data Retention Only (Z or LOW State) VCC = 2.5 V ±0.2 V VCC =3.0 V ±0.3 V VCC =5.0 V ±0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V −55 +125 °C 0 0 0 20 10 5 ns/V NL27WZ06 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition −40°C ≤ TA ≤ 85°C TA = 25°C VCC (V) Min 0.75 VCC 0.70 VCC Typ Max Min Max High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 0.25 VCC 0.30 VCC 0.25 VCC 0.30 VCC V ILKG Z−State Output Leakage Current VIN = VIL VOUT = VCC or GND 1.65 to 5.5 ±5.0 ±10.0 A VOL Low−Level Output Voltage g VIN = VIH IOL = 100 A 1.65 to 5.5 0.0 0.1 0.1 V IOL = 3 mA 1.65 0.08 0.24 IOL = 8 mA 2.3 0.22 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN or VOUT = VCC or GND 0 to 5.5 ±0.1 ±1.0 A VOUT = 5.5 V 0 1 10 A VIN = VCC or GND 5.5 1 10 A IIN Input Leakage Current IOFF Power Off−Output Leakage Current ICC Quiescent Supply Current 0.75 VCC 0.70 VCC Unit VIH V ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 −40°C ≤ TA ≤ 85°C TA = 25°C Symbol tPZL tPLZ Condition VCC (V) Min Typ Max Min Max Unit RL = R1= 5000 CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 ns RL = R1= 500 CL = 50 pF 2.5 ± 0.20 0.8 3.0 3.6 0.8 4.1 RL = R1= 500 CL = 50 pF 3.3 ± 0.30 0.8 2.4 3.2 0.8 3.7 RL = R1= 500 CL = 50 pF 5.0 ± 0.50 0.5 2.4 3.0 0.5 3.5 RL = R1= 5000 CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 RL = R1= 500 CL = 50 pF 2.5 ± 0.20 0.8 3.0 3.6 0.8 4.1 RL = R1= 500 CL = 50 pF 3.3 ± 0.30 0.8 2.1 3.2 0.8 3.7 RL = R1= 500 CL = 50 pF 5.0 ± 0.50 0.5 1.2 3.0 0.5 3.5 Parameter Propagation Delay ( (Figure 3 and 4)) Propagation Delay ( (Figure 3 and 4)) ns CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ06 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition −55°C ≤ TA ≤ 125°C TA = 25°C VCC (V) Min Typ 0.75 VCC 0.70 VCC Max Min Max High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 0.25 VCC 0.30 VCC 0.25 VCC 0.30 VCC V ILKG Z−State Output Leakage Current VIN = VIL VOUT = VCC or GND 1.65 to 5.5 ±5.0 ±10.0 A VOL Low−Level Output Voltage g VIN = VIH IOL = 100 A 1.65 to 5.5 0.0 0.1 0.1 V IOL = 3 mA 1.65 0.08 0.24 IOL = 8 mA 2.3 0.22 0.3 0.35 IOL = 12 mA 2.7 0.22 0.4 0.45 IOL = 16 mA 3.0 0.28 0.4 0.5 IOL = 24 mA 3.0 0.38 0.55 0.65 IOL = 32 mA 4.5 0.42 0.55 0.65 VIN or VOUT = VCC or GND 0 to 5.5 ±0.1 ±1.0 A VOUT = 5.5 V 0 1 10 A VIN = VCC or GND 5.5 1 10 A IIN Input Leakage Current IOFF Power Off−Output Leakage Current ICC Quiescent Supply Current 0.75 VCC 0.70 VCC Unit VIH V ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 −55°C ≤ TA ≤ 125°C TA = 25°C Symbol tPZL tPLZ Condition VCC (V) Min Typ Max Min Max Unit RL = R1= 5000 CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 ns RL = R1= 500 CL = 50 pF 2.5 ± 0.20 0.8 3.0 3.6 0.8 4.1 RL = R1= 500 CL = 50 pF 3.3 ± 0.30 0.8 2.4 3.2 0.8 3.7 RL = R1= 500 CL = 50 pF 5.0 ± 0.50 0.5 2.4 3.0 0.5 3.5 RL = R1= 5000 CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 RL = R1= 500 CL = 50 pF 2.5 ± 0.20 0.8 3.8 4.5 0.8 5.0 RL = R1= 500 CL = 50 pF 3.3 ± 0.30 0.8 2.9 3.2 0.8 3.7 RL = R1= 500 CL = 50 pF 5.0 ± 0.50 0.5 1.2 3.0 0.5 3.5 Parameter Propagation Delay ( (Figure 3 and 4)) Propagation Delay ( (Figure 3 and 4)) ns CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 4 NL27WZ06 VCC A 50% GND tPZL tPLZ HIGH IMPEDANCE 50% VCC Y VOL +0.3 V Figure 3. Switching Waveforms VCC R1 PULSE GENERATOR VCC x 2 DUT RT CL RL RT = ZOUT of pulse generator (typically 50 ) Figure 4. Test Circuit ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL27WZ06DFT2 NL 2 NL27WZ06DFT2G NL NL27WZ06DTT1 NL Device Technology Device Function Package Suffix Tape & Reel Suffix† Package Shipping† 7 WZ 06 DF T2 SC−88 3000 / Tape & Reel 2 7 WZ 06 DF T2 SC−88 (Pb−Free) 3000 / Tape & Reel 2 7 WZ 06 DT T1 TSOP−6 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NL27WZ06 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. A G 6 5 DIM A B C D G H J K N S 4 −B− S 1 2 3 D 6 PL 0.2 (0.008) M B INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 M N J C H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL27WZ06 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A L 6 S 1 5 4 2 3 B MILLIMETERS DIM MIN MAX A 2.90 3.10 B 1.30 1.70 C 0.90 1.10 D 0.25 0.50 G 0.85 1.05 H 0.013 0.100 J 0.10 0.26 K 0.20 0.60 L 1.25 1.55 M 0 10 S 2.50 3.00 D G M J C 0.05 (0.002) K H SOLDERING FOOTPRINT 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 http://onsemi.com 7 SCALE 10:1 mm inches INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 NL27WZ06 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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