FAIRCHILD FF1N30HS60DD

FF1N30HS60DD
30A, 600V Stealth™ Diode
General Description
Features
The FF1N30HS60DD is a Stealth™ diode optimized for low
loss performance in high frequency hard switched applications.
The Stealth™ family exhibits low reverse recovery current
(IRM(REC)) and exceptionally soft recovery under typical
operating conditions.
• Soft Recovery . . . . . . . . . . . . . . . . . . . . . . . . tb / ta > 1.2
• Fast Recovery . . . . . . . . . . . . . . . . . . . . . . . . . trr < 35ns
• Operating Temperature . . . . . . . . . . . . . . . . . . . . 175oC
• Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V
• Fully Isolated Package (2,500 volt AC)
This device is intended for use as a free wheeling or boost
diode in power supplies and other power switching
applications. The low IRM(REC) and short ta phase reduce loss
in switching transistors. The soft recovery minimizes ringing,
expanding the range of conditions under which the diode may
be operated without the use of additional snubber circuitry.
Consider using the Stealth™ diode with an SMPS IGBT to
provide the most efficient and highest power density design at
lower cost.
Applications
Formerly developmental type TA49411.
• SMPS FWD
• Extremely Low Switching Losses
• Avalanche Energy Rated
• Switch Mode Power Supplies
• Hard Switched CCM PFC Boost Diode
• UPS and Motor Drive Free Wheeling Diode
• Snubber Diode
Package
Symbol
JEDEC SOT-227
K
K
A
A
Device Maximum Ratings (per diode) TC = 25°C unless otherwise noted
Symbol
VRRM
Parameter
Repetitive Peak Reverse Voltage
Ratings
600
Units
V
Working Peak Reverse Voltage
600
V
DC Blocking Voltage
600
V
IF(AV)
Average Rectified Forward Current (TC = 110oC)
30
A
IFRM
Repetitive Peak Surge Current (20kHz Square Wave)
70
A
IFSM
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz)
325
A
Power Dissipation
136
W
Avalanche Energy (1A, 40mH)
20
mJ
VRWM
VR
PD
EAVL
TJ, TSTG
Md
TL
TPKG
Operating and Storage Temperature Range
Mounting force
Terminal connection torque
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Techbrief TB334
-55 to 175
°C
1.5/13
1.5/13
Nm/lb.in.
Nm/lb.in.
300
260
°C
°C
CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2003 Fairchild Semiconductor Corporation
FFH1N30HS60DD RevA
FF1N30HS60DD
May 2003
Device Marking
FF1N30HS60DD
Device
FF1N30HS60DD
Package
SOT-227
Tape Width
-
Quantity
10
Electrical Characteristics (per diode) TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off State Characteristics
IR
Instantaneous Reverse Current
TC = 25°C
-
-
100
µA
TC = 125°C
-
-
1.0
mA
TC = 25°C
-
2.1
2.4
V
TC = 125°C
-
1.7
2.1
V
VR = 10V, IF = 0A
-
120
-
pF
ns
VR = 600V
On State Characteristics
VF
Instantaneous Forward Voltage
IF = 30A
Dynamic Characteristics
CJ
Junction Capacitance
Switching Characteristics
trr
trr
IRM(REC)
QRR
Reverse Recovery Time
Reverse Recovery Time
Maximum Reverse Recovery Current
Reverse Recovered Charge
trr
Reverse Recovery Time
S
Softness Factor (tb/ta)
IRM(REC)
QRR
Maximum Reverse Recovery Current
Reverse Recovered Charge
trr
Reverse Recovery Time
S
Softness Factor (tb/ta)
IRM(REC)
QRR
dIM/dt
Maximum Reverse Recovery Current
Reverse Recovered Charge
IF = 1A, dIF/dt = 100A/µs, VR = 30V
-
27
35
IF = 30A, dIF/dt = 100A/µs, VR = 30V
-
36
45
ns
IF = 30A,
dIF/dt = 200A/µs,
VR = 390V, TC = 25°C
-
36
-
ns
-
2.9
-
A
-
55
-
nC
ns
IF = 30A,
dIF/dt = 200A/µs,
VR = 390V,
TC = 125°C
-
110
-
-
1.9
-
-
6
-
A
-
450
-
nC
IF = 30A,
dIF/dt = 1000A/µs,
VR = 390V,
TC = 125°C
-
60
-
ns
-
1.25
-
Maximum di/dt during tb
-
21
-
A
730
-
nC
800
-
A/µs
Thermal Characteristics
