MURHD560T4 Preferred Device MEGAHERTZ™ Power Rectifier Features and Benefits • • • • • Ultrafast 30 Nanosecond Recovery Times 175°C Operating Junction Temperature High Temperature Glass Passivated Junction High Voltage Capability to 600 Volts These are Pb−Free Devices http://onsemi.com ULTRAFAST RECTIFIER 5.0 AMPERES 600 VOLTS Applications • Power Supplies • Inverters • Free Wheeling Diodes 1 4 3 Mechanical Characteristics • • • • • • 4 Case: Epoxy, Molded Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 0.4 g (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ESD Ratings: Machine Model = C (>400 V) Human Body Model = 3B (>8000 V) 1 2 3 DPAK CASE 369C MARKING DIAGRAM YWW UH560G MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current (Rated VR, TC = 159°C) IF(AV) 5.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction and Storage Temperature Range TJ, Tstg 50 A °C −65 to +175 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2005 December, 2005 − Rev. 2 1 UH560G Y WW = Device Code = Year = Work Week ORDERING INFORMATION Device Package Shipping† MURHD560T4G DPAK (Pb−Free) 2500 /Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MURHD560/D MURHD560T4 THERMAL CHARACTERISTICS Symbol Value Unit Maximum Thermal Resistance, Junction to Case Rating RθJC 2.5 °C/W Maximum Thermal Resistance, Junction to Ambient (Note 1) RθJA 49.5 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2) (IF = 5.0 Amps, TC = 25°C) (IF = 5.0 Amps, TC = 125°C) VF Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TC = 25°C) (Rated dc Voltage, TC = 125°C) IR Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25°C) trr V 2.7 1.65 mA 10 70 30 ns 1. Rating applies when surface mounted on a 1.5 mm FR4 PC board with a 1 oz. thick, 700 mm2 Cu area. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 100 IF, FORWARD CURRENT (AMPS) IF, FORWARD CURRENT (AMPS) 100 150°C 10 125°C 100°C 1 25°C 0.1 150°C 10 125°C 100°C 1 25°C 0.1 0.01 0.01 0 1.0 0.5 1.5 2.0 2.5 0 3.0 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 2.0 3.0 4.0 5.0 6.0 VF, MAXIMUM FORWARD VOLTAGE (VOLTS) Figure 2. Maximum Forward Voltage 1.0E−4 IR, MAXIMUM REVERSE CURRENT (AMPS) Figure 1. Typical Forward Voltage IR, REVERSE CURRENT (AMPS) 1.0 1.0E−3 150°C 125°C 1.0E−5 150°C 1.0E−4 100°C 1.0E−6 125°C 100°C 1.0E−5 1.0E−7 1.0E−6 1.0E−8 25°C 1.0E−7 25°C 1.0E−9 1.0E−8 0 100 200 300 400 500 600 0 100 200 300 400 500 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 600 MURHD560T4 100 PFO, AVERAGE POWER DISSIPATION (WATTS) 20 80 70 60 50 40 30 20 10 0 0 25 50 75 125 100 175 150 200 TJ = 175°C 15 SQUARE WAVE 10 dc 5 0 0 1 2 3 4 5 6 7 VR, REVERSE VOLTAGE (VOLTS) IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Typical Capacitance Figure 6. Forward Power Dissipation IF, AVERAGE FORWARD CURRENT (AMPS) C, CAPACITANCE (pF) 90 9 RqJC = 2.5°C/W TJ = 175°C dc 8 7 6 SQUARE WAVE 5 4 3 2 1 0 100 110 120 130 140 150 160 TC, CASE TEMPERATURE (°C) Figure 7. Current Derating http://onsemi.com 3 170 180 8 R(t), TRANSIENT THERMAL RESISTANCE MURHD560T4 10 0.5 1 0.2 0.1 0.05 P(pk) 0.01 0.1 t1 Single Pulse t2 DUTY CYCLE, D = t1/t2 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 t, TIME (s) R(t), TRANSIENT THERMAL RESISTANCE Figure 8. Thermal Response, Junction to Case 100 0.5 10 1 0.2 0.1 0.05 P(pk) 0.01 t1 0.1 Single Pulse 0.01 0.000001 0.00001 t2 DUTY CYCLE, D = t1/t2 0.0001 0.001 0.01 0.1 1.0 t, TIME (s) Figure 9. Thermal Response, Junction to Ambient http://onsemi.com 4 10 100 1000 MURHD560T4 PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O −T− C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE E R 4 Z A S 1 2 DIM A B C D E F G H J K L R S U V Z 3 U K F J L H D G 2 PL 0.13 (0.005) M INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− T RECOMMENDED FOOTPRINT 6.20 0.244 2.58 0.101 5.80 0.228 3.0 0.118 1.6 0.063 6.172 0.243 SCALE 3:1 mm Ǔ ǒinches MEGAHERTZ is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 5 For additional information, please contact your local Sales Representative. MURHD560/D