MOTOROLA Freescale Semiconductor, Inc. Order this document by MPXH6300A SEMICONDUCTOR TECHNICAL DATA Freescale Semiconductor, Inc... High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated Motorola’s MPXH6300A series sensor integrates on–chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on–chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXH6300A series piezoresistive transducer is a state–of–the–art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. MPXH6300A SERIES INTEGRATED PRESSURE SENSOR 20 to 304 kPa (3.0 to 42 psi) 0.3 to 4.9 Volts Output SUPER SMALL OUTLINE PACKAGE Features • Improved Accuracy at High Temperature MPXH6300A6T1 CASE 1317 • Available in Small and Super Small Outline Packages • 1.5% Maximum Error over 0° to 85°C • Ideally suited for Microprocessor or Microcontroller–Based Systems • Temperature Compensated from –40° to +125°C • Durable Thermoplastic (PPS) Surface Mount Package Application Examples • Industrial Controls MPXH6300AC6T1 CASE 1317A • Engine Control/Manifold Absolute Pressure (MAP) VS THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 SENSING ELEMENT PIN NUMBER GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY Vout PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS 1 N/C 5 N/C 2 VS 6 N/C 3 Gnd 7 N/C 4 Vout 8 N/C NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the chamfered corner of the package. GND Figure 1. Fully Integrated Pressure Sensor Schematic REV 2 Motorola Sensor Device Data Motorola, Inc. 2003 For More Information On This Product, Go to: www.freescale.com MPXH6300A SERIES 1 Freescale Semiconductor, Inc. MAXIMUM RATINGS(1) Symbol Value Units Maximum Pressure (P1 u P2) Parametrics Pmax 1200 kPa Storage Temperature Tstg –40° to +125° °C TA –40° to +125° °C Io+ 0.5 mAdc Io– –0.5 mAdc Operating Temperature Output Source Current @ Full Scale Output(2) Output Sink Current @ Minimum Pressure Offset(2) NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 u P2.) Freescale Semiconductor, Inc... Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 304 kPa Supply Voltage(1) VS 4.74 5.1 5.46 Vdc Io — 6.0 10 mAdc (0 to 85°C) Voff 0.241 0.306 0.371 Vdc Full Scale Output(3) @ VS = 5.1 Volts (0 to 85°C) VFSO 4.847 4.912 4.977 Vdc Full Scale Span(4) @ VS = 5.1 Volts (0 to 85°C) VFSS 4.476 4.606 4.736 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS Supply Current Minimum Pressure @ VS = 5.1 Volts Offset(2) Sensitivity V/P — 16.2 — mV/kPa Response Time(6) tR — 1.0 — ms Warm–Up Time(7) — — 20 — ms — — ±ā0.25 — %VFSS Offset Stability(8) NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MPXH6300A SERIES 2 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. DIE FLUORO SILICONE GEL DIE COAT +5.1 V STAINLESS STEEL CAP P1 WIRE BOND THERMOPLASTIC CASE LEAD FRAME VS Pin 2 MPXH6300A Vout Pin 4 100 nF GND Pin 3 to ADC 47 pF 51 K ABSOLUTE ELEMENT DIE BOND SEALED VACUUM REFERENCE Figure 3. Typical Application Circuit (Output Source Current Operation) Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 shows a typical application circuit (output source current operation). 5.0 4.5 4.0 OUTPUT (Volts) 3.5 TRANSFER FUNCTION: Vout = Vs* (.00318*P-.00353) ± Error VS = 5.1 Vdc TEMP = 0 to 85°C 3.0 2.5 MAX 2.0 TYP 1.5 1.0 0.5 0 MIN 20 35 50 65 80 95 110 125 140 155 170 185 200 215 230 245 260 275 290 304 Freescale Semiconductor, Inc... Figure 2. Cross Sectional Diagram SSOP (not to scale) Pressure (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The Motorola Sensor Device Data MPXH6300A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. For More Information On This Product, Go to: www.freescale.com MPXH6300A SERIES 3 Freescale Semiconductor, Inc. Transfer Function (MPXH6300A) Nominal Transfer Value: Vout = VS x (0.00318 x P – 0.00353) ± (Pressure Error x Temp. Factor x 0.00318 x VS) VS = 5.1 ± 0.36 Vdc Temperature Error Band MPXH6300A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 125 3 1 3 1.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure 4.0 3.0 Pressure Error (kPa) Freescale Semiconductor, Inc... 0.0 2.0 1.0 0.0 -1.0 60 20 100 140 180 220 260 Pressure (in kPa) 300 -Ă2.0 -Ă3.0 -4.0 Pressure Error (Max) 20 to 304 (kPa) ±Ă4.0 (kPa) ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE Device Type Options Case No. Basic Element Absolute, Element Only 1317 MPXH6300A6U Rails MPXH6300A Absolute, Element Only 1317 MPXH6300A6T1 Tape and Reel MPXH6300A Absolute, Axial Port 1317A MPXH6300AC6U Rails MPXH6300A Absolute, Axial Port 1317A MPXH6300AC6T1 Tape and Reel MPXH6300A Ported Element MPXH6300A SERIES 4 MPX Series Order No. Packing Options For More Information On This Product, Go to: www.freescale.com Marking Motorola Sensor Device Data Freescale Semiconductor, Inc. SURFACE MOUNTING INFORMATION MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self–align when subjected to 0.050 1.27 TYP a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 Freescale Semiconductor, Inc... 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com MPXH6300A SERIES 5 Freescale Semiconductor, Inc. SUPER SMALL OUTLINE PACKAGE DIMENSIONS 2X 0.006 C A B 0.420 0.400 0.050 0.025 0.300 0.280 3 NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.019 5 0.014 0.004 M C A B Freescale Semiconductor, Inc... 8X A 0.300 0.280 B 3 0.298 0.278 .010 GAGE PLANE 0.165 0.145 0.010 0.002 0.004 DETAIL E C 0.023 0.013 10° 0° DETAIL E SEATING PLANE CASE 1317–03 ISSUE B MPXH6300A SERIES 6 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. SUPER SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED) 2X 0.006 C A B NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.420 0.400 0.050 0.025 0.345 0.325 Freescale Semiconductor, Inc... 8X A 0.345 0.325 B 0.018 0.014 0.004 M 5 C A B .014 GAGE PLANE 0.010 0.002 10° 0° 0.048 0.038 DETAIL E 0.130 0.110 0.200 0.180 0.300 0.280 0.390 0.370 3 0.004 A DETAIL E C 0.300 0.280 B 3 SEATING PLANE BOTTOM VIEW CASE 1317A–01 ISSUE A Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com MPXH6300A SERIES 7 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. 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All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. E Motorola Inc. 2003 HOW TO REACH US: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–800–521–6274 or 480–768–2130 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu, Minato–ku, Tokyo 106–8573, Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 HOME PAGE: http://motorola.com/semiconductors MPXH6300A SERIES 8 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data MPXH6300A