RθJC
Thermal Resistance Junction to Case
-
-
1.1
°C/W
RθJA
Thermal Resistance Junction to Ambient SOT-227
-
-
12
°C/W
©2003 Fairchild Semiconductor Corporation
FFH1N30HS60DD RevA
FF1N30HS60DD
Package Marking and Ordering Information
FF1N30HS60DD
Typical Performance Curves
5000
60
175oC
o
175 C
1000
25oC
150oC
IR, REVERSE CURRENT (µA)
IF, FORWARD CURRENT (A)
50
40
o
125 C
30
20
100oC
10
0.5
1.0
1.5
2.0
2.5
125oC
100
100oC
75oC
10
1
25oC
0.1
100
0
0
150oC
3.0
500
600
Figure 2. Reverse Current vs Reverse Voltage
120
100
VR = 390V, TJ = 125oC
90
VR = 390V, TJ = 125oC
tb AT dIF/dt = 200A/µs, 500A/µs, 800A/µs
100
t, RECOVERY TIMES (ns)
80
t, RECOVERY TIMES (ns)
400
VR , REVERSE VOLTAGE (V)
Figure 1. Forward Current vs Forward Voltage
70
60
50
40
30
20
tb AT IF = 60A, 30A, 15A
80
60
40
20
10
ta AT dIF/dt = 200A/µs, 500A/µs, 800A/µs
ta AT IF = 60A, 30A, 15A
0
200
0
0
10
20
30
40
50
60
400
IF, FORWARD CURRENT (A)
dIF/dt = 800A/µs
18
16
14
dIF/dt = 500A/µs
12
10
8
dIF/dt = 200A/µs
6
4
0
10
20
30
40
50
60
IF, FORWARD CURRENT (A)
Figure 5. Maximum Reverse Recovery Current vs
Forward Current
©2003 Fairchild Semiconductor Corporation
800
1000
1200
1400
1600
Figure 4. ta and tb Curves vs dIF/dt
IRM(REC) , MAX REVERSE RECOVERY CURRENT (A)
20
VR = 390V, TJ = 125oC
600
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 3. ta and tb Curves vs Forward Current
IRM(REC) , MAX REVERSE RECOVERY CURRENT (A)
300
200
VF, FORWARD VOLTAGE (V)
30
VR = 390V, TJ = 125oC
IF = 60A
25
IF = 30A
20
IF = 15A
15
10
5
0
200
400
600
800
1000
1200
1400
1600
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 6. Maximum Reverse Recovery Current vs
dIF/dt
FFH1N30HS60DD RevA
FF1N30HS60DD
2.5
1200
QRR, REVERSE RECOVERED CHARGE (nC)
S, REVERSE RECOVERY SOFTNESS FACTOR
Typical Performance Curves (Continued)
VR = 390V, TJ = 125oC
IF = 60A
2.25
2.0
IF = 30A
1.75
1.5
1.25
IF = 15A
1.0
0.75
0.5
200
400
600
800
1000
1200
1400
VR = 390V, TJ = 125oC
1000
600
IF = 15A
400
200
200
1600
IF = 30A
800
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
400
600
800
1000
1200
1400
1600
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 7. Reverse Recovery Softness Factor vs
dIF/dt
Figure 8. Reverse Recovered Charge vs dIF/dt
35
IF(AV) , AVERAGE FORWARD CURRENT (A)
1000
CJ , JUNCTION CAPACITANCE (pF)
IF = 60A
800
600
400
200
0
30
25
20
15
10
5
0
0.1
1
10
100
105
115
125
VR , REVERSE VOLTAGE (V)
135
145
155
165
175
TC, CASE TEMPERATURE
Figure 9. Junction Capacitance vs Reverse
Voltage
Figure 10. DC Current Derating Curve
2.0
THERMAL IMPEDANCE
ZθJA, NORMALIZED
1.0
0.1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
PDM
t1
t2
0.01
NOTES:
DUTY FACTOR: D = t1/t2
SINGLE PULSE
PEAK TJ = PDM x ZθJA x RθJA + TA
0.001
10-5
10-4
10-3
10-2
10-1
100
101
t, RECTANGULAR PULSE DURATION (s)
Figure 11. Normalized Maximum Transient Thermal Impedance
©2003 Fairchild Semiconductor Corporation
FFH1N30HS60DD RevA
FF1N30HS60DD
Test Circuit
and Waveforms
Typical
Performance
Curves (Continued)
VGE AMPLITUDE AND
RG CONTROL dIF/dt
t1 AND t2 CONTROL IF
L
IF
DUT
RG
CURRENT
SENSE
dIF
trr
dt
ta
tb
0
+
VGE
-
MOSFET
t1
0.25 IRM
VDD
IRM
t2
Figure 12. trr Test Circuit
Figure 13. trr Waveforms and Definitions
I = 1A
L = 40mH
R < 0.1Ω
VDD = 50V
EAVL = 1/2LI2 [VR(AVL) /(VR(AVL) - VDD)]
Q1 = IGBT (BVCES > DUT VR(AVL))
L
CURRENT
SENSE
VAVL
R
+
VDD
Q1
VDD
DUT
IL
t0
Figure 14. Avalanche Energy Test Circuit
©2003 Fairchild Semiconductor Corporation
IL
I V
t1
t2
t
Figure 15. Avalanche Current and Voltage
Waveforms
FFH1N30HS60DD RevA
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I2